XC7K160T-2FFG676I
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AMD Xilinx XC7K160T-2FFG676I

Manufacturer No:
XC7K160T-2FFG676I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 400 I/O 676FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XC7K160T-2FFG676I is a high-performance field-programmable gate array (FPGA) designed by AMD Xilinx. It belongs to the Kintex-7 family and is optimized for demanding applications in various industries such as telecommunications, aerospace, and defense. This FPGA features extensive programmability, advanced processing capabilities, and versatile I/O options, making it suitable for high-speed data processing, signal processing, and interface applications.

Key Specifications

Specification Value
Logic Cells 162,240
On-Chip Memory 11,700 KB
DSP Slices 600
High-Speed Transceivers 8 (GTX)
I/O Pins 400
Operating Voltage 1.0V
Operating Temperature Range -40°C to +100°C
Package FFG-676 (676-pin BGA)
Process Technology 28 nm, high-k metal gate (HKMG)

Key Features

  • High Logic Density: Offers a large number of logic cells for complex design implementation.
  • Large On-Chip Memory: Provides ample storage for data processing and buffering.
  • Advanced DSP Slices: Suited for demanding digital signal processing tasks with 25 x 18 multipliers, 48-bit accumulators, and pre-adders.
  • High-Speed Transceivers: Enables high-speed data communication between FPGAs and external devices, supporting rates up to 28.05 Gb/s.
  • Low Operating Voltage: Operates at a low power supply voltage for energy efficiency.
  • Wide Temperature Range: Can function in varied environmental conditions.
  • High-Performance SelectIO Technology: Supports DDR3 interfaces up to 1,866 Mb/s.
  • User Configurable Analog Interface (XADC): Incorporates dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
  • Powerful Clock Management Tiles (CMT): Combines phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
  • Integrated Block for PCI Express (PCIe): Supports up to x8 Gen3 Endpoint and Root Port designs.

Applications

  • Telecommunications: Ideal for 3G and 4G wireless infrastructure, and other high-speed communication systems.
  • Aerospace and Defense: Used in various military and aerospace applications requiring high reliability and performance.
  • Cloud Computing: Supports cloud infrastructure with its high-performance and low-power consumption.
  • Consumer Electronics: Suitable for flat panel displays, video over IP solutions, and other consumer electronics requiring advanced signal processing.
  • Industrial Control: Used in industrial automation and control systems that demand high-speed data processing and reliable operation.
  • Internet of Things (IoT): Supports IoT applications with its versatile I/O options and low power consumption.
  • Medical Equipment: Applied in medical devices that require advanced signal processing and high reliability.

Q & A

  1. What is the XC7K160T-2FFG676I FPGA used for?

    The XC7K160T-2FFG676I FPGA is used for demanding applications in various industries such as telecommunications, aerospace, defense, cloud computing, and consumer electronics, requiring high-speed data processing, signal processing, and interface capabilities.

  2. What are the key specifications of the XC7K160T-2FFG676I FPGA?

    The key specifications include 162,240 logic cells, 11,700 KB of on-chip memory, 600 DSP slices, 8 high-speed GTX transceivers, and 400 I/O pins, operating at 1.0V with a temperature range of -40°C to +100°C.

  3. What process technology is used in the XC7K160T-2FFG676I FPGA?

    The XC7K160T-2FFG676I FPGA is built on a 28 nm, high-k metal gate (HKMG) process technology.

  4. What are the advanced features of the XC7K160T-2FFG676I FPGA?

    Advanced features include high-performance SelectIO technology, user-configurable analog interfaces, powerful clock management tiles, and integrated blocks for PCI Express.

  5. Can the XC7K160T-2FFG676I FPGA be used in harsh environmental conditions?

    Yes, the XC7K160T-2FFG676I FPGA can function in a wide temperature range of -40°C to +100°C.

  6. What are the typical applications of the XC7K160T-2FFG676I FPGA in telecommunications?

    In telecommunications, it is ideal for 3G and 4G wireless infrastructure and other high-speed communication systems.

  7. How does the XC7K160T-2FFG676I compare to other FPGAs in the Kintex-7 family?

    The XC7K160T-2FFG676I provides a balanced mix of logic resources, processing power, and I/O interfaces compared to other FPGAs in the Kintex-7 family, making it a versatile choice for applications requiring a combination of performance and flexibility.

  8. Can the XC7K160T-2FFG676I FPGA be interchanged with the XC7K325T-2FFG676I?

    No, the XC7K160T-2FFG676I and XC7K325T-2FFG676I have different specifications and are not interchangeable. The XC7K325T-2FFG676I offers higher logic density, more on-chip memory, additional DSP slices, and increased transceiver count.

  9. What is the packaging of the XC7K160T-2FFG676I FPGA?

    The XC7K160T-2FFG676I FPGA is housed in a 676-pin BGA package (FFG-676).

  10. Does the XC7K160T-2FFG676I FPGA support PCI Express?

    Yes, the XC7K160T-2FFG676I FPGA supports up to x8 Gen3 Endpoint and Root Port designs for PCI Express.

Product Attributes

Number of LABs/CLBs:12675
Number of Logic Elements/Cells:162240
Total RAM Bits:11980800
Number of I/O:400
Number of Gates:- 
Voltage - Supply:0.97V ~ 1.03V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:676-BBGA, FCBGA
Supplier Device Package:676-FCBGA (27x27)
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Similar Products

Part Number XC7K160T-2FFG676I XC7K160T-L2FFG676I XC7K160T-1FFG676I XC7K160T-2FBG676I XC7K160T-2FF676I XC7K160T-2FFG676C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active Active
Number of LABs/CLBs 12675 12675 12675 12675 12675 12675
Number of Logic Elements/Cells 162240 162240 162240 162240 162240 162240
Total RAM Bits 11980800 11980800 11980800 11980800 11980800 11980800
Number of I/O 400 400 400 400 400 400
Number of Gates - - - - - -
Voltage - Supply 0.97V ~ 1.03V 0.87V ~ 0.93V 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27)

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