XC7K325T-2FFG900I
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AMD Xilinx XC7K325T-2FFG900I

Manufacturer No:
XC7K325T-2FFG900I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 500 I/O 900FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The AMD Xilinx XC7K325T-2FFG900I is a high-performance Field Programmable Gate Array (FPGA) from the Kintex-7 series. This device is designed to offer advanced capabilities in logic, memory, and interface integration, making it suitable for a wide range of applications requiring high-speed data processing and complex logic operations.

Key Specifications

Specification Value
Part Number XC7K325T-2FFG900I
Manufacturer / Brand AMD Xilinx
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 500 I/O 900FCBGA
Voltage - Supply 0.97 V ~ 1.03 V
Total RAM Bits 16404480
Supplier Device Package 900-FCBGA (31x31)
Series Kintex®-7
Package / Case 900-BBGA, FCBGA
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 326080
Number of LABs/CLBs 25475
Number of I/O 500
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 4 (72 Hours)

Key Features

  • High-Performance Logic: The XC7K325T-2FFG900I features 326,080 logic elements and 25,475 LABs/CLBs, enabling complex logic operations and high-speed data processing.
  • Memory Integration: It includes 16,404,480 total RAM bits, providing ample memory for various applications.
  • Interface Capabilities: The FPGA supports 500 I/O pins and is packaged in a 900-FCBGA, facilitating a wide range of interface options.
  • Operating Temperature Range: The device operates within a temperature range of -40°C to 100°C, making it suitable for various environmental conditions.
  • RoHS Compliance: The XC7K325T-2FFG900I is lead-free and RoHS compliant, ensuring environmental sustainability.

Applications

The AMD Xilinx XC7K325T-2FFG900I is versatile and can be used in several applications, including:

  • PCIe Data Acceleration: Ideal for high-speed data acceleration in PCIe-based systems.
  • Optical Fiber Communication: Supports high-speed optical fiber communication with its QSFP+ and SFP interfaces.
  • High-Speed Data Exchange and Storage: Suitable for applications requiring rapid data exchange and storage.
  • Video Image Acquisition and Transmission Processing: Used in video processing and transmission systems due to its high-performance capabilities.
  • Industrial Control: Can be integrated into industrial control systems for complex logic and high-speed data processing.

Q & A

  1. What is the part number of this FPGA?

    The part number of this FPGA is XC7K325T-2FFG900I.

  2. Who is the manufacturer of the XC7K325T-2FFG900I?

    The manufacturer is AMD Xilinx.

  3. What is the total number of RAM bits in the XC7K325T-2FFG900I?

    The total number of RAM bits is 16,404,480.

  4. What is the operating temperature range of the XC7K325T-2FFG900I?

    The operating temperature range is -40°C to 100°C (TJ).

  5. How many I/O pins does the XC7K325T-2FFG900I have?

    The XC7K325T-2FFG900I has 500 I/O pins.

  6. Is the XC7K325T-2FFG900I RoHS compliant?

    Yes, the XC7K325T-2FFG900I is lead-free and RoHS compliant.

  7. What is the package type of the XC7K325T-2FFG900I?

    The package type is 900-FCBGA (31x31).

  8. What are some common applications of the XC7K325T-2FFG900I?

    Common applications include PCIe data acceleration, optical fiber communication, high-speed data exchange and storage, video image acquisition and transmission processing, and industrial control.

  9. How many logic elements does the XC7K325T-2FFG900I have?

    The XC7K325T-2FFG900I has 326,080 logic elements.

  10. What is the moisture sensitivity level (MSL) of the XC7K325T-2FFG900I?

    The MSL is 4 (72 Hours).

Product Attributes

Number of LABs/CLBs:25475
Number of Logic Elements/Cells:326080
Total RAM Bits:16404480
Number of I/O:500
Number of Gates:- 
Voltage - Supply:0.97V ~ 1.03V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:900-BBGA, FCBGA
Supplier Device Package:900-FCBGA (31x31)
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Similar Products

Part Number XC7K325T-2FFG900I XC7K325T-L2FFG900I XC7K325T-2FFV900I XC7K325T-1FFG900I XC7K325T-2FBG900I XC7K325T-2FF900I XC7K325T-2FFG900C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Obsolete Active Active Active Active
Number of LABs/CLBs 25475 25475 25475 25475 25475 25475 25475
Number of Logic Elements/Cells 326080 326080 326080 326080 326080 326080 326080
Total RAM Bits 16404480 16404480 16404480 16404480 16404480 16404480 16404480
Number of I/O 500 500 500 500 500 500 500
Number of Gates - - - - - - -
Voltage - Supply 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31)

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