Overview
The FQD12N20LTM, produced by onsemi, is an N-Channel enhancement mode power MOSFET. This device is fabricated using onsemi's proprietary planar stripe and DMOS technology, which is designed to reduce on-state resistance and provide superior switching performance along with high avalanche energy strength. This MOSFET is suitable for a variety of high-power applications, including switched mode power supplies, active power factor correction (PFC), and electronic lamp ballasts.
Key Specifications
| Parameter | Rating | Unit |
|---|---|---|
| Drain-Source Voltage (VDSS) | 200 | V |
| Continuous Drain Current (ID) at TC = 25°C | 9.0 | A |
| Continuous Drain Current (ID) at TC = 100°C | 5.7 | A |
| Pulsed Drain Current (IDM) | 36 | A |
| Gate-Source Voltage (VGSS) | ±20 | V |
| Static Drain-Source On-Resistance (RDS(on)) at VGS = 10 V, ID = 4.5 A | 280 mΩ (Max.) | mΩ |
| Gate Threshold Voltage (VGS(th)) | 1.0 - 2.0 | V |
| Power Dissipation (PD) at TA = 25°C | 2.5 | W |
| Thermal Resistance, Junction to Case (RJC) | 2.27 | °C/W |
| Operating and Storage Temperature Range (TJ, TSTG) | -55 to +150 | °C |
Key Features
- Low on-state resistance (RDS(on) = 280 mΩ Max. at VGS = 10 V, ID = 4.5 A)
- Low gate charge (Typ. 16 nC)
- Low Crss (Typ. 17 pF)
- 100% avalanche tested
- High avalanche energy strength
- Superior switching performance
Applications
The FQD12N20LTM is suitable for various high-power applications, including:
- Switched mode power supplies
- Active power factor correction (PFC)
- Electronic lamp ballasts
Q & A
- What is the maximum drain-source voltage of the FQD12N20LTM?
The maximum drain-source voltage (VDSS) is 200 V. - What is the continuous drain current at 25°C and 100°C?
The continuous drain current is 9.0 A at 25°C and 5.7 A at 100°C. - What is the maximum pulsed drain current?
The maximum pulsed drain current (IDM) is 36 A. - What is the gate-source voltage range?
The gate-source voltage (VGSS) range is ±20 V. - What is the typical gate charge?
The typical gate charge is 16 nC. - What are the thermal resistance values for junction to case and junction to ambient?
The thermal resistance from junction to case (RJC) is 2.27 °C/W, and from junction to ambient (RJA) is 110 °C/W (minimum pad of 2-oz copper). - What is the operating and storage temperature range?
The operating and storage temperature range (TJ, TSTG) is -55 to +150 °C. - What are the typical applications of the FQD12N20LTM?
The typical applications include switched mode power supplies, active power factor correction (PFC), and electronic lamp ballasts. - Is the FQD12N20LTM 100% avalanche tested?
Yes, the FQD12N20LTM is 100% avalanche tested. - What is the maximum lead temperature for soldering?
The maximum lead temperature for soldering is 300 °C for 1/8” from the case for 5 seconds.
