FQD16N25CTM_F080
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onsemi FQD16N25CTM_F080

Manufacturer No:
FQD16N25CTM_F080
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 250V 16A DPAK
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FQD16N25CTM is an N-Channel enhancement mode power MOSFET produced by onsemi, utilizing their proprietary planar stripe and DMOS technology. This advanced technology is designed to reduce on-state resistance and provide superior switching performance along with high avalanche energy strength. The device is suitable for a variety of high-power applications, including switched mode power supplies, active power factor correction (PFC), and electronic lamp ballasts.

Key Specifications

Parameter Value Unit
Drain-Source Voltage (VDSS) 250 V
Continuous Drain Current (ID) at TC = 25°C 16 A
Continuous Drain Current (ID) at TC = 100°C 10.1 A
Pulsed Drain Current (IDM) 64 A
Gate-Source Voltage (VGSS) ±30 V
Single Pulsed Avalanche Energy (EAS) 432 mJ
Avalanche Current (IAR) 16 A
Repetitive Avalanche Energy (EAR) 160 mJ
Power Dissipation (PD) at TC = 25°C 160 W
Thermal Resistance, Junction-to-Case (RθJC) 0.78 °C/W
Thermal Resistance, Junction-to-Ambient (RθJA) 110 °C/W
Operating and Storage Temperature Range (TJ, TSTG) -55 to +150 °C
Maximum Lead Temperature for Soldering 300 °C
Static Drain-Source On-Resistance (RDS(on)) at VGS = 10 V, ID = 8 A 0.22 - 0.27 Ω
Gate Threshold Voltage (VGS(th)) 2.0 - 4.0 V
Total Gate Charge (Qg) 41 - 53.5 nC

Key Features

  • 16 A, 250 V with RDS(on) = 270 mΩ (Max.) at VGS = 10 V, ID = 8 A
  • Low Gate Charge (Typ. 41 nC)
  • Low Crss (Typ. 68 pF)
  • 100% Avalanche Tested
  • Pb-Free
  • Advanced planar stripe and DMOS technology for reduced on-state resistance and superior switching performance

Applications

  • Switched mode power supplies
  • Active power factor correction (PFC)
  • Electronic lamp ballasts

Q & A

  1. What is the maximum drain-source voltage (VDSS) of the FQD16N25CTM?

    The maximum drain-source voltage (VDSS) is 250 V.

  2. What is the continuous drain current (ID) at 25°C and 100°C?

    The continuous drain current (ID) is 16 A at 25°C and 10.1 A at 100°C.

  3. What is the typical total gate charge (Qg) of the FQD16N25CTM?

    The typical total gate charge (Qg) is 41 nC.

  4. What are the typical values for Crss and RDS(on)?

    The typical values are Crss = 68 pF and RDS(on) = 0.22 - 0.27 Ω at VGS = 10 V, ID = 8 A.

  5. Is the FQD16N25CTM Pb-Free?
  6. What are the operating and storage temperature ranges for the FQD16N25CTM?

    The operating and storage temperature ranges are -55 to +150 °C.

  7. What is the maximum lead temperature for soldering purposes?

    The maximum lead temperature for soldering purposes is 300 °C.

  8. What are some common applications of the FQD16N25CTM?
  9. What is the thermal resistance, junction-to-case (RθJC), of the FQD16N25CTM?

    The thermal resistance, junction-to-case (RθJC), is 0.78 °C/W.

  10. What is the gate threshold voltage (VGS(th)) range of the FQD16N25CTM?

    The gate threshold voltage (VGS(th)) range is 2.0 - 4.0 V.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):250 V
Current - Continuous Drain (Id) @ 25°C:16A (Tc)
Drive Voltage (Max Rds On, Min Rds On):10V
Rds On (Max) @ Id, Vgs:270mOhm @ 8A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:53.5 nC @ 10 V
Vgs (Max):±30V
Input Capacitance (Ciss) (Max) @ Vds:1080 pF @ 25 V
FET Feature:- 
Power Dissipation (Max):160W (Tc)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:TO-252AA
Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
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Same Series
FQD16N25CTM_F080
FQD16N25CTM_F080
MOSFET N-CH 250V 16A DPAK

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