FDMS86202
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onsemi FDMS86202

Manufacturer No:
FDMS86202
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 120V 13.5A POWER56
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDMS86202 is an N-Channel Shielded Gate PowerTrench® MOSFET produced by ON Semiconductor. This device is part of the PowerTrench® family, which is known for its advanced technology that optimizes on-state resistance while maintaining superior switching performance. The FDMS86202 is designed to operate at high efficiency and is suitable for various power management applications.

Key Specifications

Parameter Test Conditions Min Typ Max Units
VDS (Drain to Source Voltage) TJ = 25 °C unless otherwise noted 120 V
VGS (Gate to Source Voltage) TJ = 25 °C unless otherwise noted ±20 V
ID (Drain Current) - Continuous (TC = 25 °C) 13.5 A
ID (Drain Current) - Continuous (TA = 25 °C) Note 1a 64 A
ID (Drain Current) - Pulsed Note 4 240 A
EAS (Single Pulse Avalanche Energy) Note 3 600 mJ
PD (Power Dissipation) - TC = 25 °C 156 W
PD (Power Dissipation) - TA = 25 °C Note 1a 2.7 W
TJ, TSTG (Operating and Storage Junction Temperature Range) -55 +150 °C
RθJC (Thermal Resistance, Junction to Case) 0.8 °C/W
RθJA (Thermal Resistance, Junction to Ambient) Note 1a 45 °C/W
rDS(on) (Static Drain to Source On Resistance) at VGS = 10 V, ID = 13.5 A 6.0 7.2 mΩ
rDS(on) (Static Drain to Source On Resistance) at VGS = 6 V, ID = 11.5 A 8.1 10.3 mΩ

Key Features

  • Shielded Gate MOSFET Technology: Enhances performance by reducing gate to drain capacitance and improving switching characteristics.
  • Low On-State Resistance: Maximum rDS(on) of 7.2 mΩ at VGS = 10 V, ID = 13.5 A, and 10.3 mΩ at VGS = 6 V, ID = 11.5 A.
  • Advanced Package and Silicon Combination: Optimized for high efficiency and low on-state resistance.
  • MSL1 Robust Package Design: Ensures reliability and durability.
  • 100% UIL Tested: Guaranteed to meet specific testing standards.
  • RoHS Compliant: Meets environmental regulations regarding the use of hazardous substances.

Applications

  • DC-DC Conversion: Ideal for power conversion applications due to its high efficiency and low on-state resistance.
  • Power Management: Suitable for various power management systems requiring high current handling and low losses.
  • Industrial and Automotive Systems: Can be used in high-power applications in industrial and automotive sectors.

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDMS86202?

    The maximum drain to source voltage (VDS) is 120 V.

  2. What is the maximum continuous drain current (ID) at TC = 25 °C?

    The maximum continuous drain current (ID) at TC = 25 °C is 13.5 A.

  3. What is the thermal resistance from junction to case (RθJC)?

    The thermal resistance from junction to case (RθJC) is 0.8 °C/W.

  4. What is the typical on-state resistance (rDS(on)) at VGS = 10 V and ID = 13.5 A?

    The typical on-state resistance (rDS(on)) at VGS = 10 V and ID = 13.5 A is 7.2 mΩ.

  5. Is the FDMS86202 RoHS compliant?

    Yes, the FDMS86202 is RoHS compliant.

  6. What are the typical applications of the FDMS86202?

    The FDMS86202 is typically used in DC-DC conversion, power management, and high-power applications in industrial and automotive systems.

  7. What is the maximum gate to source voltage (VGS)?

    The maximum gate to source voltage (VGS) is ±20 V.

  8. What is the single pulse avalanche energy (EAS) rating?

    The single pulse avalanche energy (EAS) rating is 600 mJ.

  9. What is the operating and storage junction temperature range (TJ, TSTG)?

    The operating and storage junction temperature range (TJ, TSTG) is -55 to +150 °C.

  10. Is the FDMS86202 100% UIL tested?

    Yes, the FDMS86202 is 100% UIL tested.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):120 V
Current - Continuous Drain (Id) @ 25°C:13.5A (Ta)
Drive Voltage (Max Rds On, Min Rds On):6V, 10V
Rds On (Max) @ Id, Vgs:7.2mOhm @ 13.5A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:64 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:4250 pF @ 60 V
FET Feature:- 
Power Dissipation (Max):2.7W (Ta), 156W (Tc)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-PQFN (5x6)
Package / Case:8-PowerTDFN
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Similar Products

Part Number FDMS86202 FDMS86252 FDMS8622 FDMS86200 FDMS86201
Manufacturer onsemi onsemi onsemi onsemi onsemi
Product Status Active Active Active Active Active
FET Type N-Channel N-Channel N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 120 V 150 V 100 V 150 V 120 V
Current - Continuous Drain (Id) @ 25°C 13.5A (Ta) 4.6A (Ta), 16A (Tc) 4.8A (Ta), 16.5A (Tc) 9.6A (Ta), 35A (Tc) 11.6A (Ta), 49A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 6V, 10V 6V, 10V 6V, 10V 6V, 10V 6V, 10V
Rds On (Max) @ Id, Vgs 7.2mOhm @ 13.5A, 10V 51mOhm @ 4.6A, 10V 56mOhm @ 4.8A, 10V 18mOhm @ 9.6A, 10V 11.5mOhm @ 11.6A, 10V
Vgs(th) (Max) @ Id 4V @ 250µA 4V @ 250µA 4V @ 250µA 4V @ 250µA 4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 64 nC @ 10 V 15 nC @ 10 V 7 nC @ 10 V 46 nC @ 10 V 46 nC @ 10 V
Vgs (Max) ±20V ±20V ±20V ±20V ±20V
Input Capacitance (Ciss) (Max) @ Vds 4250 pF @ 60 V 905 pF @ 75 V 400 pF @ 50 V 2715 pF @ 75 V 2735 pF @ 60 V
FET Feature - - - - -
Power Dissipation (Max) 2.7W (Ta), 156W (Tc) 2.5W (Ta), 69W (Tc) 2.5W (Ta), 31W (Tc) 2.5W (Ta), 104W (Tc) 2.5W (Ta), 104W (Tc)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6)
Package / Case 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN

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