FDMS86202ET120
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onsemi FDMS86202ET120

Manufacturer No:
FDMS86202ET120
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 120V 13.5/102A PWR56
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDMS86202ET120 is an N-Channel Shielded Gate PowerTrench® MOSFET produced by ON Semiconductor. This device is designed using Fairchild Semiconductor’s advanced PowerTrench® process, which incorporates Shielded Gate technology. This technology optimizes the on-state resistance while maintaining superior switching performance. The MOSFET is known for its high efficiency, low on-state resistance, and robust package design, making it suitable for a variety of high-power applications.

Key Specifications

ParameterMinTypMaxUnits
Drain to Source Voltage (VDS)--120V
Gate to Source Voltage (VGS)--±20V
Continuous Drain Current (ID) at TC = 25 °C--102A
Continuous Drain Current (ID) at TC = 100 °C--72A
Pulsed Drain Current (ID)--538A
Single Pulse Avalanche Energy (EAS)--600mJ
Power Dissipation at TC = 25 °C--187W
Operating and Storage Junction Temperature Range-55-175°C
Thermal Resistance, Junction to Case (RθJC)--0.8°C/W
Thermal Resistance, Junction to Ambient (RθJA)--45°C/W
Static Drain to Source On Resistance (rDS(on)) at VGS = 10 V, ID = 13.5 A6.07.2-

Key Features

  • Extended junction temperature rating up to 175°C
  • Shielded Gate MOSFET Technology for improved on-state resistance and switching performance
  • Low on-state resistance: max rDS(on) = 7.2 mΩ at VGS = 10 V, ID = 13.5 A
  • Advanced package and silicon combination for high efficiency
  • MSL1 robust package design
  • 100% UIL tested
  • RoHS Compliant

Applications

The FDMS86202ET120 is suitable for various high-power applications, including:

  • DC-DC Conversion
  • Power Supplies
  • Motor Control
  • Industrial Power Systems
  • Automotive Systems

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDMS86202ET120?
    The maximum drain to source voltage (VDS) is 120 V.
  2. What is the continuous drain current (ID) at a case temperature of 25 °C?
    The continuous drain current (ID) at TC = 25 °C is 102 A.
  3. What is the thermal resistance from junction to case (RθJC) of the FDMS86202ET120?
    The thermal resistance from junction to case (RθJC) is 0.8 °C/W.
  4. What is the maximum power dissipation at a case temperature of 25 °C?
    The maximum power dissipation at TC = 25 °C is 187 W.
  5. Is the FDMS86202ET120 RoHS compliant?
    Yes, the FDMS86202ET120 is RoHS compliant.
  6. What is the maximum gate to source voltage (VGS) for the FDMS86202ET120?
    The maximum gate to source voltage (VGS) is ±20 V.
  7. What is the typical on-state resistance (rDS(on)) at VGS = 10 V and ID = 13.5 A?
    The typical on-state resistance (rDS(on)) at VGS = 10 V and ID = 13.5 A is 7.2 mΩ.
  8. What are the operating and storage junction temperature ranges for the FDMS86202ET120?
    The operating and storage junction temperature range is -55 to +175 °C.
  9. What is the single pulse avalanche energy (EAS) rating for the FDMS86202ET120?
    The single pulse avalanche energy (EAS) rating is 600 mJ.
  10. What type of technology is used in the FDMS86202ET120?
    The FDMS86202ET120 uses Fairchild Semiconductor’s advanced PowerTrench® process with Shielded Gate technology.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):120 V
Current - Continuous Drain (Id) @ 25°C:13.5A (Ta), 102A (Tc)
Drive Voltage (Max Rds On, Min Rds On):6V, 10V
Rds On (Max) @ Id, Vgs:7.2mOhm @ 13.5A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:64 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:4585 pF @ 60 V
FET Feature:- 
Power Dissipation (Max):3.3W (Ta), 187W (Tc)
Operating Temperature:-55°C ~ 175°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-PQFN (5x6)
Package / Case:8-PowerTDFN
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$6.46
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