FDMC86248
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onsemi FDMC86248

Manufacturer No:
FDMC86248
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N CH 150V 3.4A POWER33
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDMC86248 is an N-Channel MOSFET produced by onsemi, utilizing their advanced POWERTRENCH process. This technology is designed to minimize on-state resistance while maintaining superior switching performance. The MOSFET is packaged in a PQFN8 (3.3x3.3, 0.65P) case, which is Pb-free, halide-free, and RoHS compliant. It is suitable for high-efficiency applications requiring low on-state resistance and robust thermal performance.

Key Specifications

Parameter Value Unit
VDS (Drain to Source Voltage) 150 V
VGS (Gate to Source Voltage) ±20 V
ID (Drain Current) - Continuous (TC = 25°C) 13 A
ID (Drain Current) - Continuous (TA = 25°C) 3.4 A
ID (Drain Current) - Pulsed 15 A
EAS (Single Pulse Avalanche Energy) 37 mJ
PD (Power Dissipation) - TC = 25°C 36 W
PD (Power Dissipation) - TA = 25°C 2.3 W
TJ, TSTG (Operating and Storage Junction Temperature Range) -55 to +150 °C
RθJC (Thermal Resistance, Junction to Case) 3.4 °C/W
RθJA (Thermal Resistance, Junction to Ambient) 53 °C/W
RDS(on) (Static Drain to Source On Resistance) at VGS = 10 V, ID = 3.4 A 90
RDS(on) (Static Drain to Source On Resistance) at VGS = 6 V, ID = 2.9 A 125

Key Features

  • Advanced POWERTRENCH process for low RDS(on) and high efficiency
  • Maximum RDS(on) of 90 mΩ at VGS = 10 V, ID = 3.4 A and 125 mΩ at VGS = 6 V, ID = 2.9 A
  • 100% UIL tested
  • Pb-free, halide-free, and RoHS compliant
  • High thermal performance with RθJC of 3.4 °C/W and RθJA of 53 °C/W

Applications

  • Primary MOSFET
  • MV synchronous rectifier

Q & A

  1. What is the maximum drain to source voltage (VDS) of the FDMC86248 MOSFET?

    The maximum drain to source voltage (VDS) is 150 V.

  2. What is the maximum continuous drain current (ID) at TC = 25°C?

    The maximum continuous drain current (ID) at TC = 25°C is 13 A.

  3. What is the thermal resistance from junction to case (RθJC) and junction to ambient (RθJA)?

    The thermal resistance from junction to case (RθJC) is 3.4 °C/W, and from junction to ambient (RθJA) is 53 °C/W.

  4. Is the FDMC86248 MOSFET RoHS compliant?
  5. What are the typical applications of the FDMC86248 MOSFET?

    The FDMC86248 MOSFET is typically used as a primary MOSFET and in MV synchronous rectifier applications.

  6. What is the maximum gate to source voltage (VGS)?

    The maximum gate to source voltage (VGS) is ±20 V.

  7. What is the single pulse avalanche energy (EAS) of the FDMC86248 MOSFET?

    The single pulse avalanche energy (EAS) is 37 mJ.

  8. What is the package type of the FDMC86248 MOSFET?

    The FDMC86248 MOSFET is packaged in a PQFN8 (3.3x3.3, 0.65P) case.

  9. What is the maximum power dissipation (PD) at TA = 25°C?

    The maximum power dissipation (PD) at TA = 25°C is 2.3 W.

  10. What is the operating and storage junction temperature range (TJ, TSTG)?

    The operating and storage junction temperature range (TJ, TSTG) is -55 to +150 °C.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):150 V
Current - Continuous Drain (Id) @ 25°C:3.4A (Ta)
Drive Voltage (Max Rds On, Min Rds On):6V, 10V
Rds On (Max) @ Id, Vgs:90mOhm @ 3.4A, 10V
Vgs(th) (Max) @ Id:4V @ 250mA
Gate Charge (Qg) (Max) @ Vgs:9 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:525 pF @ 75 V
FET Feature:- 
Power Dissipation (Max):2.3W (Ta), 36W (Tc)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:Power33
Package / Case:8-PowerTDFN
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Similar Products

Part Number FDMC86248 FDMC86240 FDMC86244
Manufacturer onsemi onsemi onsemi
Product Status Active Active Active
FET Type N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 150 V 150 V 150 V
Current - Continuous Drain (Id) @ 25°C 3.4A (Ta) 4.6A (Ta), 16A (Tc) 2.8A (Ta), 9.4A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 6V, 10V 6V, 10V 6V, 10V
Rds On (Max) @ Id, Vgs 90mOhm @ 3.4A, 10V 51mOhm @ 4.6A, 10V 134mOhm @ 2.8A, 10V
Vgs(th) (Max) @ Id 4V @ 250mA 4V @ 250µA 4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 9 nC @ 10 V 15 nC @ 10 V 5.9 nC @ 10 V
Vgs (Max) ±20V ±20V ±20V
Input Capacitance (Ciss) (Max) @ Vds 525 pF @ 75 V 905 pF @ 75 V 345 pF @ 75 V
FET Feature - - -
Power Dissipation (Max) 2.3W (Ta), 36W (Tc) 2.3W (Ta), 40W (Tc) 2.3W (Ta), 26W (Tc)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount
Supplier Device Package Power33 8-MLP (3.3x3.3) 8-MLP (3.3x3.3)
Package / Case 8-PowerTDFN 8-PowerWDFN 8-PowerWDFN

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