Overview
The AMD Xilinx Virtex UltraScale+ VU19P FPGA, specifically the XCVU19P-2FSVA3824E model, is a high-performance Field Programmable Gate Array designed to meet the demands of advanced ASIC and SoC technologies. This FPGA boasts the highest logic capacity, interconnect, and external memory bandwidth available, making it ideal for complex design emulation, prototyping, and test & measurement applications. With 9 million system logic cells and over 2,000 I/Os, it enables the implementation of larger-scale, more complex designs and provides extensive verification capabilities before tape-out.
Key Specifications
| Parameter | Value |
|---|---|
| System Logic Cells (K) | 8,938 |
| DSP Slices | 3,840 |
| Memory (Mb) | 224 |
| PCIe® Gen3x16/Gen4x8/CCIX | 8 |
| GTY/GTM Transceivers (32.75/58 Gb/s) | 80/0 |
| I/O | 2,072 |
Key Features
- Highest Logic Capacity: 9 million system logic cells enable the emulation and prototyping of larger-scale, more complex designs.
- I/O Capacity and Bandwidth: Over 2,000 I/Os and massive I/O bandwidth support multi-FPGA interconnect and various external memory types and rates.
- High-Speed Transceivers: 80 GTY (28 Gb/s) transceivers offer up to 4.5 Tb/s transceiver bandwidth, suitable for high port density test equipment and next-generation platforms.
- Superior Cooling: Lidless packaging provides an optimal cooling solution, allowing for extreme performance in thermally constrained environments.
Applications
- Emulation: Extensive verification of ASICs and SoCs before tape-out, utilizing the massive logic capacity and I/Os for design visibility and debugging.
- Prototyping: Accurate system modeling and fast verification of targeted designs, enabling real I/O traffic and software bring-up before physical part availability.
- Test & Measurement: Implementation of customized test logic and new protocols, supporting higher port density in test equipment and pushing performance in thermally constrained environments.
Q & A
- What is the logic cell capacity of the XCVU19P-2FSVA3824E FPGA?
The XCVU19P-2FSVA3824E FPGA has 9 million system logic cells.
- How many I/Os does the XCVU19P-2FSVA3824E FPGA support?
The FPGA supports over 2,072 I/Os.
- What is the transceiver bandwidth of the XCVU19P-2FSVA3824E FPGA?
The FPGA features 80 GTY transceivers with up to 4.5 Tb/s transceiver bandwidth.
- What are the primary applications of the XCVU19P-2FSVA3824E FPGA?
The primary applications include emulation, prototyping, and test & measurement.
- What is the significance of the lidless packaging in the XCVU19P-2FSVA3824E FPGA?
The lidless packaging provides an optimal cooling solution, allowing for extreme performance in thermally constrained environments.
- How many DSP slices are available in the XCVU19P-2FSVA3824E FPGA?
The FPGA includes 3,840 DSP slices.
- What types of memory does the XCVU19P-2FSVA3824E FPGA support?
The FPGA supports various external memory types and rates, with a total memory capacity of 224 Mb.
- Is the XCVU19P-2FSVA3824E FPGA suitable for high-speed data transfer applications?
Yes, it is suitable due to its high-speed transceivers and massive I/O bandwidth.
- What tools are used for software bring-up and custom feature implementation on the XCVU19P-2FSVA3824E FPGA?
The Vivado™ Design Suite and AMD tools are used for software bring-up and custom feature implementation.
- Is the XCVU19P-2FSVA3824E FPGA available for immediate purchase?
The availability may vary; it is listed as restricted availability on some platforms.
