FDN336P
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onsemi FDN336P

Manufacturer No:
FDN336P
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET P-CH 20V 1.3A SUPERSOT3
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDN336P is a single P-Channel 2.5V specified PowerTrench® MOSFET produced by onsemi. This device is fabricated using onsemi's advanced PowerTrench process, which is designed to minimize on-state resistance while maintaining low gate charge for superior switching performance. The FDN336P is particularly suited for applications in portable electronics, including load switching, power management, battery charging circuits, and DC/DC conversion.

Key Specifications

ParameterValueUnit
Drain to Source Voltage (VDSS)-20V
Gate to Source Voltage (VGSS)±8V
Continuous Drain Current (ID)-1.3A
Pulsed Drain Current (ID)-10A
Maximum Power Dissipation (PD)0.5 / 0.46W
Operating and Storage Junction Temperature Range (TJ, TSTG)-55 to +150°C
Thermal Resistance, Junction-to-Ambient (RθJA)250°C/W
Thermal Resistance, Junction-to-Case (RθJC)75°C/W
Static Drain-Source On-Resistance (RDS(on)) @ VGS = -4.5V, ID = -1.3A0.20Ω
Static Drain-Source On-Resistance (RDS(on)) @ VGS = -2.5V, ID = -1.1A0.27Ω
Total Gate Charge (Qg)3.6nC

Key Features

  • High performance trench technology for extremely low RDS(on)
  • Low gate charge (3.6 nC typical)
  • SuperSOT™-3 package providing low RDS(on) and 30% higher power handling capability than SOT23 in the same footprint
  • Low on-state resistance: RDS(on) = 0.20 Ω @ VGS = -4.5 V, RDS(on) = 0.27 Ω @ VGS = -2.5 V
  • High on-state drain current: -1.3 A continuous, -10 A pulsed

Applications

The FDN336P is well-suited for various applications in portable electronics, including:

  • Load switching and power management
  • Battery charging circuits
  • DC/DC conversion

Q & A

  1. What is the maximum drain to source voltage (VDSS) of the FDN336P?
    The maximum drain to source voltage (VDSS) is -20 V.
  2. What is the gate to source voltage (VGSS) range for the FDN336P?
    The gate to source voltage (VGSS) range is ±8 V.
  3. What is the continuous drain current (ID) rating for the FDN336P?
    The continuous drain current (ID) rating is -1.3 A.
  4. What is the maximum power dissipation (PD) of the FDN336P?
    The maximum power dissipation (PD) is 0.5 W (or 0.46 W under specific conditions).
  5. What is the operating and storage junction temperature range for the FDN336P?
    The operating and storage junction temperature range is -55 to +150 °C.
  6. What is the thermal resistance, junction-to-ambient (RθJA), for the FDN336P?
    The thermal resistance, junction-to-ambient (RθJA), is 250 °C/W.
  7. What is the typical total gate charge (Qg) for the FDN336P?
    The typical total gate charge (Qg) is 3.6 nC.
  8. What are the common applications of the FDN336P?
    The FDN336P is commonly used in load switching, power management, battery charging circuits, and DC/DC conversion.
  9. What package type does the FDN336P use?
    The FDN336P uses the SuperSOT™-3 package.
  10. What are the benefits of the SuperSOT™-3 package?
    The SuperSOT™-3 package provides low RDS(on) and 30% higher power handling capability than SOT23 in the same footprint.

Product Attributes

FET Type:P-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):20 V
Current - Continuous Drain (Id) @ 25°C:1.3A (Ta)
Drive Voltage (Max Rds On, Min Rds On):2.5V, 4.5V
Rds On (Max) @ Id, Vgs:200mOhm @ 1.3A, 4.5V
Vgs(th) (Max) @ Id:1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:5 nC @ 4.5 V
Vgs (Max):±8V
Input Capacitance (Ciss) (Max) @ Vds:330 pF @ 10 V
FET Feature:- 
Power Dissipation (Max):500mW (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:SOT-23-3
Package / Case:TO-236-3, SC-59, SOT-23-3
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Same Series
FDN336P
FDN336P
MOSFET P-CH 20V 1.3A SUPERSOT3

Similar Products

Part Number FDN336P FDN338P FDN306P
Manufacturer onsemi onsemi onsemi
Product Status Active Active Active
FET Type P-Channel P-Channel P-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 20 V 20 V 12 V
Current - Continuous Drain (Id) @ 25°C 1.3A (Ta) 1.6A (Ta) 2.6A (Ta)
Drive Voltage (Max Rds On, Min Rds On) 2.5V, 4.5V 2.5V, 4.5V 1.8V, 4.5V
Rds On (Max) @ Id, Vgs 200mOhm @ 1.3A, 4.5V 115mOhm @ 1.6A, 4.5V 40mOhm @ 2.6A, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250µA 1.5V @ 250µA 1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 5 nC @ 4.5 V 6.2 nC @ 4.5 V 17 nC @ 4.5 V
Vgs (Max) ±8V ±8V ±8V
Input Capacitance (Ciss) (Max) @ Vds 330 pF @ 10 V 451 pF @ 10 V 1138 pF @ 6 V
FET Feature - - -
Power Dissipation (Max) 500mW (Ta) 500mW (Ta) 500mW (Ta)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount
Supplier Device Package SOT-23-3 SOT-23-3 SOT-23-3
Package / Case TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3 TO-236-3, SC-59, SOT-23-3

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