FDB86363-F085
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onsemi FDB86363-F085

Manufacturer No:
FDB86363-F085
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET N-CH 80V 110A D2PAK
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDB86363-F085 is a high-performance N-Channel MOSFET produced by onsemi, designed for demanding applications requiring high current handling and low on-resistance. This device is part of the POWERTRENCH® family, known for its advanced trench technology that enhances power density and efficiency. The FDB86363-F085 is AEC-Q101 qualified and PPAP capable, making it suitable for automotive and other high-reliability applications.

Key Specifications

Parameter Test Conditions Min. Typ. Max. Units
VDSS (Drain-to-Source Voltage) - - - 80 V
VGS (Gate-to-Source Voltage) - - - ±20 V
ID (Drain Current) - Continuous VGS = 10 V, TC = 25°C - - 110 A
ID (Drain Current) - Pulsed TC = 25°C - - See Figure 4 A
EAS (Single Pulse Avalanche Energy) Starting TJ = 25°C, L = 0.25 mH, IAS = 64 A, VDD = 80 V - - 512 mJ
PD (Power Dissipation) - - - 300 W
TJ, TSTG (Operating and Storage Temperature) - -55 - 175 °C
RθJC (Thermal Resistance, Junction to Case) - - - 0.5 °C/W
RθJA (Maximum Thermal Resistance, Junction to Ambient) - - - 43 °C/W
RDS(on) (Drain-to-Source On-Resistance) ID = 80 A, VGS = 10 V, TJ = 25°C 2.0 2.4 3.8 mΩ
Qg(TOT) (Total Gate Charge) VGS = 0 V to 10 V, VDD = 64 V, ID = 80 A 131 - 150 nC

Key Features

  • Typical RDS(on) = 2.0 mΩ at VGS = 10 V, ID = 80 A
  • Typical Qg(tot) = 131 nC at VGS = 10 V, ID = 80 A
  • UIS Capability
  • AEC-Q101 Qualified and PPAP Capable
  • Pb-Free, Halide Free, and RoHS Compliant

Applications

  • Automotive Engine Control
  • Power Train Management
  • Solenoid and Motor Drivers
  • Integrated Starter/Alternator
  • Primary Switch for 12 V Systems

Q & A

  1. What is the maximum drain-to-source voltage (VDSS) of the FDB86363-F085?

    The maximum drain-to-source voltage (VDSS) is 80 V.

  2. What is the typical on-resistance (RDS(on)) of the FDB86363-F085?

    The typical on-resistance (RDS(on)) is 2.0 mΩ at VGS = 10 V, ID = 80 A.

  3. What is the maximum continuous drain current (ID) of the FDB86363-F085?

    The maximum continuous drain current (ID) is 110 A at VGS = 10 V, TC = 25°C.

  4. Is the FDB86363-F085 AEC-Q101 qualified?
  5. What are the typical gate charge characteristics of the FDB86363-F085?

    The typical total gate charge (Qg(TOT)) is 131 nC at VGS = 0 V to 10 V, VDD = 64 V, ID = 80 A.

  6. What are the thermal resistance characteristics of the FDB86363-F085?

    The thermal resistance from junction to case (RθJC) is 0.5 °C/W, and the maximum thermal resistance from junction to ambient (RθJA) is 43 °C/W.

  7. What are the common applications of the FDB86363-F085?
  8. Is the FDB86363-F085 Pb-Free and RoHS compliant?
  9. What is the package type of the FDB86363-F085?

    The package type is D2PAK-3 (TO-263, 3-lead).

  10. What are the switching characteristics of the FDB86363-F085?

    The device has specified turn-on and turn-off times, delays, and rise and fall times, such as ton = 231 ns, td(on) = 38 ns, tr = 129 ns, td(off) = 64 ns, tf = 40 ns, and toff = 135 ns.

Product Attributes

FET Type:N-Channel
Technology:MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):80 V
Current - Continuous Drain (Id) @ 25°C:110A (Tc)
Drive Voltage (Max Rds On, Min Rds On):10V
Rds On (Max) @ Id, Vgs:2.4mOhm @ 80A, 10V
Vgs(th) (Max) @ Id:4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:150 nC @ 10 V
Vgs (Max):±20V
Input Capacitance (Ciss) (Max) @ Vds:10000 pF @ 40 V
FET Feature:- 
Power Dissipation (Max):300W (Tc)
Operating Temperature:-55°C ~ 175°C (TJ)
Mounting Type:Surface Mount
Supplier Device Package:D²PAK (TO-263)
Package / Case:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
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Similar Products

Part Number FDB86363-F085 FDB86366-F085 FDBL86363-F085 FDB86563-F085 FDB86360-F085
Manufacturer onsemi onsemi onsemi onsemi onsemi
Product Status Active Active Active Active Active
FET Type N-Channel N-Channel N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 80 V 80 V 80 V 60 V 80 V
Current - Continuous Drain (Id) @ 25°C 110A (Tc) 110A (Tc) 240A (Tc) 110A (Tc) 110A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 10V 10V 10V 10V 10V
Rds On (Max) @ Id, Vgs 2.4mOhm @ 80A, 10V 3.6mOhm @ 80A, 10V 2mOhm @ 80A, 10V 1.8mOhm @ 80A, 10V 1.8mOhm @ 80A, 10V
Vgs(th) (Max) @ Id 4V @ 250µA 4V @ 250µA 4V @ 250µA 4V @ 250µA 4.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 150 nC @ 10 V 112 nC @ 10 V 169 nC @ 10 V 163 nC @ 10 V 253 nC @ 10 V
Vgs (Max) ±20V ±20V ±20V ±20V ±20V
Input Capacitance (Ciss) (Max) @ Vds 10000 pF @ 40 V 6280 pF @ 40 V 10000 pF @ 40 V 10100 pF @ 30 V 14600 pF @ 25 V
FET Feature - - - - -
Power Dissipation (Max) 300W (Tc) 176W (Tj) 357W (Tj) 333W (Tc) 333W (Tc)
Operating Temperature -55°C ~ 175°C (TJ) -55°C ~ 175°C (TJ) -55°C ~ 175°C (TJ) -55°C ~ 175°C (TJ) -55°C ~ 175°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package D²PAK (TO-263) D²PAK (TO-263) 8-HPSOF D²PAK (TO-263) D²PAK (TO-263)
Package / Case TO-263-3, D²Pak (2 Leads + Tab), TO-263AB TO-263-3, D²Pak (2 Leads + Tab), TO-263AB 8-PowerSFN TO-263-3, D²Pak (2 Leads + Tab), TO-263AB TO-263-3, D²Pak (2 Leads + Tab), TO-263AB

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