XC7Z045-2FFG900I
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AMD Xilinx XC7Z045-2FFG900I

Manufacturer No:
XC7Z045-2FFG900I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC SOC CORTEX-A9 800MHZ 900FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The AMD/Xilinx Zynq-7000 SoC XC7Z045-2FFG900I is a high-performance system-on-chip (SoC) that integrates both programmable logic (PL) and processing system (PS) components. This SoC is part of the Zynq-7000 family, known for its versatility and robust feature set. The XC7Z045-2FFG900I model specifically combines the power of dual ARM Cortex-A9 MPCore processors with extensive programmable logic capabilities, making it suitable for a wide range of applications requiring high processing power and flexibility.

Key Specifications

Specification Value
Device Name XC7Z045-2FFG900I
Speed Grade -2
Package Type FFG900
Temperature Range Industrial (-40°C to +85°C)
Processors 2 x ARM Cortex-A9 MPCore
Memory 1 GByte DDR3 SDRAM, 32 MByte QSPI Flash, 8 GByte e.MMC (optional up to 64 GByte)
Transceivers 16 GTX high-performance transceiver lanes
Interfaces 2 x Gigabit Ethernet transceiver PHY, 2 x Hi-Speed USB2.0 ULPI Transceiver
FPGA I/Os 254 FPGA I/O's (125 LVDS pairs)
Form Factor 8.5 x 8.5 cm

Key Features

  • Rugged design for shock and high vibration resistance
  • Dual ARM Cortex-A9 MPCore processors for high processing power
  • Extensive programmable logic capabilities with 16 GTX high-performance transceiver lanes
  • 1 GByte DDR3 SDRAM and 32 MByte QSPI Flash memory for robust memory requirements
  • Optional up to 64 GByte e.MMC storage
  • 2 x Gigabit Ethernet transceiver PHY and 2 x Hi-Speed USB2.0 ULPI Transceiver for high-speed connectivity
  • 254 FPGA I/O's (125 LVDS pairs) available on board-to-board connectors
  • On-board high-efficiency DC-DC converters and system management with power sequencing
  • eFUSE and AES bit-stream encryption for security

Applications

  • Industrial automation and control systems
  • Embedded systems requiring high processing power and flexibility
  • Medical imaging and diagnostic equipment
  • Aerospace and defense applications
  • High-performance computing and data processing systems
  • Automotive systems, especially those requiring robust and reliable performance

Q & A

  1. What is the XC7Z045-2FFG900I SoC used for?

    The XC7Z045-2FFG900I SoC is used in applications requiring high processing power, extensive programmable logic, and robust memory and interface capabilities.

  2. What are the key components of the XC7Z045-2FFG900I?

    The key components include dual ARM Cortex-A9 MPCore processors, 1 GByte DDR3 SDRAM, 32 MByte QSPI Flash, and 16 GTX high-performance transceiver lanes.

  3. What is the operating temperature range of the XC7Z045-2FFG900I?

    The operating temperature range is industrial, spanning from -40°C to +85°C.

  4. What interfaces are available on the XC7Z045-2FFG900I?

    The SoC includes 2 x Gigabit Ethernet transceiver PHY, 2 x Hi-Speed USB2.0 ULPI Transceiver, and extensive FPGA I/Os.

  5. Is the XC7Z045-2FFG900I rugged and vibration-resistant?
  6. What is the form factor of the XC7Z045-2FFG900I module?

    The module has a form factor of 8.5 x 8.5 cm.

  7. What security features are included in the XC7Z045-2FFG900I?

    The SoC includes eFUSE and AES bit-stream encryption for enhanced security.

  8. What software is recommended for developing with the XC7Z045-2FFG900I?

    Vivado ML Enterprise Edition is recommended for development.

  9. Is there any development support available for the XC7Z045-2FFG900I?
  10. What are some typical applications of the XC7Z045-2FFG900I?

Product Attributes

Architecture:MCU, FPGA
Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:- 
RAM Size:256KB
Peripherals:DMA
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:800MHz
Primary Attributes:Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:900-BBGA, FCBGA
Supplier Device Package:900-FCBGA (31x31)
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Part Number XC7Z045-2FFG900I XC7Z045-L2FFG900I XC7Z035-2FFG900I XC7Z045-1FFG900I XC7Z045-2FF900I XC7Z045-2FFG900E
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size - - - - - -
RAM Size 256KB 256KB 256KB 256KB 256KB 256KB
Peripherals DMA DMA DMA DMA DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz 800MHz 800MHz 667MHz 800MHz 800MHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells Kintex™-7 FPGA, 350K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 350K Logic Cells Kintex™-7 FPGA, 350K Logic Cells Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31)

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