FDS4435BZ-F085
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onsemi FDS4435BZ-F085

Manufacturer No:
FDS4435BZ-F085
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET P-CH 30V 8.8A 8SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDS4435BZ-F085 is a P-Channel PowerTrench® MOSFET produced by onsemi, utilizing their advanced PowerTrench process to minimize on-state resistance. This device is particularly suited for power management and load switching applications, commonly found in notebook computers and portable battery packs. It offers high performance, low on-state resistance, and robust current handling capabilities, making it an ideal choice for various power-intensive applications.

Key Specifications

ParameterConditionsMinTypMaxUnit
VDS (Drain to Source Voltage)----30V
VGS (Gate to Source Voltage)---±25V
ID (Drain Current) - ContinuousTA = 25°C---8.8A
ID (Drain Current) - Pulsed----50A
PD (Power Dissipation) - TA = 25°C---2.5W
EAS (Single Pulse Avalanche Energy)---24mJ
TJ, TSTG (Operating and Storage Junction Temperature Range)--55-150°C
RJC (Thermal Resistance, Junction to Case)---25°C/W
RJA (Thermal Resistance, Junction to Ambient)---50°C/W
rDS(on) (Static Drain to Source On Resistance) at VGS = -10V, ID = -8.8A-1620-
rDS(on) (Static Drain to Source On Resistance) at VGS = -4.5V, ID = -6.7A-2635-

Key Features

  • High performance trench technology for extremely low RDS(on)
  • Max RDS(on) = 20 mΩ at VGS = -10 V, ID = -8.8 A
  • Max RDS(on) = 35 mΩ at VGS = -4.5 V, ID = -6.7 A
  • Extended VGSS range (-25 V) for battery applications
  • HBM ESD protection level of ±3.8 kV typical
  • High power and current handling capability
  • Lead-free and RoHS compliant
  • Qualified to AEC Q101

Applications

The FDS4435BZ-F085 is well-suited for various power management and load switching applications, particularly in:

  • Notebook computers
  • Portable battery packs
  • Other power-intensive electronic devices requiring efficient power management

Q & A

  1. What is the maximum drain to source voltage (VDS) for the FDS4435BZ-F085?
    The maximum drain to source voltage (VDS) is -30 V.
  2. What is the maximum continuous drain current (ID) at TA = 25°C?
    The maximum continuous drain current (ID) is -8.8 A.
  3. What is the typical ESD protection level for this MOSFET?
    The typical ESD protection level is ±3.8 kV.
  4. What is the thermal resistance from junction to ambient (RJA) for this device?
    The thermal resistance from junction to ambient (RJA) is 50 °C/W.
  5. Is the FDS4435BZ-F085 RoHS compliant?
    Yes, the FDS4435BZ-F085 is lead-free and RoHS compliant.
  6. What are the typical applications for the FDS4435BZ-F085?
    The typical applications include power management and load switching in notebook computers and portable battery packs.
  7. What is the maximum power dissipation (PD) at TA = 25°C?
    The maximum power dissipation (PD) is 2.5 W.
  8. What is the single pulse avalanche energy (EAS) for this MOSFET?
    The single pulse avalanche energy (EAS) is 24 mJ.
  9. What is the operating and storage junction temperature range (TJ, TSTG) for this device?
    The operating and storage junction temperature range is -55 to +150 °C.
  10. What is the static drain to source on resistance (rDS(on)) at VGS = -10V and ID = -8.8A?
    The static drain to source on resistance (rDS(on)) is 20 mΩ.

Product Attributes

FET Type:P-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):30 V
Current - Continuous Drain (Id) @ 25°C:8.8A (Ta)
Drive Voltage (Max Rds On, Min Rds On):4.5V, 10V
Rds On (Max) @ Id, Vgs:20mOhm @ 8.8A, 10V
Vgs(th) (Max) @ Id:3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:40 nC @ 10 V
Vgs (Max):±25V
Input Capacitance (Ciss) (Max) @ Vds:1845 pF @ 15 V
FET Feature:- 
Power Dissipation (Max):2.5W (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-SOIC
Package / Case:8-SOIC (0.154", 3.90mm Width)
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