NVMFS2D3P04M8LT1G
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onsemi NVMFS2D3P04M8LT1G

Manufacturer No:
NVMFS2D3P04M8LT1G
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MV8 P INITIAL PROGRAM
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The NVMFS2D3P04M8LT1G is a power MOSFET produced by onsemi, designed for high-performance applications. This single P-channel MOSFET is characterized by its low on-resistance (RDS(on)) and high current capability, making it suitable for a variety of power management and switching applications. The device is AEC-Q101 qualified and PPAP capable, ensuring reliability and compliance with automotive and other stringent requirements.

Key Specifications

ParameterSymbolValueUnit
Drain-to-Source VoltageVDSS-40V
Gate-to-Source VoltageVGS±20V
Continuous Drain Current (TC = 25°C)ID-222A
Continuous Drain Current (TC = 100°C)ID-157A
Power Dissipation (TC = 25°C)PD205W
Power Dissipation (TC = 100°C)PD103W
Pulsed Drain Current (tp = 10 µs)IDM-900A
Operating Junction and Storage Temperature RangeTJ, Tstg-55 to +175°C
Source Current (Body Diode)IS-171A
Single Pulse Drain-to-Source Avalanche EnergyEAS1516mJ
Lead Temperature for Soldering PurposesTL260°C
Junction-to-Case Thermal ResistanceRθJC0.7°C/W
Junction-to-Ambient Thermal ResistanceRθJA39°C/W
On-Resistance (VGS = -10 V, ID = -30 A)RDS(on)1.6 - 2.2

Key Features

  • Low RDS(on): Minimizes conduction losses, enhancing overall efficiency.
  • High Current Capability: Supports high current applications with a continuous drain current of up to -222 A at TC = 25°C.
  • Avalanche Energy Specified: Ensures robust performance under transient conditions with a specified avalanche energy of 1516 mJ.
  • AEC-Q101 Qualified and PPAP Capable: Meets automotive and other stringent requirements for reliability and quality.
  • Pb-Free, Halogen Free/BFR Free, and RoHS Compliant: Environmentally friendly and compliant with global regulations.
  • Wettable Flanks: Available in versions with wettable flanks for improved solderability and inspection.

Applications

The NVMFS2D3P04M8LT1G is suitable for a wide range of applications, including:

  • Automotive Systems: Given its AEC-Q101 qualification, it is ideal for use in automotive power management and switching circuits.
  • Power Management: Used in DC-DC converters, power supplies, and other power management circuits where high efficiency and reliability are crucial.
  • Industrial Control: Applicable in industrial control systems, motor drives, and other high-current applications.
  • Consumer Electronics: Suitable for use in high-power consumer electronics such as power adapters, battery chargers, and more.

Q & A

  1. What is the maximum drain-to-source voltage of the NVMFS2D3P04M8LT1G? The maximum drain-to-source voltage is -40 V.
  2. What is the continuous drain current at TC = 25°C? The continuous drain current at TC = 25°C is -222 A.
  3. Is the NVMFS2D3P04M8LT1G AEC-Q101 qualified? Yes, it is AEC-Q101 qualified and PPAP capable.
  4. What is the on-resistance (RDS(on)) of the device? The on-resistance (RDS(on)) is between 1.6 mΩ and 2.2 mΩ at VGS = -10 V and ID = -30 A.
  5. What is the junction-to-case thermal resistance? The junction-to-case thermal resistance is 0.7 °C/W.
  6. Is the device Pb-Free and RoHS compliant? Yes, the device is Pb-Free, Halogen Free/BFR Free, and RoHS compliant.
  7. What is the maximum operating junction temperature? The maximum operating junction temperature is +175 °C.
  8. What is the single pulse drain-to-source avalanche energy? The single pulse drain-to-source avalanche energy is 1516 mJ.
  9. Can the NVMFS2D3P04M8LT1G be used in life support systems or medical devices? No, the device is not designed or intended for use in life support systems or medical devices.
  10. What is the lead temperature for soldering purposes? The lead temperature for soldering purposes is 260 °C.

Product Attributes

FET Type:P-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):40 V
Current - Continuous Drain (Id) @ 25°C:31A (Ta), 222A (Tc)
Drive Voltage (Max Rds On, Min Rds On):4.5V, 10V
Rds On (Max) @ Id, Vgs:2.2mOhm @ 30A, 10V
Vgs(th) (Max) @ Id:2.4V @ 2.7mA
Gate Charge (Qg) (Max) @ Vgs:157 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:5985 pF @ 20 V
FET Feature:- 
Power Dissipation (Max):3.8W (Ta), 205W (Tc)
Operating Temperature:-55°C ~ 175°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:5-DFN (5x6) (8-SOFL)
Package / Case:8-PowerTDFN, 5 Leads
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