FDD3860
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onsemi FDD3860

Manufacturer No:
FDD3860
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 100V 6.2A DPAK
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDD3860 is an N-Channel PowerTrench® MOSFET produced by ON Semiconductor. This device is a rugged gate version of ON Semiconductor's advanced Power Trench® process, designed for low rDS(on) and low Qg figure of merit. It is tailored for a wide range of switching applications, including DC-AC conversion and synchronous rectification. The FDD3860 is known for its high performance trench technology, which provides extremely low on-resistance and high avalanche ruggedness.

Key Specifications

Parameter Test Conditions Min. Typ. Max. Units
VDS (Drain to Source Voltage) - - - 100 V
VGS (Gate to Source Voltage) - - - ±20 V
ID (Drain Current) - Continuous at TC = 25°C - - - 29 A
ID (Drain Current) - Continuous at TA = 25°C - - - 6.2 A
ID (Drain Current) - Pulsed - - - 60 A
EAS (Single Pulse Avalanche Energy) - - - 121 mJ
PD (Power Dissipation) at TC = 25°C - - - 83 W
PD (Power Dissipation) at TA = 25°C - - - 3.75 W
TJ, TSTG (Operating and Storage Junction Temperature Range) - - - -55 to +175 °C
RθJC (Thermal Resistance, Junction to Case) - - - 1.8 °C/W
RθJA (Thermal Resistance, Junction to Ambient) - - - 40 °C/W
rDS(on) (Static Drain to Source On Resistance) at VGS = 10V, ID = 5.9A - 29 36 -

Key Features

  • High performance trench technology for extremely low rDS(on)
  • Maximum rDS(on) = 36 mΩ at VGS = 10 V, ID = 5.9 A
  • 100% UIL tested
  • RoHS compliant
  • Avalanche ruggedness for a wide range of switching applications

Applications

  • DC-AC conversion
  • Synchronous rectifier

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDD3860 MOSFET?

    The maximum drain to source voltage (VDS) is 100 V.

  2. What is the maximum continuous drain current (ID) at TC = 25°C?

    The maximum continuous drain current (ID) at TC = 25°C is 29 A.

  3. What is the thermal resistance from junction to case (RθJC) of the FDD3860?

    The thermal resistance from junction to case (RθJC) is 1.8 °C/W.

  4. Is the FDD3860 MOSFET RoHS compliant?

    Yes, the FDD3860 MOSFET is RoHS compliant.

  5. What are the typical applications of the FDD3860 MOSFET?

    The FDD3860 MOSFET is typically used in DC-AC conversion and synchronous rectifier applications.

  6. What is the maximum gate to source voltage (VGS) of the FDD3860 MOSFET?

    The maximum gate to source voltage (VGS) is ±20 V.

  7. What is the single pulse avalanche energy (EAS) of the FDD3860 MOSFET?

    The single pulse avalanche energy (EAS) is 121 mJ.

  8. What is the operating and storage junction temperature range of the FDD3860 MOSFET?

    The operating and storage junction temperature range is -55 to +175 °C.

  9. What is the typical on-resistance (rDS(on)) of the FDD3860 MOSFET at VGS = 10V and ID = 5.9A?

    The typical on-resistance (rDS(on)) is 36 mΩ at VGS = 10V and ID = 5.9A.

  10. What package type is the FDD3860 MOSFET available in?

    The FDD3860 MOSFET is available in the D-PAK (TO-252) package.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):100 V
Current - Continuous Drain (Id) @ 25°C:6.2A (Ta)
Drive Voltage (Max Rds On, Min Rds On):10V
Rds On (Max) @ Id, Vgs:36mOhm @ 5.9A, 10V
Vgs(th) (Max) @ Id:4.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:31 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:1740 pF @ 50 V
FET Feature:- 
Power Dissipation (Max):3.1W (Ta), 69W (Tc)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:TO-252AA
Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
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