XC7K325T-1FFG900I
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AMD Xilinx XC7K325T-1FFG900I

Manufacturer No:
XC7K325T-1FFG900I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 500 I/O 900FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XC7K325T-1FFG900I is a Field-Programmable Gate Array (FPGA) from the Kintex-7 series, produced by AMD Xilinx. This FPGA is designed to offer high performance, low power consumption, and advanced features, making it suitable for a wide range of applications including data processing, communication systems, and embedded systems. The Kintex-7 series is known for its balance between high-performance and low-power requirements, making it an ideal choice for various industrial and consumer electronics.

Key Specifications

SpecificationValue
Device FamilyKintex-7
Device TypeFPGA
Number of Logic Cells326,080
Number of CLB (Configurable Logic Block) Slices5,200
Number of Block RAMs1,020
Number of DSP Slices1,020
Maximum User I/Os500
Package TypeFFG900
Package Size31mm x 31mm
Operating Temperature Range-40°C to 100°C
Speed Grade-1

Key Features

  • High-performance and low-power consumption, making it suitable for a variety of applications.
  • Advanced DSP capabilities with 1,020 DSP slices.
  • Extensive memory resources including 1,020 Block RAMs.
  • High-speed transceivers supporting up to 12.5 Gbps.
  • Integrated PCI Express and Gigabit Ethernet controllers.
  • Support for multiple interfaces such as DDR3, DDR2, and LPDDR2.

Applications

  • Data processing and analytics.
  • Communication systems, including wireless and wired networks.
  • Embedded systems, such as industrial control and automotive systems.
  • Medical imaging and diagnostic equipment.
  • Aerospace and defense systems.
  • High-performance computing and cloud infrastructure.

Q & A

  1. What is the XC7K325T-1FFG900I? The XC7K325T-1FFG900I is a Field-Programmable Gate Array (FPGA) from the Kintex-7 series produced by AMD Xilinx.
  2. What are the key features of the XC7K325T-1FFG900I? Key features include high-performance and low-power consumption, advanced DSP capabilities, extensive memory resources, and high-speed transceivers.
  3. What is the package type of the XC7K325T-1FFG900I? The package type is FFG900.
  4. What is the operating temperature range of the XC7K325T-1FFG900I? The operating temperature range is -40°C to 100°C.
  5. How many logic cells does the XC7K325T-1FFG900I have? The XC7K325T-1FFG900I has 326,080 logic cells.
  6. What are some common applications of the XC7K325T-1FFG900I? Common applications include data processing, communication systems, embedded systems, medical imaging, aerospace, and high-performance computing.
  7. Does the XC7K325T-1FFG900I support PCI Express? Yes, it supports integrated PCI Express controllers.
  8. What is the maximum user I/Os for the XC7K325T-1FFG900I? The maximum user I/Os is 500.
  9. How many DSP slices does the XC7K325T-1FFG900I have? The XC7K325T-1FFG900I has 1,020 DSP slices.
  10. What is the speed grade of the XC7K325T-1FFG900I? The speed grade is -1.

Product Attributes

Number of LABs/CLBs:25475
Number of Logic Elements/Cells:326080
Total RAM Bits:16404480
Number of I/O:500
Number of Gates:- 
Voltage - Supply:0.97V ~ 1.03V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:900-BBGA, FCBGA
Supplier Device Package:900-FCBGA (31x31)
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Similar Products

Part Number XC7K325T-1FFG900I XC7K325T-2FFG900I XC7K325T-1FFV900I XC7K325T-1FBG900I XC7K325T-1FF900I XC7K325T-1FFG900C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active Active
Number of LABs/CLBs 25475 25475 25475 25475 25475 25475
Number of Logic Elements/Cells 326080 326080 326080 326080 326080 326080
Total RAM Bits 16404480 16404480 16404480 16404480 16404480 16404480
Number of I/O 500 500 500 500 500 500
Number of Gates - - - - - -
Voltage - Supply 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V 0.97V ~ 1.03V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31)

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