XC3S2000-4FGG456I
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AMD Xilinx XC3S2000-4FGG456I

Manufacturer No:
XC3S2000-4FGG456I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 333 I/O 456FBGA
Delivery:
Payment:
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iso45001
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Product Introduction

Overview

The XC3S2000-4FGG456I is a Field Programmable Gate Array (FPGA) manufactured by AMD Xilinx. This device is part of the Spartan-3 series, known for its balance of performance, power, and cost. The Spartan-3 FPGAs are widely used in various applications requiring programmable logic, such as digital signal processing, embedded systems, and communication systems.

Key Specifications

SpecificationValue
ManufacturerAMD Xilinx
Package Type456-BBGA (Ball Grid Array)
Logic Cells2000
Operating Temperature-40°C to 100°C (Industrial Grade)
Supply Voltage1.2V (Core), 2.5V (I/O)
RoHS StatusRoHS3 Compliant
Memory216 Kbits of Block RAM

Key Features

  • High-performance logic fabric with up to 2000 logic cells.
  • Integrated block RAM for efficient data storage.
  • Support for multiple I/O standards, including LVCMOS, LVTTL, and LVDS.
  • Low power consumption, making it suitable for battery-powered devices.
  • Programmable via JTAG, ISP, or BPI interfaces.

Applications

  • Digital Signal Processing (DSP): Suitable for applications requiring complex signal processing such as audio and video processing.
  • Embedded Systems: Used in microcontrollers and other embedded systems for custom logic and control.
  • Communication Systems: Employed in various communication protocols and interfaces like Ethernet, USB, and UART.
  • Industrial Control: Used in industrial automation for control and monitoring systems.

Q & A

  1. What is the XC3S2000-4FGG456I? The XC3S2000-4FGG456I is a Field Programmable Gate Array (FPGA) from the Spartan-3 series by AMD Xilinx.
  2. What is the package type of the XC3S2000-4FGG456I? The package type is 456-BBGA (Ball Grid Array).
  3. What is the operating temperature range of the XC3S2000-4FGG456I? The operating temperature range is -40°C to 100°C (Industrial Grade).
  4. What is the supply voltage for the XC3S2000-4FGG456I? The supply voltage is 1.2V (Core) and 2.5V (I/O).
  5. Is the XC3S2000-4FGG456I RoHS compliant? Yes, it is RoHS3 compliant.
  6. How much block RAM does the XC3S2000-4FGG456I have? It has 216 Kbits of block RAM.
  7. What are some common applications of the XC3S2000-4FGG456I? Common applications include digital signal processing, embedded systems, communication systems, and industrial control.
  8. How is the XC3S2000-4FGG456I programmed? It can be programmed via JTAG, ISP, or BPI interfaces.
  9. What are the key features of the XC3S2000-4FGG456I? Key features include high-performance logic fabric, integrated block RAM, support for multiple I/O standards, low power consumption, and programmable interfaces.
  10. Where can I find more detailed specifications for the XC3S2000-4FGG456I? Detailed specifications can be found on the official AMD Xilinx website, as well as on distributor websites like Mouser, Digi-Key, and X-ON Electronics.

Product Attributes

Number of LABs/CLBs:5120
Number of Logic Elements/Cells:46080
Total RAM Bits:737280
Number of I/O:333
Number of Gates:2000000
Voltage - Supply:1.14V ~ 1.26V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:456-BBGA
Supplier Device Package:456-FBGA (23x23)
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Similar Products

Part Number XC3S2000-4FGG456I XC3S2000-4FG456I XC3S2000-4FGG456C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active
Number of LABs/CLBs 5120 5120 5120
Number of Logic Elements/Cells 46080 46080 46080
Total RAM Bits 737280 737280 737280
Number of I/O 333 333 333
Number of Gates 2000000 2000000 2000000
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Mounting Type Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 456-BBGA 456-BBGA 456-BBGA
Supplier Device Package 456-FBGA (23x23) 456-FBGA (23x23) 456-FBGA (23x23)

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