FDS6673BZ
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onsemi FDS6673BZ

Manufacturer No:
FDS6673BZ
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET P-CH 30V 14.5A 8SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDS6673BZ is a P-Channel MOSFET produced by onsemi, utilizing their advanced Power Trench technology. This device is designed to minimize on-state resistance, making it highly suitable for power management and load switching applications. It is particularly well-suited for use in notebook computers and portable battery packs due to its high performance and current handling capabilities.

Key Specifications

Parameter Test Conditions Min Typ Max Unit
VDS (Drain to Source Voltage) - - -30 V
VGS (Gate to Source Voltage) - - ±25 V
ID (Drain Current) - Continuous - - -14.5 A
ID (Drain Current) - Pulsed - - -75 A
PD (Maximum Power Dissipation) - - 2.5 W
TJ, TSTG (Operating and Storage Junction Temperature Range) - -55 to +150 - °C
RDS(on) (Drain to Source On-Resistance) @ VGS = -10 V, ID = -14.5 A - 6.5 7.8
RDS(on) (Drain to Source On-Resistance) @ VGS = -4.5 V, ID = -12 A - 9.6 12
VGS(th) (Gate to Source Threshold Voltage) VDS = VGS, ID = -250 μA -1 -1.9 -3 V
RJA (Thermal Resistance, Junction to Ambient) - - 50 °C/W
RJC (Thermal Resistance, Junction to Case) - - 25 °C/W

Key Features

  • High Performance Trench Technology for Extremely Low RDS(on)
  • Extended VGS Range (±25 V) for Battery Applications
  • HBM ESD Protection Level of 6.5 kV Typical
  • High Power and Current Handling Capability
  • Pb-Free, Halide Free and RoHS Compliant

Applications

The FDS6673BZ is well-suited for power management and load switching applications, particularly in:

  • Notebook Computers
  • Portable Battery Packs

Q & A

  1. What is the maximum drain to source voltage (VDS) for the FDS6673BZ?

    The maximum drain to source voltage (VDS) is -30 V.

  2. What is the maximum continuous drain current (ID) for the FDS6673BZ?

    The maximum continuous drain current (ID) is -14.5 A.

  3. What is the typical on-state resistance (RDS(on)) at VGS = -10 V and ID = -14.5 A?

    The typical on-state resistance (RDS(on)) is 6.5 mΩ.

  4. Does the FDS6673BZ have ESD protection?
  5. Is the FDS6673BZ RoHS compliant?
  6. What is the operating and storage junction temperature range for the FDS6673BZ?

    The operating and storage junction temperature range is -55°C to +150°C.

  7. What is the thermal resistance from junction to ambient (RJA) for the FDS6673BZ?

    The thermal resistance from junction to ambient (RJA) is 50°C/W.

  8. What are some typical applications for the FDS6673BZ?

    Typical applications include power management and load switching in notebook computers and portable battery packs.

  9. What is the gate to source threshold voltage (VGS(th)) for the FDS6673BZ?

    The gate to source threshold voltage (VGS(th)) is between -1 V and -3 V.

  10. Does the FDS6673BZ have any special packaging options?

Product Attributes

FET Type:P-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):30 V
Current - Continuous Drain (Id) @ 25°C:14.5A (Ta)
Drive Voltage (Max Rds On, Min Rds On):4.5V, 10V
Rds On (Max) @ Id, Vgs:7.8mOhm @ 14.5A, 10V
Vgs(th) (Max) @ Id:3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:124 nC @ 10 V
Vgs (Max):±25V
Input Capacitance (Ciss) (Max) @ Vds:4700 pF @ 15 V
FET Feature:- 
Power Dissipation (Max):2.5W (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-SOIC
Package / Case:8-SOIC (0.154", 3.90mm Width)
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Similar Products

Part Number FDS6673BZ FDS6675BZ FDS6673AZ
Manufacturer onsemi onsemi Fairchild Semiconductor
Product Status Active Active Obsolete
FET Type P-Channel P-Channel P-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 30 V 30 V 30 V
Current - Continuous Drain (Id) @ 25°C 14.5A (Ta) 11A (Ta) 14.5A (Ta)
Drive Voltage (Max Rds On, Min Rds On) 4.5V, 10V 4.5V, 10V 4.5V, 10V
Rds On (Max) @ Id, Vgs 7.8mOhm @ 14.5A, 10V 13mOhm @ 11A, 10V 7.2mOhm @ 14.5A, 10V
Vgs(th) (Max) @ Id 3V @ 250µA 3V @ 250µA 3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 124 nC @ 10 V 62 nC @ 10 V 118 nC @ 10 V
Vgs (Max) ±25V ±25V ±25V
Input Capacitance (Ciss) (Max) @ Vds 4700 pF @ 15 V 2470 pF @ 15 V 4480 pF @ 15 V
FET Feature - - -
Power Dissipation (Max) 2.5W (Ta) 2.5W (Ta) 2.5W (Ta)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 175°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount
Supplier Device Package 8-SOIC 8-SOIC 8-SOIC
Package / Case 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width)

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