FDC655BN_NBNN007
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onsemi FDC655BN_NBNN007

Manufacturer No:
FDC655BN_NBNN007
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 30V 6.3A SUPERSOT6
Delivery:
Payment:
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Product Introduction

Overview

The FDC655BN is a single N-Channel Logic Level MOSFET produced by onsemi, utilizing their advanced POWERTRENCH process. This device is designed to minimize on-state resistance while maintaining superior switching performance. It is well-suited for low voltage and battery-powered applications where low in-line power loss and fast switching are critical.

Key Specifications

Parameter Value Unit
Drain to Source Voltage (VDS) 30 V
Gate to Source Voltage (VGS) ±20 V
Continuous Drain Current (ID) 6.3 A
Pulsed Drain Current - -
Power Dissipation (PD) 1.6 W
Operating and Storage Junction Temperature Range -55 to +150 °C
On-State Resistance (RDS(ON)) at VGS = 10 V, ID = 6.3 A 21 - 25
On-State Resistance (RDS(ON)) at VGS = 4.5 V, ID = 5.5 A 26 - 33
Thermal Resistance, Junction to Ambient (RJA) 78 °C/W

Key Features

  • High Performance Trench Technology for Extremely Low RDS(ON)
  • Fast Switching
  • Low Gate Charge
  • Pb-Free, Halide Free, and RoHS Compliant
  • Low in-line power loss and fast switching capabilities

Applications

The FDC655BN is particularly suited for low voltage and battery-powered applications, including but not limited to:

  • Brushless DC Motor Control
  • Power Management in Portable Electronics
  • Low Voltage Power Switching
  • Battery-Powered Devices

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDC655BN?

    The maximum drain to source voltage (VDS) is 30 V.

  2. What is the continuous drain current (ID) rating of the FDC655BN?

    The continuous drain current (ID) rating is 6.3 A.

  3. What is the on-state resistance (RDS(ON)) at VGS = 10 V and ID = 6.3 A?

    The on-state resistance (RDS(ON)) is between 21 and 25 mΩ.

  4. Is the FDC655BN Pb-Free and RoHS compliant?
  5. What is the thermal resistance, junction to ambient (RJA), of the FDC655BN?

    The thermal resistance, junction to ambient (RJA), is 78 °C/W.

  6. What are the typical applications of the FDC655BN?

    The FDC655BN is typically used in low voltage and battery-powered applications, including brushless DC motor control and power management in portable electronics.

  7. What is the gate to source threshold voltage (VGS(th)) of the FDC655BN?

    The gate to source threshold voltage (VGS(th)) is between 1 and 3 V.

  8. What is the maximum power dissipation (PD) of the FDC655BN?

    The maximum power dissipation (PD) is 1.6 W.

  9. What is the operating and storage junction temperature range of the FDC655BN?

    The operating and storage junction temperature range is -55 to +150 °C.

  10. Is the FDC655BN still in production?

    No, the FDC655BN is obsolete and no longer manufactured.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):30 V
Current - Continuous Drain (Id) @ 25°C:6.3A (Ta)
Drive Voltage (Max Rds On, Min Rds On):4.5V, 10V
Rds On (Max) @ Id, Vgs:25mOhm @ 6.3A, 10V
Vgs(th) (Max) @ Id:3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:13 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:620 pF @ 15 V
FET Feature:- 
Power Dissipation (Max):800mW
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:SuperSOT™-6
Package / Case:SOT-23-6 Thin, TSOT-23-6
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