XC7Z030-2FFG676I
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AMD Xilinx XC7Z030-2FFG676I

Manufacturer No:
XC7Z030-2FFG676I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC SOC CORTEX-A9 800MHZ 676FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XC7Z030-2FFG676I is a System-on-Chip (SoC) FPGA from AMD Xilinx, part of the Zynq-7000 family. This device integrates a dual-core ARM Cortex-A9 processor with a Kintex-7 FPGA, offering a powerful and flexible solution for a wide range of applications. The SoC combines the benefits of programmable logic with the processing capabilities of a high-performance ARM processor, making it ideal for complex system designs.

Key Specifications

AttributeSpecification
Part NumberXC7Z030-2FFG676I
ManufacturerAMD Xilinx
ArchitectureMCU, FPGA
Core ProcessorDual ARM Cortex-A9 MPCore with CoreSight
MCU RAM256KB
PeripheralsDMA
ConnectivityCAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex-7 FPGA, 125K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)

Key Features

  • Dual-Core ARM Cortex-A9 Processor: Provides high-performance processing capabilities.
  • Kintex-7 FPGA: Offers 125K logic cells for programmable logic.
  • Integrated Peripherals: Includes DMA, CAN, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
  • High-Speed Processing: Operates at 800MHz.
  • Flexible Connectivity: Supports a variety of communication protocols.
  • Wide Operating Temperature Range: From -40°C to 100°C.

Applications

The XC7Z030-2FFG676I is suitable for a variety of applications, including:

  • Embedded Systems: Ideal for complex embedded systems requiring both processing and programmable logic.
  • Industrial Automation: Used in control systems, robotics, and other industrial automation applications.
  • Aerospace and Defense: Suitable for high-reliability and high-performance applications in the aerospace and defense sectors.
  • Medical Devices: Can be used in medical imaging, diagnostic equipment, and other medical devices requiring advanced processing and logic.
  • Automotive Systems: Used in advanced driver-assistance systems (ADAS), infotainment systems, and other automotive applications.

Q & A

  1. What is the XC7Z030-2FFG676I?

    The XC7Z030-2FFG676I is a System-on-Chip (SoC) FPGA from AMD Xilinx, integrating a dual-core ARM Cortex-A9 processor with a Kintex-7 FPGA.

  2. What are the key features of the XC7Z030-2FFG676I?

    Key features include a dual-core ARM Cortex-A9 processor, Kintex-7 FPGA with 125K logic cells, integrated peripherals, and high-speed processing at 800MHz.

  3. What are the primary applications of the XC7Z030-2FFG676I?

    It is used in embedded systems, industrial automation, aerospace and defense, medical devices, and automotive systems.

  4. What is the operating temperature range of the XC7Z030-2FFG676I?

    The operating temperature range is from -40°C to 100°C.

  5. What package type does the XC7Z030-2FFG676I come in?

    The device comes in a 676-BBGA, FCBGA package.

  6. How much MCU RAM does the XC7Z030-2FFG676I have?

    The device has 256KB of MCU RAM.

  7. What connectivity options are available on the XC7Z030-2FFG676I?

    It supports CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.

  8. Is the XC7Z030-2FFG676I suitable for high-reliability applications?

    Yes, it is suitable for high-reliability applications, including those in the aerospace and defense sectors.

  9. Can the XC7Z030-2FFG676I be used in medical devices?

    Yes, it can be used in medical devices such as medical imaging and diagnostic equipment.

  10. What is the clock speed of the ARM Cortex-A9 processor in the XC7Z030-2FFG676I?

    The clock speed is 800MHz.

Product Attributes

Architecture:MCU, FPGA
Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:- 
RAM Size:256KB
Peripherals:DMA
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:800MHz
Primary Attributes:Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:676-BBGA, FCBGA
Supplier Device Package:676-FCBGA (27x27)
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Part Number XC7Z030-2FFG676I XC7Z030-L2FFG676I XC7Z035-2FFG676I XC7Z030-1FFG676I XC7Z030-2FBG676I XC7Z030-2FF676I XC7Z030-2FFG676E
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size - - - - - - -
RAM Size 256KB 256KB 256KB 256KB 256KB 256KB 256KB
Peripherals DMA DMA DMA DMA DMA DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz 800MHz 800MHz 667MHz 800MHz 800MHz 800MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27)

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