FDS6673BZ-G
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onsemi FDS6673BZ-G

Manufacturer No:
FDS6673BZ-G
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
-30V P-CHANNEL POWERTRENCH MOSFE
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDS6673BZ-G is a P-Channel MOSFET produced by onsemi, utilizing their advanced Power Trench process. This technology is specifically designed to minimize on-state resistance, making the device highly efficient for power management and load switching applications. The MOSFET is well-suited for use in notebook computers and portable battery packs due to its high performance and robust specifications.

Key Specifications

Parameter Value Unit
Current (Ta) 14.5 A A
Drain to Source Voltage (Vdss) 30 V V
Drive Voltage (Max Rds On, Min Rds On) 4.5 V, 10 V V
FET Type P-Channel
Gate Charge (Qg) (Max) @ Vgs 65 nC @ 5 V nC
Input Capacitance (Ciss) (Max) @ Vds 4700 pF @ 15 V pF
Mounting Type Surface Mount
Operating Temperature -55°C ~ 150°C (TJ) °C
Package 8-SOIC (0.154", 3.90mm Width)
Power Dissipation (Max) 1 W (Ta) W
Rds On (Max) @ Id, Vgs 7.8 mΩ @ 14.5 A, 10 V
Vgs (Max) ±25 V V
Vgs(th) (Max) @ Id 3 V @ 250 µA V

Key Features

  • High performance trench technology for extremely low Rds(on)
  • Extended Vgs range (-25 V) for battery applications
  • HBM ESD protection level of 6.5 kV typical
  • High power and current handling capability
  • Pb-free, halide-free, and RoHS compliant

Applications

The FDS6673BZ-G is well-suited for power management and load switching applications, particularly in:

  • Notebook computers
  • Portable battery packs

Q & A

  1. What is the maximum drain to source voltage (Vdss) of the FDS6673BZ-G?

    The maximum drain to source voltage (Vdss) is 30 V.

  2. What is the typical on-state resistance (Rds(on)) at Vgs = -10 V and Id = -14.5 A?

    The typical on-state resistance (Rds(on)) is 7.8 mΩ.

  3. What is the operating temperature range of the FDS6673BZ-G?

    The operating temperature range is -55°C to 150°C (TJ).

  4. What is the package type of the FDS6673BZ-G?

    The package type is 8-SOIC with a width of 0.154" (3.90mm).

  5. Is the FDS6673BZ-G RoHS compliant?
  6. What is the maximum gate to source voltage (Vgs) for the FDS6673BZ-G?

    The maximum gate to source voltage (Vgs) is ±25 V.

  7. What is the gate charge (Qg) at Vgs = 5 V?

    The gate charge (Qg) at Vgs = 5 V is 65 nC.

  8. What are the typical applications for the FDS6673BZ-G?

    The typical applications include power management and load switching in notebook computers and portable battery packs.

  9. What is the input capacitance (Ciss) at Vds = 15 V?

    The input capacitance (Ciss) at Vds = 15 V is 4700 pF.

  10. What is the HBM ESD protection level of the FDS6673BZ-G?

    The HBM ESD protection level is 6.5 kV typical.

Product Attributes

FET Type:P-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):30 V
Current - Continuous Drain (Id) @ 25°C:14.5A (Ta)
Drive Voltage (Max Rds On, Min Rds On):4.5V, 10V
Rds On (Max) @ Id, Vgs:7.8mOhm @ 14.5A, 10V
Vgs(th) (Max) @ Id:3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:65 nC @ 5 V
Vgs (Max):±25V
Input Capacitance (Ciss) (Max) @ Vds:4700 pF @ 15 V
FET Feature:- 
Power Dissipation (Max):1W (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-SOIC
Package / Case:8-SOIC (0.154", 3.90mm Width)
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