STL12P6F6
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STMicroelectronics STL12P6F6

Manufacturer No:
STL12P6F6
Manufacturer:
STMicroelectronics
Package:
Tape & Reel (TR)
Description:
MOSFET P-CH 60V 4A POWERFLAT
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The STL12P6F6 is a P-channel Power MOSFET developed by STMicroelectronics, utilizing the advanced STripFET™ F6 technology. This device features a new trench gate structure, enhancing its performance and efficiency. The STL12P6F6 is packaged in a PowerFLAT™ 5x6 package, making it suitable for a variety of power management applications.

Key Specifications

Parameter Value Unit
VDS (Drain-Source Voltage) -60 V
RDS(on) (On-Resistance) 0.13 Ω
ID (Drain Current) -3 A
Package PowerFLAT™ 5x6
Technology STripFET™ F6

Key Features

  • Advanced STripFET™ F6 technology with a new trench gate structure for improved performance and efficiency.
  • Low on-resistance (RDS(on)) of 0.13 Ω typical, reducing power losses.
  • High drain current capability of -3 A, suitable for various power management applications.
  • Compact PowerFLAT™ 5x6 package, optimizing board space and thermal performance.

Applications

  • Power management in consumer electronics, such as laptops and smartphones.
  • Automotive systems, including battery management and motor control.
  • Industrial power supplies and DC-DC converters.
  • Switch-mode power supplies and high-efficiency power systems.

Q & A

  1. What is the typical on-resistance of the STL12P6F6?

    The typical on-resistance (RDS(on)) of the STL12P6F6 is 0.13 Ω.

  2. What is the maximum drain-source voltage for the STL12P6F6?

    The maximum drain-source voltage (VDS) for the STL12P6F6 is -60 V.

  3. What is the package type of the STL12P6F6?

    The STL12P6F6 is packaged in a PowerFLAT™ 5x6 package.

  4. What technology is used in the STL12P6F6?

    The STL12P6F6 uses the advanced STripFET™ F6 technology with a new trench gate structure.

  5. What is the maximum drain current of the STL12P6F6?

    The maximum drain current (ID) of the STL12P6F6 is -3 A.

  6. In what types of applications is the STL12P6F6 commonly used?

    The STL12P6F6 is commonly used in power management applications such as consumer electronics, automotive systems, industrial power supplies, and switch-mode power supplies.

  7. What are the benefits of using the STripFET™ F6 technology in the STL12P6F6?

    The STripFET™ F6 technology provides improved performance and efficiency due to its new trench gate structure, reducing power losses and enhancing overall system performance.

  8. How does the PowerFLAT™ 5x6 package benefit the STL12P6F6?

    The PowerFLAT™ 5x6 package optimizes board space and thermal performance, making it suitable for compact and high-efficiency power management systems.

  9. Where can I find detailed specifications and datasheets for the STL12P6F6?

    Detailed specifications and datasheets for the STL12P6F6 can be found on the STMicroelectronics official website and other authorized distributors such as Digi-Key, Mouser, and Arrow Electronics.

  10. Is the STL12P6F6 suitable for automotive applications?

    Yes, the STL12P6F6 can be used in automotive systems due to its robust specifications and the availability of automotive-grade versions in similar product lines.

Product Attributes

FET Type:P-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):60 V
Current - Continuous Drain (Id) @ 25°C:4A (Tc)
Drive Voltage (Max Rds On, Min Rds On):10V
Rds On (Max) @ Id, Vgs:160mOhm @ 1.5A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:6.4 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:340 pF @ 48 V
FET Feature:- 
Power Dissipation (Max):75W (Tc)
Operating Temperature:-55°C ~ 175°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:PowerFlat™ (5x6)
Package / Case:8-PowerVDFN
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