10AX027E3F29I2SG
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Intel 10AX027E3F29I2SG

Manufacturer No:
10AX027E3F29I2SG
Manufacturer:
Intel
Package:
Tray
Description:
IC FPGA 360 I/O 780FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The Intel Arria 10 GX FPGA, model 10AX027E3F29I2SG, is a high-performance and power-efficient field-programmable gate array (FPGA) from the Arria 10 device family. These FPGAs are fabricated using a 20 nm process technology, offering a balance between performance and power consumption. The Arria 10 GX series is designed to meet the demands of mid-range FPGA applications, providing advanced features and capabilities for a wide range of use cases.

Key Specifications

Specification Value
Device Family Arria 10 GX
Process Technology 20 nm
Maximum LEs (Logic Elements) 270,000
Maximum M9K Memory Blocks 1,518
Maximum M20K Memory Blocks 0
Maximum DSP Blocks 1,518
Maximum PLLs (Phase-Locked Loops) 12
Package Type FG896 (29x29 mm)
Operating Temperature Range -40°C to 100°C (Industrial Grade)

Key Features

  • High Performance and Low Power Consumption: The 10AX027E3F29I2SG offers high performance with reduced power consumption, making it suitable for a variety of applications.
  • Advanced DSP Capabilities: Equipped with a significant number of DSP blocks, this FPGA is ideal for digital signal processing tasks.
  • High-Speed Transceivers: Supports high-speed transceivers for high-bandwidth data transfer.
  • Rich Set of Hard IP Cores: Includes hard IP cores for PCIe, 10GbE, and other high-speed interfaces.
  • Programmable Logic: Offers a large number of logic elements and memory blocks for flexible and customizable designs.

Applications

  • Wireless and Wired Communications: Suitable for baseband processing, radio heads, and other communication infrastructure.
  • Data Center and Cloud Computing: Used in network processing, storage, and other data center applications.
  • Industrial Automation and Control: Ideal for control systems, motor control, and other industrial automation tasks.
  • Aerospace and Defense: Applied in various military and aerospace systems requiring high reliability and performance.
  • Medical Imaging and Diagnostics: Used in medical imaging equipment and diagnostic systems.

Q & A

  1. What is the process technology used in the 10AX027E3F29I2SG FPGA?

    The 10AX027E3F29I2SG FPGA is fabricated using a 20 nm process technology.

  2. How many logic elements does the 10AX027E3F29I2SG FPGA have?

    The 10AX027E3F29I2SG FPGA has up to 270,000 logic elements.

  3. What is the maximum number of DSP blocks available in this FPGA?

    The maximum number of DSP blocks in the 10AX027E3F29I2SG FPGA is 1,518.

  4. What are the common applications of the Arria 10 GX FPGAs?

    Common applications include wireless and wired communications, data center and cloud computing, industrial automation, aerospace and defense, and medical imaging.

  5. What is the operating temperature range for the 10AX027E3F29I2SG FPGA?

    The operating temperature range is -40°C to 100°C for the industrial grade.

  6. Does the 10AX027E3F29I2SG support high-speed transceivers?
  7. What package type is used for the 10AX027E3F29I2SG FPGA?

    The package type is FG896 (29x29 mm).

  8. Are there any hard IP cores available in this FPGA?
  9. Where can I find the datasheet for the 10AX027E3F29I2SG FPGA?

    The datasheet can be downloaded from official Intel resources or from distributors like Digi-Key and Lansheng Technology.

  10. What is the typical use case for the Arria 10 GX FPGAs in industrial automation?

    In industrial automation, these FPGAs are used for control systems, motor control, and other automation tasks requiring high performance and reliability.

Product Attributes

Number of LABs/CLBs:101620
Number of Logic Elements/Cells:270000
Total RAM Bits:17870848
Number of I/O:360
Number of Gates:- 
Voltage - Supply:0.87V ~ 0.93V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:780-BBGA, FCBGA
Supplier Device Package:780-FBGA, FC (29x29)
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Similar Products

Part Number 10AX027E3F29I2SG 10AX022E3F29I2SG 10AX027E2F29I2SG 10AX027E3F27I2SG 10AX027E3F29E2SG 10AX027E3F29I2LG
Manufacturer Intel Intel Intel Intel Intel Intel
Product Status Active Active Active Active Active Active
Number of LABs/CLBs 101620 80330 101620 101620 101620 101620
Number of Logic Elements/Cells 270000 220000 270000 270000 270000 270000
Total RAM Bits 17870848 13752320 17870848 17870848 17870848 17870848
Number of I/O 360 288 360 240 360 360
Number of Gates - - - - - -
Voltage - Supply 0.87V ~ 0.93V 0.87V ~ 0.93V 0.87V ~ 0.98V 0.87V ~ 0.93V 0.87V ~ 0.93V 0.87V ~ 0.93V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Package / Case 780-BBGA, FCBGA 780-BBGA, FCBGA 780-BBGA, FCBGA 672-BBGA, FCBGA 780-BBGA, FCBGA 780-BBGA, FCBGA
Supplier Device Package 780-FBGA, FC (29x29) 780-FBGA, FC (29x29) 780-FBGA, FC (29x29) 672-FBGA, FC (27x27) 780-FBGA, FC (29x29) 780-FBGA, FC (29x29)

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