XC7Z100-2FFG900I
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AMD Xilinx XC7Z100-2FFG900I

Manufacturer No:
XC7Z100-2FFG900I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC SOC CORTEX-A9 800MHZ 900FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The XC7Z100-2FFG900I is a System-on-Chip (SoC) from AMD Xilinx, part of the Zynq-7000 family. This SoC integrates a dual-core ARM Cortex-A9 processor with Xilinx 7-series Field-Programmable Gate Array (FPGA) logic. This integration provides a powerful platform for embedded processing, combining the flexibility of FPGA fabric with the processing capabilities of ARM cores.

Key Specifications

SpecificationDetails
FPGA DeviceXC7Z100-2FFG900I
ProcessorDual-core ARM Cortex-A9
Memory1 GByte DDR3, 32bit; 64MB QSPI Flash; 8GB eMMC
Logic Cells444K
Transceivers16 GTX lanes
Interfaces2 x Gigabit Ethernet transceiver PHY, USB 2.0, PCIe 2.0 x 8, UART, TF Card Slot, FMC Expansion Interface
SizeVaries by module (e.g., 8.5 x 8.5 cm for some modules)

Key Features

  • Embedded processing with dual-core ARM Cortex-A9 processors
  • Integrated Xilinx 7-series FPGA fabric
  • High-speed interfaces including PCIe 2.0 x 8, Gigabit Ethernet, and USB 2.0
  • Support for various memory types: DDR3, QSPI Flash, and eMMC
  • FMC expansion interface for additional functionality
  • Pre-verified reference designs for ease of development

Applications

The XC7Z100-2FFG900I SoC is suitable for a wide range of applications, including:

  • High-speed data exchange and processing
  • Data storage and management
  • Video transmission and processing
  • Optical fiber communication
  • Ethernet communication
  • Industrial control systems

Q & A

  1. What is the XC7Z100-2FFG900I?

    The XC7Z100-2FFG900I is a System-on-Chip (SoC) from AMD Xilinx, integrating a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic.

  2. What type of processor does it use?

    Dual-core ARM Cortex-A9 processor.

  3. What are the memory specifications?

    1 GByte DDR3, 32bit; 64MB QSPI Flash; 8GB eMMC.

  4. What high-speed interfaces are supported?

    PCIe 2.0 x 8, Gigabit Ethernet, USB 2.0, and others.

  5. What is the FMC expansion interface used for?

    The FMC (FPGA Mezzanine Card) expansion interface allows for additional functionality and customization.

  6. What are some common applications for this SoC?

    High-speed data exchange, data storage, video transmission, optical fiber communication, Ethernet communication, and industrial control.

  7. Does it support pre-verified reference designs?

    Yes, it supports pre-verified reference designs to ease the development process.

  8. What is the size of the module?

    The size varies by module but can be as large as 8.5 x 8.5 cm for some configurations.

  9. How many logic cells does the FPGA have?

    444K logic cells.

  10. What type of transceivers are included?

    16 GTX lanes.

Product Attributes

Architecture:MCU, FPGA
Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:- 
RAM Size:256KB
Peripherals:DMA
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:800MHz
Primary Attributes:Kintex™-7 FPGA, 444K Logic Cells
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:900-BBGA, FCBGA
Supplier Device Package:900-FCBGA (31x31)
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Similar Products

Part Number XC7Z100-2FFG900I XC7Z100-L2FFG900I XC7Z100-1FFG900I XC7Z100-2FF900I
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size - - - -
RAM Size 256KB 256KB 256KB 256KB
Peripherals DMA DMA DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz 800MHz 667MHz 800MHz
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells Kintex™-7 FPGA, 444K Logic Cells Kintex™-7 FPGA, 444K Logic Cells Kintex™-7 FPGA, 444K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31)

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