FDV304P_NB8U003
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onsemi FDV304P_NB8U003

Manufacturer No:
FDV304P_NB8U003
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET P-CH 25V 460MA SOT-23
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The FDV304P_NB8U003 is a P-Channel enhancement mode field effect transistor (FET) produced by onsemi. This device is fabricated using onsemi's proprietary high cell density DMOS technology, which is designed to minimize on-state resistance at low gate drive conditions. It is particularly suited for battery power applications in devices such as notebook computers and cellular phones.

Key Specifications

Parameter Value Unit
Drain-Source Voltage (VDSS) -25 V
Gate-Source Voltage (VGSS) ±8 V
Continuous Drain Current (ID) -0.46 A
Pulsed Drain Current (ID) -1.5 A
Maximum Power Dissipation (PD) 0.35 W
On-State Drain-Source Resistance (RDS(on)) at VGS = -4.5 V 1.1 Ω
On-State Drain-Source Resistance (RDS(on)) at VGS = -2.7 V 1.5 Ω
Gate Threshold Voltage (VGS(th)) -0.65 to -1.5 V
Operating and Storage Temperature Range (TJ, TSTG) -55 to 150 °C
Electrostatic Discharge Rating (ESD) 6.0 kV (Human Body Model)

Key Features

  • Very low level gate drive requirements, allowing direct operation in 3 V circuits.
  • Excellent on-state resistance even at gate drive voltages as low as 2.5 V.
  • Compact industry standard SOT-23 surface mount package.
  • Pb-Free and Halide-Free, RoHS compliant.
  • Gate-Source Zener for ESD ruggedness.
  • High cell density DMOS technology for minimized on-state resistance.

Applications

  • Battery power management in devices such as notebook computers and cellular phones.
  • Load switching and battery protection circuits.

Q & A

  1. What is the FDV304P_NB8U003?

    The FDV304P_NB8U003 is a P-Channel enhancement mode field effect transistor produced by onsemi.

  2. What technology is used in the FDV304P_NB8U003?

    It uses onsemi's proprietary high cell density DMOS technology.

  3. What is the maximum drain-source voltage (VDSS) of the FDV304P_NB8U003?

    The maximum drain-source voltage (VDSS) is -25 V.

  4. What is the continuous drain current (ID) of the FDV304P_NB8U003?

    The continuous drain current (ID) is -0.46 A.

  5. What is the maximum power dissipation (PD) of the FDV304P_NB8U003?

    The maximum power dissipation (PD) is 0.35 W.

  6. What is the on-state drain-source resistance (RDS(on)) at VGS = -4.5 V?

    The on-state drain-source resistance (RDS(on)) at VGS = -4.5 V is 1.1 Ω.

  7. Is the FDV304P_NB8U003 RoHS compliant?

    Yes, the FDV304P_NB8U003 is Pb-Free, Halide-Free, and RoHS compliant.

  8. What is the operating and storage temperature range of the FDV304P_NB8U003?

    The operating and storage temperature range is -55 to 150 °C.

  9. What is the electrostatic discharge (ESD) rating of the FDV304P_NB8U003?

    The ESD rating is 6.0 kV (Human Body Model).

  10. In what package is the FDV304P_NB8U003 available?

    The FDV304P_NB8U003 is available in a compact industry standard SOT-23 surface mount package.

Product Attributes

FET Type:P-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):25 V
Current - Continuous Drain (Id) @ 25°C:460mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):2.7V, 4.5V
Rds On (Max) @ Id, Vgs:1.1Ohm @ 500mA, 4.5V
Vgs(th) (Max) @ Id:1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:1.5 nC @ 4.5 V
Vgs (Max):-8V
Input Capacitance (Ciss) (Max) @ Vds:63 pF @ 10 V
FET Feature:- 
Power Dissipation (Max):350mW (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:SOT-23-3
Package / Case:TO-236-3, SC-59, SOT-23-3
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