FDMS86150
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onsemi FDMS86150

Manufacturer No:
FDMS86150
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N CH 100V 16A POWER56
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDMS86150 is an N-Channel Shielded Gate PowerTrench® MOSFET produced by ON Semiconductor. This device is designed using ON Semiconductor’s advanced PowerTrench process, which incorporates Shielded Gate technology. This technology optimizes the on-state resistance while maintaining superior switching performance. The MOSFET is packaged in a Power 56 package, which is robust and designed for high efficiency and low on-state resistance.

Key Specifications

Parameter Test Conditions Min Typ Max Units
VDS (Drain to Source Voltage) - - 100 V
VGS (Gate to Source Voltage) - - ±20 V
ID (Drain Current - Continuous, TC = 25°C) - - 80 A
ID (Drain Current - Continuous, TA = 25°C) - - 16 A
ID (Drain Current - Pulsed) - - 300 A
EAS (Single Pulse Avalanche Energy) - - 726 mJ
PD (Power Dissipation, TC = 25°C) - - 113 W
PD (Power Dissipation, TA = 25°C) - - 2.7 W
TJ, TSTG (Operating and Storage Junction Temperature Range) - - -55 to +150 °C
rDS(on) (Static Drain to Source On Resistance at VGS = 10 V, ID = 16 A) - 3.9 4.85
rDS(on) (Static Drain to Source On Resistance at VGS = 6 V, ID = 13 A) - 6 7.8
BVDSS (Drain to Source Breakdown Voltage) ID = 250 μA, VGS = 0 V - - 100 V
VGS(th) (Gate to Source Threshold Voltage) VGS = VDS, ID = 250 μA 2 3 4 V

Key Features

  • Shielded Gate MOSFET Technology
  • Low on-state resistance (rDS(on)) of 4.85 mΩ at VGS = 10 V, ID = 16 A and 7.8 mΩ at VGS = 6 V, ID = 13 A
  • Advanced Package and Silicon combination for low rDS(on) and high efficiency
  • MSL1 robust package design
  • 100% UIL tested
  • Pb-free and RoHS Compliant

Applications

  • Primary DC-DC MOSFET
  • Secondary Synchronous Rectifier
  • Load Switch

Q & A

  1. What is the maximum drain to source voltage (VDS) for the FDMS86150 MOSFET?

    The maximum drain to source voltage (VDS) is 100 V.

  2. What is the maximum continuous drain current (ID) at TC = 25°C?

    The maximum continuous drain current (ID) at TC = 25°C is 80 A.

  3. What is the typical on-state resistance (rDS(on)) at VGS = 10 V and ID = 16 A?

    The typical on-state resistance (rDS(on)) at VGS = 10 V and ID = 16 A is 4.85 mΩ.

  4. Is the FDMS86150 MOSFET RoHS compliant?

    Yes, the FDMS86150 MOSFET is Pb-free and RoHS compliant.

  5. What are the typical applications for the FDMS86150 MOSFET?

    The typical applications include primary DC-DC MOSFET, secondary synchronous rectifier, and load switch.

  6. What is the operating and storage junction temperature range for the FDMS86150 MOSFET?

    The operating and storage junction temperature range is -55 to +150 °C.

  7. What is the maximum gate to source voltage (VGS) for the FDMS86150 MOSFET?

    The maximum gate to source voltage (VGS) is ±20 V.

  8. What is the thermal resistance, junction to case (RθJC), for the FDMS86150 MOSFET?

    The thermal resistance, junction to case (RθJC), is 1.1 °C/W.

  9. Is the FDMS86150 MOSFET 100% UIL tested?

    Yes, the FDMS86150 MOSFET is 100% UIL tested.

  10. What package type is used for the FDMS86150 MOSFET?

    The FDMS86150 MOSFET is packaged in a Power 56 package.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):100 V
Current - Continuous Drain (Id) @ 25°C:16A (Ta), 60A (Tc)
Drive Voltage (Max Rds On, Min Rds On):6V, 10V
Rds On (Max) @ Id, Vgs:4.85mOhm @ 16A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:62 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:4065 pF @ 50 V
FET Feature:- 
Power Dissipation (Max):2.7W (Ta), 156W (Tc)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-PQFN (5x6)
Package / Case:8-PowerTDFN
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Similar Products

Part Number FDMS86150 FDMS86250 FDMS86350 FDMS86550 FDMS86180 FDMS86152
Manufacturer onsemi onsemi onsemi onsemi onsemi onsemi
Product Status Active Active Active Active Active Active
FET Type N-Channel N-Channel N-Channel N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 100 V 150 V 80 V 60 V 100 V 100 V
Current - Continuous Drain (Id) @ 25°C 16A (Ta), 60A (Tc) 6.7A (Ta), 20A (Tc) 25A (Ta), 130A (Tc) 32A (Ta), 155A (Tc) 151A (Tc) 14A (Ta), 45A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 6V, 10V 6V, 10V 8V, 10V 8V, 10V 6V, 10V 6V, 10V
Rds On (Max) @ Id, Vgs 4.85mOhm @ 16A, 10V 25mOhm @ 6.7A, 10V 2.4mOhm @ 25A, 10V 1.65mOhm @ 32A, 10V 3.2mOhm @ 67A, 10V 6mOhm @ 14A, 10V
Vgs(th) (Max) @ Id 4V @ 250µA 4V @ 250µA 4.5V @ 250µA 4.5V @ 250µA 4V @ 370µA 4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 62 nC @ 10 V 36 nC @ 10 V 155 nC @ 10 V 154 nC @ 10 V 54 nC @ 6 V 50 nC @ 10 V
Vgs (Max) ±20V ±20V ±20V ±20V ±20V ±20V
Input Capacitance (Ciss) (Max) @ Vds 4065 pF @ 50 V 2330 pF @ 75 V 10680 pF @ 40 V 11530 pF @ 30 V 6215 pF @ 50 V 3370 pF @ 50 V
FET Feature - - - - - -
Power Dissipation (Max) 2.7W (Ta), 156W (Tc) 2.5W (Ta), 96W (Tc) 2.7W (Ta), 156W (Tc) 2.7W (Ta), 156W (Tc) 138W (Tc) 2.7W (Ta), 125W (Tc)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6) Power56 8-PQFN (5x6)
Package / Case 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN

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