XC3S700A-4FGG484I
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AMD Xilinx XC3S700A-4FGG484I

Manufacturer No:
XC3S700A-4FGG484I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 372 I/O 484FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XC3S700A-4FGG484I is a member of the Spartan-3A family of Field-Programmable Gate Arrays (FPGAs) produced by AMD Xilinx. This FPGA is designed to address the design challenges in high-volume, cost-sensitive applications. It offers a balance of performance, power efficiency, and feature richness, making it suitable for a wide range of electronic systems.

Key Specifications

Attribute Value
Device XC3S700A
System Gates Equivalent 700K
Logic Cells 13,248
CLB Array (One CLB = Four Slices) 48 rows, 32 columns, 1,584 slices
Distributed RAM bits 176 Kbits
Block RAM bits 576 Kbits
Dedicated Multipliers 32
DCMs (Digital Clock Managers) 8
Maximum User I/O 502
Maximum Differential I/O Pairs 227
Package FGG484
Speed Grade -4

Key Features

  • Multi-standard SelectIO™ interface pins supporting LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O, and LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O.
  • Selectable output drive up to 24 mA per pin and QUIETIO standard to reduce I/O switching noise.
  • Full 3.3V ± 10% compatibility and hot swap compliance.
  • Enhanced Double Data Rate (DDR) support and DDR/DDR2 SDRAM support up to 400 Mb/s.
  • Fully compliant 32-/64-bit, 33/66 MHz PCI® technology support.
  • Abundant, flexible logic resources including wide multiplexers, wide logic, and fast look-ahead carry logic.
  • Enhanced 18 x 18 multipliers with optional pipeline.
  • IEEE 1149.1/1532 JTAG programming/debug port.
  • Hierarchical SelectRAM™ memory architecture with up to 576 Kbits of fast block RAM and up to 176 Kbits of efficient distributed RAM.
  • Eight low-skew global clock networks and eight additional clocks per half device.
  • Clock skew elimination (delay locked loop), frequency synthesis, multiplication, division, and high-resolution phase shifting.

Applications

The XC3S700A-4FGG484I FPGA is versatile and can be used in various applications, including:

  • High-volume consumer electronics such as digital TVs, set-top boxes, and DVD players.
  • Industrial control systems, medical devices, and automotive systems.
  • Communication equipment, such as routers, switches, and base stations.
  • Data storage and computing systems, including RAID controllers and server peripherals.
  • Aerospace and defense systems requiring high reliability and performance.

Q & A

  1. What is the XC3S700A-4FGG484I FPGA used for?

    The XC3S700A-4FGG484I FPGA is used in high-volume, cost-sensitive applications requiring a balance of performance, power efficiency, and feature richness.

  2. What are the key features of the XC3S700A FPGA?

    Key features include multi-standard SelectIO™ interface pins, enhanced DDR support, PCI technology support, abundant logic resources, and hierarchical SelectRAM™ memory architecture.

  3. What is the maximum number of user I/O pins available on the XC3S700A FPGA?

    The maximum number of user I/O pins is 502.

  4. What types of memory does the XC3S700A FPGA support?

    The FPGA supports up to 576 Kbits of fast block RAM and up to 176 Kbits of efficient distributed RAM.

  5. Does the XC3S700A FPGA support DDR/DDR2 SDRAM?
  6. What is the purpose of the Digital Clock Managers (DCMs) in the XC3S700A FPGA?

    The DCMs are used for clock skew elimination, frequency synthesis, multiplication, division, and high-resolution phase shifting.

  7. What is the QUIETIO standard in the context of the XC3S700A FPGA?

    The QUIETIO standard reduces I/O switching noise.

  8. Is the XC3S700A FPGA compatible with 3.3V systems?
  9. What are some common applications of the XC3S700A FPGA?
  10. What is the significance of the hierarchical SelectRAM™ memory architecture in the XC3S700A FPGA?

Product Attributes

Number of LABs/CLBs:1472
Number of Logic Elements/Cells:13248
Total RAM Bits:368640
Number of I/O:372
Number of Gates:700000
Voltage - Supply:1.14V ~ 1.26V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:484-BBGA
Supplier Device Package:484-FBGA (23x23)
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Similar Products

Part Number XC3S700A-4FGG484I XC3S700AN-4FGG484I XC3S700A-4FG484I XC3S700A-4FGG484C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active
Number of LABs/CLBs 1472 1472 1472 1472
Number of Logic Elements/Cells 13248 13248 13248 13248
Total RAM Bits 368640 368640 368640 368640
Number of I/O 372 372 372 372
Number of Gates 700000 700000 700000 700000
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 484-BBGA 484-BBGA 484-BBGA 484-BBGA
Supplier Device Package 484-FBGA (23x23) 484-FBGA (23x23) 484-FBGA (23x23) 484-FBGA (23x23)

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