FDD4685TF_SB82135
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onsemi FDD4685TF_SB82135

Manufacturer No:
FDD4685TF_SB82135
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET P-CH 40V 8.4A/32A DPAK
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDD4685TF_SB82135 is a 40V P-Channel PowerTrench® MOSFET produced by onsemi. This device is designed using Fairchild Semiconductor’s proprietary PowerTrench® technology, which delivers extremely low on-resistance (rDS(on)) and excellent switching characteristics. The MOSFET is packaged in a D-PAK (TO-252) surface mount package, making it suitable for a variety of high-performance applications.

Key Specifications

Parameter Symbol Test Conditions Min Typ Max Units
Drain to Source Voltage VDS -40 V
Gate to Source Voltage VGS ±20 V
Continuous Drain Current (Package Limited) ID TC = 25°C -32 A
Continuous Drain Current (Silicon Limited) ID TC = 25°C -40 A
Pulsed Drain Current ID -100 A
Drain-Source On Resistance rDS(on) VGS = -10V, ID = -8.4A 23 27 33 mΩ
Drain-Source On Resistance rDS(on) VGS = -4.5V, ID = -7A 30 35 42 mΩ
Thermal Resistance, Junction to Case RθJC 1.8 °C/W
Thermal Resistance, Junction to Ambient RθJA 40 °C/W
Operating and Storage Junction Temperature Range TJ, TSTG -55 +150 °C

Key Features

  • High performance trench technology for extremely low rDS(on)
  • Maximum rDS(on) of 27mΩ at VGS = -10V, ID = -8.4A and 35mΩ at VGS = -4.5V, ID = -7A
  • RoHS Compliant
  • Excellent switching characteristics
  • High drain current capability: up to -32A continuous and -100A pulsed
  • Low gate to source threshold voltage: -1 to -3V
  • Low thermal resistance: RθJC = 1.8°C/W and RθJA = 40°C/W

Applications

  • Inverter applications
  • Power supplies

Q & A

  1. What is the maximum drain to source voltage of the FDD4685TF_SB82135 MOSFET?

    The maximum drain to source voltage (VDS) is -40V.

  2. What is the maximum continuous drain current for this MOSFET?

    The maximum continuous drain current (ID) is -32A at TC = 25°C and -40A at TA = 25°C.

  3. What is the typical on-resistance (rDS(on)) of the FDD4685TF_SB82135?

    The typical on-resistance (rDS(on)) is 27mΩ at VGS = -10V, ID = -8.4A.

  4. Is the FDD4685TF_SB82135 RoHS compliant?
  5. What is the thermal resistance, junction to case (RθJC), of this MOSFET?

    The thermal resistance, junction to case (RθJC), is 1.8°C/W.

  6. What are the typical applications for the FDD4685TF_SB82135 MOSFET?

    The typical applications include inverter and power supply applications.

  7. What is the package type of the FDD4685TF_SB82135 MOSFET?

    The package type is D-PAK (TO-252).

  8. What is the operating and storage junction temperature range for this MOSFET?

    The operating and storage junction temperature range is -55°C to +150°C.

  9. What is the gate to source threshold voltage (VGS(th)) of the FDD4685TF_SB82135?

    The gate to source threshold voltage (VGS(th)) is -1 to -3V.

  10. What is the maximum power dissipation (PD) of this MOSFET at TC = 25°C?

    The maximum power dissipation (PD) is 69W at TC = 25°C.

Product Attributes

FET Type:P-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):40 V
Current - Continuous Drain (Id) @ 25°C:8.4A (Ta), 32A (Tc)
Drive Voltage (Max Rds On, Min Rds On):- 
Rds On (Max) @ Id, Vgs:27mOhm @ 8.4A, 10V
Vgs(th) (Max) @ Id:3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:27 nC @ 5 V
Vgs (Max):- 
Input Capacitance (Ciss) (Max) @ Vds:2380 pF @ 20 V
FET Feature:- 
Power Dissipation (Max):- 
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:TO-252AA
Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
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