FDMS86200DC
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onsemi FDMS86200DC

Manufacturer No:
FDMS86200DC
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 150V 9.3A DLCOOL56
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDMS86200DC is an N-Channel MOSFET produced by onsemi, utilizing their advanced POWERTRENCH® process and incorporating Shielded Gate technology. This device is designed to offer low on-state resistance (rDS(on)) while maintaining excellent switching performance. The DUAL COOL® package technology enhances thermal management, making it suitable for high-power applications.

Key Specifications

Parameter Unit Typical Value Maximum Value
VDS (Drain to Source Voltage) V - 150
ID (Drain Current) A - 40
rDS(on) at VGS = 10 V, ID = 9.3 A 14 17
rDS(on) at VGS = 6 V, ID = 7.8 A 17 25
gFS (Forward Transconductance) at VDS = 10 V, ID = 9.3 A S 32 -
Ciss (Input Capacitance) at VDS = 75 V, VGS = 0 V, f = 1 MHz pF 2110 2955
Coss (Output Capacitance) pF 205 290
Crss (Reverse Transfer Capacitance) pF 8.1 15
Rg (Gate Resistance) Ω 0.1 3.0
td(on) (Turn-On Delay Time) at VDD = 75 V, ID = 9.3 A, VGS = 10 V ns 16 29
tr (Rise Time) ns 4 10
td(off) (Turn-Off Delay Time) ns 23 37
tf (Fall Time) ns 5 10

Key Features

  • Shielded Gate MOSFET Technology: Enhances switching performance and reduces on-state resistance.
  • DUAL COOL® Top Side Cooling DFN8 Package: Improves thermal management by allowing heat dissipation from both the top and bottom of the package.
  • Low rDS(on): Maximum rDS(on) of 17 mΩ at VGS = 10 V, ID = 9.3 A, and 25 mΩ at VGS = 6 V, ID = 7.8 A.
  • High Performance Technology: Optimized for low on-state resistance and superior switching characteristics.
  • 100% UIL Tested: Ensures reliability and performance under various operating conditions.

Applications

  • Power Management: Suitable for high-power applications such as DC-DC converters, power supplies, and motor control systems.
  • Industrial Automation: Used in industrial automation equipment, including drives and control systems.
  • Automotive Systems: Applicable in automotive systems requiring high power and efficient thermal management.
  • Renewable Energy Systems: Can be used in solar and wind power systems for efficient power conversion.

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDMS86200DC?

    The maximum drain to source voltage (VDS) is 150 V.

  2. What is the maximum drain current (ID) of the FDMS86200DC?

    The maximum drain current (ID) is 40 A.

  3. What is the typical on-state resistance (rDS(on)) at VGS = 10 V and ID = 9.3 A?

    The typical on-state resistance (rDS(on)) is 14 mΩ, with a maximum of 17 mΩ.

  4. What is the package type of the FDMS86200DC?

    The package type is DUAL COOL® Top Side Cooling DFN8.

  5. What are the key features of the Shielded Gate technology in the FDMS86200DC?

    The Shielded Gate technology enhances switching performance and reduces on-state resistance.

  6. What are some typical applications of the FDMS86200DC?

    Typical applications include power management, industrial automation, automotive systems, and renewable energy systems.

  7. What is the forward transconductance (gFS) at VDS = 10 V and ID = 9.3 A?

    The forward transconductance (gFS) is 32 S.

  8. What are the input, output, and reverse transfer capacitances of the FDMS86200DC?

    The input capacitance (Ciss) is 2110-2955 pF, the output capacitance (Coss) is 205-290 pF, and the reverse transfer capacitance (Crss) is 8.1-15 pF.

  9. What is the gate resistance (Rg) of the FDMS86200DC?

    The gate resistance (Rg) is 0.1-3.0 Ω.

  10. What are the turn-on and turn-off delay times of the FDMS86200DC?

    The turn-on delay time (td(on)) is 16-29 ns, and the turn-off delay time (td(off)) is 23-37 ns.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):150 V
Current - Continuous Drain (Id) @ 25°C:9.3A (Ta), 28A (Tc)
Drive Voltage (Max Rds On, Min Rds On):6V, 10V
Rds On (Max) @ Id, Vgs:17mOhm @ 9.3A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:42 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:2955 pF @ 75 V
FET Feature:- 
Power Dissipation (Max):3.2W (Ta), 125W (Tc)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:8-PQFN (5x6)
Package / Case:8-PowerTDFN
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Similar Products

Part Number FDMS86200DC FDMS86300DC FDMS86500DC
Manufacturer onsemi onsemi onsemi
Product Status Active Active Active
FET Type N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 150 V 80 V 60 V
Current - Continuous Drain (Id) @ 25°C 9.3A (Ta), 28A (Tc) 24A (Ta), 76A (Tc) 29A (Ta), 108A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 6V, 10V 8V, 10V 8V, 10V
Rds On (Max) @ Id, Vgs 17mOhm @ 9.3A, 10V 3.1mOhm @ 24A, 10V 2.3mOhm @ 29A, 10V
Vgs(th) (Max) @ Id 4V @ 250µA 4.5V @ 250µA 4.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 42 nC @ 10 V 101 nC @ 10 V 107 nC @ 10 V
Vgs (Max) ±20V ±20V ±20V
Input Capacitance (Ciss) (Max) @ Vds 2955 pF @ 75 V 7005 pF @ 40 V 7680 pF @ 30 V
FET Feature - - -
Power Dissipation (Max) 3.2W (Ta), 125W (Tc) 3.2W (Ta), 125W (Tc) 3.2W (Ta), 125W (Tc)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount
Supplier Device Package 8-PQFN (5x6) 8-PQFN (5x6) 8-PQFN (5x6)
Package / Case 8-PowerTDFN 8-PowerTDFN 8-PowerTDFN

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