FDV304P-CGB8
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onsemi FDV304P-CGB8

Manufacturer No:
FDV304P-CGB8
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET P-CHANNEL
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDV304P-CGB8 is a P-Channel enhancement mode field effect transistor (FET) produced by onsemi using their proprietary high cell density DMOS technology. This device is designed to minimize on-state resistance, especially at low gate drive conditions, making it suitable for battery-powered applications such as notebook computers and cellular phones. The FDV304P-CGB8 features very low level gate drive requirements, allowing direct operation in 3 V circuits, and is packaged in a compact industry standard SOT-23 surface mount package.

Key Specifications

Parameter Value Unit
Drain-Source Voltage (VDSS) -25 V
Gate-Source Voltage (VGSS) -8 V
Continuous Drain Current (ID) -0.46 A
Pulsed Drain Current (ID) -1.5 A
Maximum Power Dissipation (PD) 0.35 W
Operating and Storage Temperature Range -55 to 150 °C
Electrostatic Discharge Rating (ESD) 6.0 kV (Human Body Model) kV
Thermal Resistance, Junction-to-Ambient (RθJA) 357 °C/W
Gate Threshold Voltage (VGS(th)) -0.65 to -1.5 V
Static Drain-Source On-Resistance (RDS(on)) at VGS = -4.5 V 1.1 Ω Ω
Static Drain-Source On-Resistance (RDS(on)) at VGS = -2.7 V 1.5 Ω Ω

Key Features

  • Very low on-state resistance even at low gate drive voltages (e.g., RDS(on) = 1.1 Ω at VGS = -4.5 V and RDS(on) = 1.5 Ω at VGS = -2.7 V)
  • Low level gate drive requirements, allowing direct operation in 3 V circuits
  • Gate-Source Zener for ESD ruggedness (6 kV Human Body Model)
  • Compact industry standard SOT-23 surface mount package
  • Pb-Free and Halide-Free

Applications

The FDV304P-CGB8 is particularly suited for battery-powered applications such as:

  • Notebook computers
  • Cellular phones
  • Other portable electronic devices requiring low power consumption and high efficiency

Q & A

  1. What is the maximum drain-source voltage (VDSS) of the FDV304P-CGB8?

    The maximum drain-source voltage (VDSS) is -25 V.

  2. What is the continuous drain current (ID) rating of the FDV304P-CGB8?

    The continuous drain current (ID) rating is -0.46 A.

  3. What is the maximum power dissipation (PD) of the FDV304P-CGB8?

    The maximum power dissipation (PD) is 0.35 W.

  4. What is the operating and storage temperature range of the FDV304P-CGB8?

    The operating and storage temperature range is -55 to 150 °C.

  5. What is the ESD rating of the FDV304P-CGB8?

    The ESD rating is 6.0 kV (Human Body Model).

  6. What is the thermal resistance, junction-to-ambient (RθJA), of the FDV304P-CGB8?

    The thermal resistance, junction-to-ambient (RθJA), is 357 °C/W.

  7. What is the gate threshold voltage (VGS(th)) range of the FDV304P-CGB8?

    The gate threshold voltage (VGS(th)) range is -0.65 to -1.5 V.

  8. What are the typical on-state resistances (RDS(on)) at different gate-source voltages?

    The typical on-state resistances are 1.1 Ω at VGS = -4.5 V and 1.5 Ω at VGS = -2.7 V.

  9. Is the FDV304P-CGB8 Pb-Free and Halide-Free?

    Yes, the FDV304P-CGB8 is Pb-Free and Halide-Free.

  10. What is the package type of the FDV304P-CGB8?

    The package type is SOT-23-3 surface mount.

Product Attributes

FET Type:- 
Technology:- 
Drain to Source Voltage (Vdss):- 
Current - Continuous Drain (Id) @ 25°C:460mA (Tj)
Drive Voltage (Max Rds On, Min Rds On):- 
Rds On (Max) @ Id, Vgs:- 
Vgs(th) (Max) @ Id:- 
Gate Charge (Qg) (Max) @ Vgs:- 
Vgs (Max):- 
Input Capacitance (Ciss) (Max) @ Vds:- 
FET Feature:- 
Power Dissipation (Max):- 
Operating Temperature:- 
Mounting Type:- 
Supplier Device Package:- 
Package / Case:- 
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