FDMA410NZ
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onsemi FDMA410NZ

Manufacturer No:
FDMA410NZ
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 20V 9.5A 6MICROFET
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDMA410NZ is a single N-Channel MOSFET designed by onsemi using their advanced POWERTRENCH process. This device is optimized for low on-resistance (RDS(on)) at a gate-source voltage (VGS) of 1.5 V, making it suitable for a variety of power management and switching applications. The MOSFET is packaged in a WDFN6 2x2, 0.65P (MicroFET 2x2) leadframe, which is Pb-free and halide-free, ensuring environmental compliance.

Key Specifications

Parameter Test Condition Min Typ Max Unit
VDS (Drain to Source Voltage) - - 20 V
VGS (Gate to Source Voltage) - - ±8 V
ID (Continuous Drain Current at TA = 25°C) - - 9.5 A
RDS(on) at VGS = 4.5 V, ID = 9.5 A - - 23
RDS(on) at VGS = 2.5 V, ID = 8.0 A - - 29
RDS(on) at VGS = 1.8 V, ID = 4.0 A - - 36
RDS(on) at VGS = 1.5 V, ID = 2.0 A - - 50
BVDSS (Drain to Source Breakdown Voltage) ID = 250 μA, VGS = 0 V - - 20 V
td(on) (Turn-On Delay Time) VDD = 10 V, ID = 9.5 A, VGS = 4.5 V, RGEN = 6 Ω - 7.5 15 ns
tr (Rise Time) - 3.9 10 ns
td(off) (Turn-Off Delay Time) - 27 44 ns
tf (Fall Time) - 3.7 10 ns
Qg (Total Gate Charge) VDD = 10 V, ID = 9.5 A, VGS = 4.5 V - 10 14 nC
RJA (Thermal Resistance, Junction to Ambient) - - 52 / 145 °C/W

Key Features

  • Low on-resistance (RDS(on)) at VGS = 1.5 V, optimized using onsemi's advanced POWERTRENCH process.
  • Maximum RDS(on) of 23 mΩ at VGS = 4.5 V and ID = 9.5 A.
  • Maximum RDS(on) of 29 mΩ at VGS = 2.5 V and ID = 8.0 A.
  • Maximum RDS(on) of 36 mΩ at VGS = 1.8 V and ID = 4.0 A.
  • Maximum RDS(on) of 50 mΩ at VGS = 1.5 V and ID = 2.0 A.
  • HBM ESD Protection Level > 2.5 kV.
  • High continuous drain current of up to 9.5 A.
  • Low turn-on and turn-off delay times.
  • Compact WDFN6 2x2, 0.65P (MicroFET 2x2) package, Pb-free and halide-free.

Applications

  • Power management in DC-DC converters and switching power supplies.
  • Motor control and drive systems.
  • High-frequency switching applications.
  • Audio amplifiers and other high-power audio equipment.
  • Automotive and industrial power systems.

Q & A

  1. What is the maximum drain to source voltage (VDS) for the FDMA410NZ?

    The maximum drain to source voltage (VDS) is 20 V.

  2. What is the typical on-resistance (RDS(on)) at VGS = 4.5 V and ID = 9.5 A?

    The typical on-resistance (RDS(on)) is 23 mΩ.

  3. What is the HBM ESD protection level for this MOSFET?

    The HBM ESD protection level is greater than 2.5 kV.

  4. What is the maximum continuous drain current (ID) at TA = 25°C?

    The maximum continuous drain current (ID) is 9.5 A.

  5. What is the thermal resistance (RJA) when mounted on a 1 in^2 pad of 2 oz copper?

    The thermal resistance (RJA) is 52 °C/W.

  6. What is the package type and dimensions for the FDMA410NZ?

    The package type is WDFN6 2x2, 0.65P (MicroFET 2x2), and it is Pb-free and halide-free.

  7. What are the typical turn-on and turn-off delay times for this MOSFET?

    The typical turn-on delay time (td(on)) is 7.5 ns, and the typical turn-off delay time (td(off)) is 27 ns.

  8. What is the total gate charge (Qg) at VGS = 4.5 V and ID = 9.5 A?

    The total gate charge (Qg) is typically 10 nC.

  9. In what types of applications is the FDMA410NZ commonly used?

    The FDMA410NZ is commonly used in power management, motor control, high-frequency switching, audio amplifiers, and automotive and industrial power systems.

  10. Is the FDMA410NZ RoHS compliant?

    Yes, the FDMA410NZ is Pb-free and halide-free, making it RoHS compliant.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):20 V
Current - Continuous Drain (Id) @ 25°C:9.5A (Ta)
Drive Voltage (Max Rds On, Min Rds On):1.5V, 4.5V
Rds On (Max) @ Id, Vgs:23mOhm @ 9.5A, 4.5V
Vgs(th) (Max) @ Id:1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:14 nC @ 4.5 V
Vgs (Max):±8V
Input Capacitance (Ciss) (Max) @ Vds:1080 pF @ 10 V
FET Feature:- 
Power Dissipation (Max):2.4W (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:6-MicroFET (2x2)
Package / Case:6-WDFN Exposed Pad
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Similar Products

Part Number FDMA410NZ FDMA420NZ FDMA430NZ FDMA410NZT
Manufacturer onsemi onsemi onsemi onsemi
Product Status Active Active Active Active
FET Type N-Channel N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 20 V 20 V 30 V 20 V
Current - Continuous Drain (Id) @ 25°C 9.5A (Ta) 5.7A (Ta) 5A (Ta) 9.5A (Ta)
Drive Voltage (Max Rds On, Min Rds On) 1.5V, 4.5V 2.5V, 4.5V 2.5V, 4.5V 1.5V, 4.5V
Rds On (Max) @ Id, Vgs 23mOhm @ 9.5A, 4.5V 30mOhm @ 5.7A, 4.5V 40mOhm @ 5A, 4.5V 23mOhm @ 9.5A, 4.5V
Vgs(th) (Max) @ Id 1V @ 250µA 1.5V @ 250µA 1.5V @ 250µA 1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 14 nC @ 4.5 V 12 nC @ 4.5 V 11 nC @ 4.5 V 14 nC @ 4.5 V
Vgs (Max) ±8V ±12V ±12V ±8V
Input Capacitance (Ciss) (Max) @ Vds 1080 pF @ 10 V 935 pF @ 10 V 800 pF @ 10 V 1310 pF @ 10 V
FET Feature - - - -
Power Dissipation (Max) 2.4W (Ta) 2.4W (Ta) 2.4W (Ta) 2.4W (Ta)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package 6-MicroFET (2x2) 6-MicroFET (2x2) 6-MicroFET (2x2) 6-UDFN (2.05x2.05)
Package / Case 6-WDFN Exposed Pad 6-WDFN Exposed Pad 6-WDFN Exposed Pad 6-UDFN Exposed Pad

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