FDN337N
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onsemi FDN337N

Manufacturer No:
FDN337N
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 30V 2.2A SUPERSOT3
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDN337N is a 30 V, 65 mΩ N-Channel logic level enhancement mode power field effect transistor produced by onsemi. This device is fabricated using high cell density DMOS technology, which is specifically designed to minimize on-state resistance. The FDN337N is particularly suited for low voltage applications where fast switching and low in-line power loss are critical.

Key Specifications

FET Type N-Channel
Drain-to-Source Voltage (Vdss) 30 V
Drain-Source On Resistance-Max (RDS(ON)) 0.065 Ω @ VGS = 4.5 V, 0.082 Ω @ VGS = 2.5 V
Rated Power Dissipation 0.5 W
Continuous Drain Current (ID) 2.2 A
Package Style SSOT-3 (SuperSOT-3)
Mounting Method Surface Mount
Gate to Source Voltage (VGS) ±8 V
Operating Junction Temperature Range -55°C to 150°C

Key Features

  • High density cell design for extremely low RDS(ON)
  • Exceptional on-resistance and maximum DC current capability
  • Industry standard outline SOT-23 surface mount package
  • Low on-state resistance of 65 mΩ at VGS = 4.5 V
  • Continuous drain current of 2.2 A
  • Maximum power dissipation of 500 mW

Applications

  • Load switch
  • Battery protection
  • Power management
  • Notebook computers
  • Portable phones
  • PCMCIA cards and other battery-powered circuits

Q & A

  1. What is the drain-to-source voltage (Vdss) of the FDN337N?

    The drain-to-source voltage (Vdss) of the FDN337N is 30 V.

  2. What is the maximum drain-source on resistance (RDS(ON)) of the FDN337N?

    The maximum drain-source on resistance (RDS(ON)) is 0.065 Ω at VGS = 4.5 V and 0.082 Ω at VGS = 2.5 V.

  3. What is the continuous drain current (ID) of the FDN337N?

    The continuous drain current (ID) of the FDN337N is 2.2 A.

  4. What is the package style of the FDN337N?

    The package style of the FDN337N is SSOT-3 (SuperSOT-3).

  5. What is the mounting method of the FDN337N?

    The mounting method of the FDN337N is surface mount.

  6. What are the typical applications of the FDN337N?

    The FDN337N is typically used in load switch, battery protection, power management, notebook computers, portable phones, and PCMCIA cards.

  7. What is the operating junction temperature range of the FDN337N?

    The operating junction temperature range of the FDN337N is -55°C to 150°C.

  8. What is the maximum power dissipation of the FDN337N?

    The maximum power dissipation of the FDN337N is 500 mW.

  9. What is the gate to source voltage (VGS) range of the FDN337N?

    The gate to source voltage (VGS) range of the FDN337N is ±8 V.

  10. Why is the FDN337N suitable for low voltage applications?

    The FDN337N is suitable for low voltage applications due to its high density cell design, which minimizes on-state resistance and provides fast switching and low in-line power loss.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):30 V
Current - Continuous Drain (Id) @ 25°C:2.2A (Ta)
Drive Voltage (Max Rds On, Min Rds On):2.5V, 4.5V
Rds On (Max) @ Id, Vgs:65mOhm @ 2.2A, 4.5V
Vgs(th) (Max) @ Id:1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:9 nC @ 4.5 V
Vgs (Max):±8V
Input Capacitance (Ciss) (Max) @ Vds:300 pF @ 10 V
FET Feature:- 
Power Dissipation (Max):500mW (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:SOT-23-3
Package / Case:TO-236-3, SC-59, SOT-23-3
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Similar Products

Part Number FDN337N FDN357N FDN537N FDN327N FDN335N
Manufacturer onsemi onsemi onsemi onsemi onsemi
Product Status Active Active Active Active Active
FET Type N-Channel N-Channel N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 30 V 30 V 30 V 20 V 20 V
Current - Continuous Drain (Id) @ 25°C 2.2A (Ta) 1.9A (Ta) 6.5A (Ta), 6.5A (Tc) 2A (Ta) 1.7A (Ta)
Drive Voltage (Max Rds On, Min Rds On) 2.5V, 4.5V 4.5V, 10V 4.5V, 10V 1.8V, 4.5V 2.5V, 4.5V
Rds On (Max) @ Id, Vgs 65mOhm @ 2.2A, 4.5V 60mOhm @ 2.2A, 10V 23mOhm @ 6.5A, 10V 70mOhm @ 2A, 4.5V 70mOhm @ 1.7A, 4.5V
Vgs(th) (Max) @ Id 1V @ 250µA 2V @ 250µA 3V @ 250µA 1.5V @ 250µA 1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 9 nC @ 4.5 V 5.9 nC @ 5 V 8.4 nC @ 10 V 6.3 nC @ 4.5 V 5 nC @ 4.5 V
Vgs (Max) ±8V ±20V ±20V ±8V ±8V
Input Capacitance (Ciss) (Max) @ Vds 300 pF @ 10 V 235 pF @ 10 V 465 pF @ 15 V 423 pF @ 10 V 310 pF @ 10 V
FET Feature - - - - -
Power Dissipation (Max) 500mW (Ta) 500mW (Ta) 1.5W (Ta) 500mW (Ta) 500mW (Ta)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package SOT-23-3 SOT-23-3 SOT-23-3 SOT-23-3 SOT-23-3
Package / Case TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3

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