FDS86242
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onsemi FDS86242

Manufacturer No:
FDS86242
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 150V 4.1A 8SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDS86242 is an N-Channel MOSFET produced by onsemi, utilizing their advanced POWERTRENCH® process. This device is optimized for low on-resistance (rDS(on)), superior switching performance, and enhanced ruggedness. It is designed to operate at high power and current levels, making it suitable for a variety of applications in power management and conversion.

Key Specifications

Parameter Test Conditions Min Typ Max Unit
VDS (Drain to Source Voltage) - - - 150 V
VGS (Gate to Source Voltage) - - - ±20 V
ID (Drain Current) - Continuous - - - 4.1 A
ID (Drain Current) - Pulsed - - - 20 A
rDS(on) at VGS = 10 V, ID = 4.1 A - 56.3 67
rDS(on) at VGS = 6 V, ID = 3.3 A - 73.8 98
BVDSS (Drain to Source Breakdown Voltage) ID = 250 μA, VGS = 0 V - - 150 V
PD (Power Dissipation) at TC = 25°C - - - 5.0 W
TJ, TSTG (Operating and Storage Junction Temperature Range) - -55 - 150 °C
RθJC (Thermal Resistance, Junction to Case) - - - 25 °C/W
RθJA (Thermal Resistance, Junction to Ambient) - - - 50 °C/W

Key Features

  • High performance trench technology for extremely low rDS(on)
  • High power and current handling capability in a widely used SOIC-8 surface mount package
  • 100% UIL Tested for reliability
  • ESD Protection Level: HBM > 500 V, CDM > 2 kV
  • Pb-Free, Halide Free, and RoHS Compliant
  • Low on-resistance (rDS(on)) of 67 mΩ at VGS = 10 V, ID = 4.1 A and 98 mΩ at VGS = 6 V, ID = 3.3 A
  • High gate to source threshold voltage (VGS(th)) of 2 to 4 V
  • Low gate to source leakage current (IGSS) of ±100 nA

Applications

  • DC/DC converters and Off-Line UPS
  • Distributed Power Architectures and VRMs
  • Primary Switch for 24 V and 48 V Systems
  • High Voltage Synchronous Rectifier

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDS86242 MOSFET?

    The maximum drain to source voltage (VDS) is 150 V.

  2. What is the continuous drain current (ID) rating of the FDS86242?

    The continuous drain current (ID) rating is 4.1 A.

  3. What is the typical on-resistance (rDS(on)) at VGS = 10 V and ID = 4.1 A?

    The typical on-resistance (rDS(on)) is 56.3 mΩ, with a maximum of 67 mΩ.

  4. Is the FDS86242 MOSFET RoHS compliant?
  5. What are the typical applications of the FDS86242 MOSFET?

    The FDS86242 is typically used in DC/DC converters, Off-Line UPS, Distributed Power Architectures, VRMs, and as a primary switch for 24 V and 48 V systems.

  6. What is the thermal resistance from junction to case (RθJC) of the FDS86242?

    The thermal resistance from junction to case (RθJC) is 25 °C/W.

  7. What is the gate to source threshold voltage (VGS(th)) range of the FDS86242?

    The gate to source threshold voltage (VGS(th)) range is from 2 to 4 V.

  8. Does the FDS86242 have ESD protection? 500 V and CDM > 2 kV.

  9. What is the operating and storage junction temperature range of the FDS86242?

    The operating and storage junction temperature range is from -55°C to +150°C.

  10. What package type is the FDS86242 available in?

    The FDS86242 is available in an SOIC-8 surface mount package.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):150 V
Current - Continuous Drain (Id) @ 25°C:4.1A (Ta)
Drive Voltage (Max Rds On, Min Rds On):6V, 10V
Rds On (Max) @ Id, Vgs:67mOhm @ 4.1A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:13 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:760 pF @ 75 V
FET Feature:- 
Power Dissipation (Max):2.5W (Ta), 5W (Tc)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-SOIC
Package / Case:8-SOIC (0.154", 3.90mm Width)
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Similar Products

Part Number FDS86242 FDS86252 FDS86240
Manufacturer onsemi onsemi onsemi
Product Status Active Active Active
FET Type N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 150 V 150 V 150 V
Current - Continuous Drain (Id) @ 25°C 4.1A (Ta) 4.5A (Ta) 7.5A (Ta)
Drive Voltage (Max Rds On, Min Rds On) 6V, 10V 6V, 10V 6V, 10V
Rds On (Max) @ Id, Vgs 67mOhm @ 4.1A, 10V 55mOhm @ 4.5A, 10V 19.8mOhm @ 7.5A, 10V
Vgs(th) (Max) @ Id 4V @ 250µA 4V @ 250µA 4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 13 nC @ 10 V 15 nC @ 10 V 40 nC @ 10 V
Vgs (Max) ±20V ±20V ±20V
Input Capacitance (Ciss) (Max) @ Vds 760 pF @ 75 V 955 pF @ 75 V 2570 pF @ 75 V
FET Feature - - -
Power Dissipation (Max) 2.5W (Ta), 5W (Tc) 2.5W (Ta), 5W (Tc) 2.5W (Ta), 5W (Tc)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount
Supplier Device Package 8-SOIC 8-SOIC 8-SOIC
Package / Case 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width)

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