FDV304P
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onsemi FDV304P

Manufacturer No:
FDV304P
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET P-CH 25V 460MA SOT23
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDV304P is a P-Channel enhancement mode field effect transistor (FET) produced by onsemi using their proprietary high cell density DMOS technology. This device is designed to minimize on-state resistance, particularly at low gate drive conditions, making it suitable for battery-powered applications such as notebook computers and cellular phones. The FDV304P features a compact SOT-23 surface mount package and is Pb-free and halide-free, adhering to environmental standards.

Key Specifications

Parameter Value Unit
Drain-Source Voltage (VDSS) -25 V
Gate-Source Voltage (VGSS) -8 V
Continuous Drain Current (ID) -0.46 A
Pulsed Drain Current (ID) -1.5 A
Maximum Power Dissipation (PD) 0.35 W
Operating and Storage Temperature Range (TJ, TSTG) -55 to 150 °C
Electrostatic Discharge Rating (ESD) 6.0 kV (Human Body Model)
Thermal Resistance, Junction-to-Ambient (RθJA) 357 °C/W
Gate Threshold Voltage (VGS(th)) -0.65 to -1.5 V
Static Drain-Source On-Resistance (RDS(on)) at VGS = -4.5 V, ID = -0.5 A 1.1 Ω
Static Drain-Source On-Resistance (RDS(on)) at VGS = -2.7 V, ID = -0.25 A 1.5 Ω

Key Features

  • Very low on-state resistance, especially at low gate drive voltages (e.g., RDS(on) = 1.1 Ω @ VGS = -4.5 V, ID = -0.5 A)
  • Low gate drive requirements, allowing direct operation in 3 V circuits (VGS(th) < 1.5 V)
  • Gate-Source Zener for ESD ruggedness (6 kV Human Body Model)
  • Compact industry standard SOT-23 surface mount package
  • Pb-free and halide-free, compliant with environmental standards

Applications

The FDV304P is particularly suited for battery-powered applications, including:

  • Notebook computers
  • Cellular phones
  • Other portable electronic devices requiring low power consumption and high efficiency

Q & A

  1. What is the maximum drain-source voltage (VDSS) of the FDV304P?

    The maximum drain-source voltage (VDSS) is -25 V.

  2. What is the continuous drain current (ID) rating of the FDV304P?

    The continuous drain current (ID) rating is -0.46 A.

  3. What is the thermal resistance, junction-to-ambient (RθJA), of the FDV304P?

    The thermal resistance, junction-to-ambient (RθJA), is 357 °C/W.

  4. Is the FDV304P Pb-free and halide-free?
  5. What is the gate threshold voltage (VGS(th)) range of the FDV304P?

    The gate threshold voltage (VGS(th)) range is -0.65 to -1.5 V.

  6. What is the typical on-state resistance (RDS(on)) at VGS = -4.5 V and ID = -0.5 A?

    The typical on-state resistance (RDS(on)) is 1.1 Ω.

  7. What is the ESD rating of the FDV304P?

    The ESD rating is 6.0 kV (Human Body Model).

  8. In what package is the FDV304P available?

    The FDV304P is available in a SOT-23 surface mount package.

  9. What are some typical applications for the FDV304P?

    Typical applications include notebook computers, cellular phones, and other portable electronic devices.

  10. What is the maximum power dissipation (PD) of the FDV304P?

    The maximum power dissipation (PD) is 0.35 W.

Product Attributes

FET Type:P-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):25 V
Current - Continuous Drain (Id) @ 25°C:460mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):2.7V, 4.5V
Rds On (Max) @ Id, Vgs:1.1Ohm @ 500mA, 4.5V
Vgs(th) (Max) @ Id:1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:1.5 nC @ 4.5 V
Vgs (Max):±8V
Input Capacitance (Ciss) (Max) @ Vds:63 pF @ 10 V
FET Feature:- 
Power Dissipation (Max):350mW (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:SOT-23-3
Package / Case:TO-236-3, SC-59, SOT-23-3
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