FDMS86250
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onsemi FDMS86250

Manufacturer No:
FDMS86250
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 150V 6.7A/20A 8PQFN
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDMS86250 is an N-Channel Shielded Gate PowerTrench® MOSFET produced by onsemi (formerly Fairchild Semiconductor). This device is designed to offer high efficiency and superior switching performance, making it suitable for a variety of power management applications. The MOSFET features advanced PowerTrench® technology, which optimizes on-state resistance while maintaining excellent switching characteristics.

Key Specifications

Parameter Value Units
Drain to Source Voltage (VDS) 150 V
Gate to Source Voltage (VGS) ±20 V
Continuous Drain Current (ID) at TC = 25 °C 30 A
Continuous Drain Current (ID) at TA = 25 °C 6.7 A
Pulsed Drain Current (ID) 100 A
Power Dissipation (PD) at TC = 25 °C 96 W
Power Dissipation (PD) at TA = 25 °C 2.5 W
Operating and Storage Junction Temperature Range (TJ, TSTG) -55 to +150 °C
Thermal Resistance, Junction to Case (RθJC) 1.3 °C/W
Thermal Resistance, Junction to Ambient (RθJA) 50 °C/W
Static Drain to Source On Resistance (rDS(on)) at VGS = 10 V, ID = 6.7 A 25
Static Drain to Source On Resistance (rDS(on)) at VGS = 6 V, ID = 5.8 A 33
Gate to Source Threshold Voltage (VGS(th)) 2.0 - 4.0 V
Total Gate Charge (Qg) at VGS = 0 V to 10 V 25 - 36 nC
Turn-On Delay Time (td(on)) 14 - 25 ns
Turn-Off Delay Time (td(off)) 22 - 35 ns
Rise Time (tr) 4.3 - 10 ns
Fall Time (tf) 4.2 - 10 ns

Key Features

  • Shielded Gate MOSFET Technology: Enhances on-state resistance and switching performance.
  • Low On-State Resistance: Maximum rDS(on) of 25 mΩ at VGS = 10 V, ID = 6.7 A, and 33 mΩ at VGS = 6 V, ID = 5.8 A.
  • Advanced Package and Silicon Combination: Optimized for high efficiency and low rDS(on).
  • MSL1 Robust Package Design: Ensures reliability and durability.
  • 100% UIL Tested: Guaranteed to meet strict quality standards.
  • RoHS Compliant: Environmentally friendly, lead-free design.

Applications

  • DC-DC Conversion: Ideal for power conversion applications due to its high efficiency and low on-state resistance.
  • Power Management: Suitable for various power management systems requiring high current handling and low losses.
  • Switching Applications: Excellent for applications that require fast switching times and low thermal resistance.

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDMS86250?

    150 V.

  2. What is the maximum continuous drain current (ID) at TA = 25 °C?

    6.7 A.

  3. What is the typical on-state resistance (rDS(on)) at VGS = 10 V and ID = 6.7 A?

    25 mΩ.

  4. What is the thermal resistance, junction to case (RθJC), of the FDMS86250?

    1.3 °C/W.

  5. Is the FDMS86250 RoHS compliant?

    Yes, it is RoHS compliant.

  6. What are the typical turn-on and turn-off delay times?

    Turn-on delay time: 14 - 25 ns, Turn-off delay time: 22 - 35 ns.

  7. What is the maximum gate to source voltage (VGS)?

    ±20 V.

  8. What is the total gate charge (Qg) at VGS = 0 V to 10 V?

    25 - 36 nC.

  9. What are the rise and fall times of the FDMS86250?

    Rise time: 4.3 - 10 ns, Fall time: 4.2 - 10 ns.

  10. What are some common applications for the FDMS86250?

    DC-DC conversion, power management, and switching applications.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):150 V
Current - Continuous Drain (Id) @ 25°C:6.7A (Ta), 20A (Tc)
Drive Voltage (Max Rds On, Min Rds On):6V, 10V
Rds On (Max) @ Id, Vgs:25mOhm @ 6.7A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:36 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:2330 pF @ 75 V
FET Feature:- 
Power Dissipation (Max):2.5W (Ta), 96W (Tc)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-PQFN (5x6)
Package / Case:8-PowerTDFN
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Similar Products

Part Number FDMS86250 FDMS86255 FDMS86252 FDMS86350 FDMS86550 FDMS86150 FDMS86200
Manufacturer onsemi onsemi onsemi onsemi onsemi onsemi onsemi
Product Status Active Active Active Active Active Active Active
FET Type N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 150 V 150 V 150 V 80 V 60 V 100 V 150 V
Current - Continuous Drain (Id) @ 25°C 6.7A (Ta), 20A (Tc) 10A (Ta), 45A (Tc) 4.6A (Ta), 16A (Tc) 25A (Ta), 130A (Tc) 32A (Ta), 155A (Tc) 16A (Ta), 60A (Tc) 9.6A (Ta), 35A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 6V, 10V 6V, 10V 6V, 10V 8V, 10V 8V, 10V 6V, 10V 6V, 10V
Rds On (Max) @ Id, Vgs 25mOhm @ 6.7A, 10V 12.4mOhm @ 10A, 10V 51mOhm @ 4.6A, 10V 2.4mOhm @ 25A, 10V 1.65mOhm @ 32A, 10V 4.85mOhm @ 16A, 10V 18mOhm @ 9.6A, 10V
Vgs(th) (Max) @ Id 4V @ 250µA 4V @ 250µA 4V @ 250µA 4.5V @ 250µA 4.5V @ 250µA 4V @ 250µA 4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 36 nC @ 10 V 63 nC @ 10 V 15 nC @ 10 V 155 nC @ 10 V 154 nC @ 10 V 62 nC @ 10 V 46 nC @ 10 V
Vgs (Max) ±20V ±20V ±20V ±20V ±20V ±20V ±20V
Input Capacitance (Ciss) (Max) @ Vds 2330 pF @ 75 V 4480 pF @ 75 V 905 pF @ 75 V 10680 pF @ 40 V 11530 pF @ 30 V 4065 pF @ 50 V 2715 pF @ 75 V
FET Feature - - - - - - -
Power Dissipation (Max) 2.5W (Ta), 96W (Tc) 2.7W (Ta), 113W (Tc) 2.5W (Ta), 69W (Tc) 2.7W (Ta), 156W (Tc) 2.7W (Ta), 156W (Tc) 2.7W (Ta), 156W (Tc) 2.5W (Ta), 104W (Tc)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6)
Package / Case 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN

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