FDN357N
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onsemi FDN357N

Manufacturer No:
FDN357N
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 30V 1.9A SUPERSOT3
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDN357N is a SuperSOT™-3 N-Channel logic level enhancement mode power field effect transistor produced by onsemi. It utilizes onsemi's proprietary, high cell density, DMOS technology, which is tailored to minimize on-state resistance. This device is particularly suited for low voltage applications in battery-powered circuits where fast switching and low in-line power loss are critical.

Key Specifications

Parameter Value Unit
Drain-Source Voltage (VDSS) 30 V
Gate-Source Voltage - Continuous (VGSS) ±20 V
Drain/Output Current - Continuous (ID) 1.9 A
Drain/Output Current - Pulsed (ID) 10 A
Maximum Power Dissipation (PD) 0.5 (Note 1a), 0.46 (Note 1b) W
Operating and Storage Junction Temperature Range (TJ, TSTG) -55 to 150 °C
Thermal Resistance, Junction-to-Ambient (RθJA) 250 °C/W
Thermal Resistance, Junction-to-Case (RθJC) 75 °C/W
Drain-Source On-Resistance (RDS(ON)) @ VGS = 4.5 V 0.09 Ω Ω
Drain-Source On-Resistance (RDS(ON)) @ VGS = 10 V 0.06 Ω Ω

Key Features

  • 1.9 A, 30 V, with RDS(ON) = 0.09 Ω @ VGS = 4.5 V and RDS(ON) = 0.06 Ω @ VGS = 10 V.
  • Industry standard outline SOT-23 surface mount package using proprietary SuperSOT™-3 design for superior thermal and electrical capabilities.
  • High density cell design for extremely low RDS(ON).
  • Exceptional on-resistance and maximum DC current capability.
  • Pb-Free and RoHS compliant.

Applications

  • Notebook computers
  • Portable phones
  • PCMCIA cards
  • Battery-powered circuits
  • Low voltage applications where fast switching and low in-line power loss are necessary.

Q & A

  1. What is the maximum drain-source voltage (VDSS) of the FDN357N? The maximum drain-source voltage (VDSS) is 30 V.
  2. What is the continuous drain current (ID) rating of the FDN357N? The continuous drain current (ID) rating is 1.9 A.
  3. What is the maximum power dissipation (PD) of the FDN357N? The maximum power dissipation (PD) is 0.5 W (Note 1a) and 0.46 W (Note 1b).
  4. What is the thermal resistance, junction-to-ambient (RθJA), of the FDN357N? The thermal resistance, junction-to-ambient (RθJA), is 250 °C/W.
  5. Is the FDN357N Pb-Free and RoHS compliant? Yes, the FDN357N is Pb-Free and RoHS compliant.
  6. What package type does the FDN357N use? The FDN357N uses an industry standard SOT-23 surface mount package with the proprietary SuperSOT™-3 design.
  7. What are the typical applications of the FDN357N? Typical applications include notebook computers, portable phones, PCMCIA cards, and other battery-powered circuits.
  8. What is the gate-source voltage (VGS) required for the specified RDS(ON) values? The RDS(ON) values are specified at VGS = 4.5 V and VGS = 10 V.
  9. What is the maximum operating junction temperature of the FDN357N? The maximum operating junction temperature is 150 °C.
  10. How many devices are typically shipped per reel? The devices are typically shipped in quantities of 3000 per reel.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):30 V
Current - Continuous Drain (Id) @ 25°C:1.9A (Ta)
Drive Voltage (Max Rds On, Min Rds On):4.5V, 10V
Rds On (Max) @ Id, Vgs:60mOhm @ 2.2A, 10V
Vgs(th) (Max) @ Id:2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:5.9 nC @ 5 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:235 pF @ 10 V
FET Feature:- 
Power Dissipation (Max):500mW (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:SOT-23-3
Package / Case:TO-236-3, SC-59, SOT-23-3
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Similar Products

Part Number FDN357N FDN327N FDN337N
Manufacturer onsemi onsemi onsemi
Product Status Active Active Active
FET Type N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 30 V 20 V 30 V
Current - Continuous Drain (Id) @ 25°C 1.9A (Ta) 2A (Ta) 2.2A (Ta)
Drive Voltage (Max Rds On, Min Rds On) 4.5V, 10V 1.8V, 4.5V 2.5V, 4.5V
Rds On (Max) @ Id, Vgs 60mOhm @ 2.2A, 10V 70mOhm @ 2A, 4.5V 65mOhm @ 2.2A, 4.5V
Vgs(th) (Max) @ Id 2V @ 250µA 1.5V @ 250µA 1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 5.9 nC @ 5 V 6.3 nC @ 4.5 V 9 nC @ 4.5 V
Vgs (Max) ±20V ±8V ±8V
Input Capacitance (Ciss) (Max) @ Vds 235 pF @ 10 V 423 pF @ 10 V 300 pF @ 10 V
FET Feature - - -
Power Dissipation (Max) 500mW (Ta) 500mW (Ta) 500mW (Ta)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount
Supplier Device Package SOT-23-3 SOT-23-3 SOT-23-3
Package / Case TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3

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