FDMT800120DC-22897
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onsemi FDMT800120DC-22897

Manufacturer No:
FDMT800120DC-22897
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
FET 120V 4.2 MOHM PQFN88
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDMT800120DC-22897 is an N-Channel MOSFET produced by onsemi, utilizing their advanced POWERTRENCH process and DUAL COOL™ 88 package technology. This device is designed to offer low on-resistance (rDS(on)) and high efficiency, making it suitable for various high-performance applications. The MOSFET features a surface mount package and is Pb-free, halide-free, and RoHS compliant.

Key Specifications

Parameter Rating Unit
Drain to Source Voltage (VDS) 120 V
Gate to Source Voltage (VGS) ±20 V
Continuous Drain Current (ID) at TA = 25°C 20 A
Continuous Drain Current (ID) at TC = 25°C 128 A
Power Dissipation at TA = 25°C 3.2 W
Power Dissipation at TC = 25°C 156 W
Operating and Storage Junction Temperature Range −55 to +150 °C
Thermal Resistance, Junction to Ambient (RθJA) 38 (Note 1a) °C/W
Static Drain to Source On Resistance (rDS(on)) at VGS = 10 V, ID = 15 A -

Key Features

  • Advanced POWERTRENCH process for low rDS(on) and high efficiency
  • DUAL COOL™ 88 package technology for enhanced thermal performance
  • Next generation enhanced body diode technology for soft recovery
  • Low profile 8x8 mm MLP package
  • MSL1 robust package design
  • 100% UIL tested
  • Pb-free, halide-free, and RoHS compliant

Applications

  • OringFET / Load Switching
  • Synchronous Rectification
  • DC-DC Conversion

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDMT800120DC-22897?

    The maximum drain to source voltage (VDS) is 120 V.

  2. What is the continuous drain current (ID) at ambient temperature (TA = 25°C)?

    The continuous drain current (ID) at TA = 25°C is 20 A.

  3. What is the thermal resistance, junction to ambient (RθJA), for this device?

    The thermal resistance, junction to ambient (RθJA), is 38 °C/W under specified conditions.

  4. Is the FDMT800120DC-22897 Pb-free and RoHS compliant?

    Yes, the device is Pb-free, halide-free, and RoHS compliant.

  5. What are the typical applications of the FDMT800120DC-22897?

    Typical applications include OringFET / Load Switching, Synchronous Rectification, and DC-DC Conversion.

  6. What package type does the FDMT800120DC-22897 use?

    The device uses an 8x8 mm MLP package with DUAL COOL™ 88 technology.

  7. What is the maximum power dissipation at case temperature (TC = 25°C)?

    The maximum power dissipation at TC = 25°C is 156 W.

  8. What is the operating and storage junction temperature range for this MOSFET?

    The operating and storage junction temperature range is −55 to +150 °C.

  9. Does the FDMT800120DC-22897 have enhanced body diode technology?

    Yes, it features next generation enhanced body diode technology for soft recovery.

  10. Is the package design of the FDMT800120DC-22897 robust?

    Yes, the package design is MSL1 robust.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):120 V
Current - Continuous Drain (Id) @ 25°C:20A (Ta), 128A (Tc)
Drive Voltage (Max Rds On, Min Rds On):6V, 10V
Rds On (Max) @ Id, Vgs:4.2mOhm @ 20A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:107 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:7850 pF @ 60 V
FET Feature:- 
Power Dissipation (Max):3.2W (Ta), 156W (Tc)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-Dual Cool™88
Package / Case:8-PowerVDFN
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