FDG6332C-PG
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onsemi FDG6332C-PG

Manufacturer No:
FDG6332C-PG
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N P-CH 20V SC70-6
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDG6332C-PG is a dual N & P-Channel MOSFET produced by onsemi, utilizing their advanced PowerTrench process. This technology is designed to minimize on-state resistance while maintaining superior switching performance. The device is optimized for applications requiring high power dissipation in a compact footprint, making it an ideal choice where larger, more expensive packages like TSSOP-8 and SSOP-6 are impractical.

This MOSFET array is housed in a small SC70-6 (SOT-363) package, which is 51% smaller than the SSOT-6 package and has a low profile of 1mm thickness. This compact design makes it suitable for a wide range of general usage applications.

Key Specifications

Parameter Symbol Test Conditions Min Max Unit
Drain-Source Breakdown Voltage (N-Channel) BVDSS VGS = 0 V, ID = 0.5 A - - 20 V
Drain-Source Breakdown Voltage (P-Channel) BVDSS VGS = 0 V, ID = -0.5 A - - 20 V
On-State Drain Current (N-Channel) ID(on) VGS = 4.5 V, VDS = 5 V 1 - - A
On-State Drain Current (P-Channel) ID(on) VGS = -4.5 V, VDS = -5 V -2 - - A
On-State Resistance (N-Channel) RDS(ON) VGS = 4.5 V - 300 - mΩ
On-State Resistance (N-Channel) RDS(ON) VGS = 2.5 V - 400 - mΩ
On-State Resistance (P-Channel) RDS(ON) VGS = -4.5 V - 420 - mΩ
On-State Resistance (P-Channel) RDS(ON) VGS = -2.5 V - 630 - mΩ
Thermal Resistance, Junction-to-Ambient RJA - - 415 °C/W

Key Features

  • Advanced PowerTrench Process: Minimizes on-state resistance and maintains superior switching performance.
  • Compact Package: SC70-6 (SOT-363) package, 51% smaller than SSOT-6 and 1mm thick.
  • Low On-State Resistance: RDS(ON) = 300 mΩ @ VGS = 4.5 V for N-Channel, RDS(ON) = 420 mΩ @ VGS = -4.5 V for P-Channel.
  • High Performance Trench Technology: Ensures extremely low RDS(ON) values.
  • Low Gate Charge: Enhances switching efficiency.

Applications

The FDG6332C-PG is suitable for a wide range of applications where compact, high-performance MOSFETs are required. These include:

  • Portable Electronics: Due to its small footprint and low profile, it is ideal for mobile devices, tablets, and other portable electronics.
  • Automotive Systems: Can be used in various automotive applications requiring high power dissipation in a small space.
  • Industrial Control Systems: Suitable for use in industrial control circuits where space is limited.
  • Power Management Systems: Can be used in power management circuits requiring efficient switching and low on-state resistance.

Q & A

  1. What is the FDG6332C-PG MOSFET?

    The FDG6332C-PG is a dual N & P-Channel MOSFET produced by onsemi, utilizing the advanced PowerTrench process.

  2. What are the key features of the FDG6332C-PG?

    Key features include low on-state resistance, high performance trench technology, low gate charge, and a compact SC70-6 package.

  3. What is the on-state resistance of the N-Channel MOSFET at VGS = 4.5 V?

    The on-state resistance (RDS(ON)) of the N-Channel MOSFET at VGS = 4.5 V is 300 mΩ.

  4. What is the on-state resistance of the P-Channel MOSFET at VGS = -4.5 V?

    The on-state resistance (RDS(ON)) of the P-Channel MOSFET at VGS = -4.5 V is 420 mΩ.

  5. What is the thermal resistance, junction-to-ambient (RJA) of the FDG6332C-PG?

    The thermal resistance, junction-to-ambient (RJA) is 415 °C/W.

  6. In what package is the FDG6332C-PG available?

    The FDG6332C-PG is available in the SC70-6 (SOT-363) package.

  7. What are some typical applications for the FDG6332C-PG?

    Typical applications include portable electronics, automotive systems, industrial control systems, and power management systems.

  8. How does the PowerTrench process benefit the FDG6332C-PG?

    The PowerTrench process minimizes on-state resistance and maintains superior switching performance.

  9. What is the maximum drain-source breakdown voltage for both channels?

    The maximum drain-source breakdown voltage (BVDSS) for both N and P channels is 20 V.

  10. Is the FDG6332C-PG RoHS compliant?

    Yes, the FDG6332C-PG is RoHS compliant.

Product Attributes

FET Type:N and P-Channel Complementary
FET Feature:Standard
Drain to Source Voltage (Vdss):20V
Current - Continuous Drain (Id) @ 25°C:700mA (Ta), 600mA (Ta)
Rds On (Max) @ Id, Vgs:300mOhm @ 700mA, 4.5V, 420mOhm @ 600mA, 4.5V
Vgs(th) (Max) @ Id:1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:1.5nC @ 4.5V, 2nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:113pF @ 10V, 114pF @ 10V
Power - Max:300mW (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Package / Case:6-TSSOP, SC-88, SOT-363
Supplier Device Package:SC-88/SC70-6/SOT-363
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