FDMC86160ET100
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onsemi FDMC86160ET100

Manufacturer No:
FDMC86160ET100
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 100V 9A/43A POWER33
Delivery:
Payment:
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iso45001
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Product Introduction

Overview

The FDMC86160ET100 is an N-Channel MOSFET produced by onsemi, utilizing their advanced PowerTrench process with Shielded Gate technology. This device is optimized for ultra-low on-state resistance (RDS(on)), making it highly suitable for applications requiring high performance in compact spaces, such as high-performance VRM (Voltage Regulator Modules), POL (Point of Load), and orring functions.

Key Specifications

ParameterValueUnit
Drain to Source Voltage (VDS)100V
Gate to Source Voltage (VGS)±20V
Continuous Drain Current (ID) at TC = 25°C43A
Continuous Drain Current (ID) at TC = 100°C31A
Pulsed Drain Current (ID)204A
Power Dissipation (PD) at TC = 25°C65W
Power Dissipation (PD) at TA = 25°C2.8W
Operating and Storage Junction Temperature Range (TJ, TSTG)-55 to +175°C
Thermal Resistance, Junction to Case (RθJC)2.3°C/W
Thermal Resistance, Junction to Ambient (RθJA)53°C/W
Static Drain to Source On Resistance (rDS(on)) at VGS = 10 V, ID = 9 A14 mΩ
Static Drain to Source On Resistance (rDS(on)) at VGS = 6 V, ID = 7 A23 mΩ

Key Features

  • Shielded Gate MOSFET Technology
  • Extended TJ Rating to 175°C
  • High Performance Technology for Extremely Low RDS(on)
  • Lead-free and RoHS Compliant
  • Ultra-low RDS(on) for high-performance applications in small spaces

Applications

  • Bridge Topologies
  • Synchronous Rectifier
  • High-performance VRM (Voltage Regulator Modules)
  • POL (Point of Load)
  • Orring functions

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDMC86160ET100? The maximum VDS is 100 V.
  2. What is the maximum continuous drain current (ID) at TC = 25°C? The maximum ID at TC = 25°C is 43 A.
  3. What is the thermal resistance from junction to case (RθJC) of this MOSFET? The RθJC is 2.3 °C/W.
  4. Is the FDMC86160ET100 RoHS compliant? Yes, it is lead-free and RoHS compliant.
  5. What are the typical applications of the FDMC86160ET100? Typical applications include bridge topologies, synchronous rectifier, high-performance VRM, POL, and orring functions.
  6. What is the maximum gate to source voltage (VGS) rating? The maximum VGS rating is ±20 V.
  7. What is the static drain to source on resistance (rDS(on)) at VGS = 10 V and ID = 9 A? The rDS(on) is 14 mΩ at VGS = 10 V and ID = 9 A.
  8. What is the operating and storage junction temperature range (TJ, TSTG)? The range is -55 to +175 °C.
  9. What is the power dissipation (PD) at TA = 25°C? The power dissipation at TA = 25°C is 2.8 W.
  10. What is the package type of the FDMC86160ET100? The package type is WDFN8 3.3x3.3, 0.65P (Power 33).

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):100 V
Current - Continuous Drain (Id) @ 25°C:9A (Ta), 43A (Tc)
Drive Voltage (Max Rds On, Min Rds On):6V, 10V
Rds On (Max) @ Id, Vgs:14mOhm @ 9A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:22 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:1290 pF @ 50 V
FET Feature:- 
Power Dissipation (Max):2.8W (Ta), 65W (Tc)
Operating Temperature:-55°C ~ 175°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:Power33
Package / Case:8-PowerWDFN
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