XCKU040-2FFVA1156E
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AMD Xilinx XCKU040-2FFVA1156E

Manufacturer No:
XCKU040-2FFVA1156E
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 520 I/O 1156FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The AMD Xilinx Kintex UltraScale XCKU040-2FFVA1156E is a high-performance Field-Programmable Gate Array (FPGA) designed for demanding applications requiring high logic integration, advanced signal processing, and robust power management. This FPGA is part of the Kintex UltraScale family, which offers a balance of price, performance, and power, making it ideal for various high-throughput and high-bandwidth applications. The XCKU040-2FFVA1156E is particularly suited for data centers, cloud computing, wired communications, broadcasting and multimedia, aerospace and defense systems, and industrial control and automation.

Key Specifications

ParameterValue
System Logic Cells (K)530
DSP Slices1,920
Block RAM (Mb)21.1
16.3 Gb/s Transceivers20
I/O Pins520
Number of LABs/CLBs30,300
Total RAM Bits21,606,000
Voltage - Supply0.922V ~ 0.979V
Operating Temperature-40°C ~ 100°C (TJ)

Key Features

  • High logic integration with 530,250 logic elements and 30,300 configurable logic blocks (CLBs).
  • Advanced signal processing capabilities with 1,920 DSP slices.
  • Substantial memory capacity with 21.1 Mb of Block RAM and 21,606,000 total RAM bits.
  • Abundant I/O options with 520 I/O pins.
  • Support for a wide range of supply voltages from 0.922V to 0.979V.
  • Robust thermal performance with an operating temperature range of -40°C to 100°C.
  • Optimized for both cost and power, enhancing overall efficiency.
  • Compatible with standard surface mount processes and supports various voltage levels for interfacing with different system components.

Applications

  • Data centers and cloud computing: Ideal for packet processing in 100G networking and other high-throughput applications.
  • Wired communications: Suitable for high-bandwidth networking applications.
  • Broadcasting and multimedia: Used in DSP-intensive processing for 8K/4K video and other multimedia applications.
  • Aerospace and defense systems: Robust construction and wide temperature range make it suitable for demanding environments.
  • Industrial control and automation: High logic integration and advanced signal processing capabilities are beneficial for complex control systems).

Q & A

  1. What is the XCKU040-2FFVA1156E FPGA used for? The XCKU040-2FFVA1156E FPGA is used for high-performance applications in data centers, cloud computing, wired communications, broadcasting and multimedia, aerospace and defense systems, and industrial control and automation.
  2. How many system logic cells does the XCKU040-2FFVA1156E FPGA have? The XCKU040-2FFVA1156E FPGA has 530,000 system logic cells.
  3. What is the number of DSP slices in the XCKU040-2FFVA1156E FPGA? The XCKU040-2FFVA1156E FPGA has 1,920 DSP slices.
  4. What is the total RAM capacity of the XCKU040-2FFVA1156E FPGA? The XCKU040-2FFVA1156E FPGA has a total RAM capacity of 21.1 Mb Block RAM and 21,606,000 total RAM bits.
  5. How many I/O pins does the XCKU040-2FFVA1156E FPGA have? The XCKU040-2FFVA1156E FPGA has 520 I/O pins.
  6. What is the operating temperature range of the XCKU040-2FFVA1156E FPGA? The operating temperature range of the XCKU040-2FFVA1156E FPGA is -40°C to 100°C (TJ).
  7. Is the XCKU040-2FFVA1156E FPGA RoHS compliant? Yes, the XCKU040-2FFVA1156E FPGA is RoHS compliant.
  8. What kind of packaging does the XCKU040-2FFVA1156E FPGA use? The XCKU040-2FFVA1156E FPGA uses a 1156-BBGA, FCBGA package.
  9. What design tools are available for the XCKU040-2FFVA1156E FPGA? The XCKU040-2FFVA1156E FPGA is supported by the AMD Vivado Design Suite and other comprehensive design tools.
  10. Is the XCKU040-2FFVA1156E FPGA suitable for high-throughput applications? Yes, the XCKU040-2FFVA1156E FPGA is optimized for high-throughput and high-bandwidth applications).

Product Attributes

Number of LABs/CLBs:30300
Number of Logic Elements/Cells:530250
Total RAM Bits:21606000
Number of I/O:520
Number of Gates:- 
Voltage - Supply:0.922V ~ 0.979V
Mounting Type:Surface Mount
Operating Temperature:0°C ~ 100°C (TJ)
Package / Case:1156-BBGA, FCBGA
Supplier Device Package:1156-FCBGA (35x35)
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Similar Products

Part Number XCKU040-2FFVA1156E XCKU060-2FFVA1156E XCKU040-2FFVA1156I XCKU040-3FFVA1156E
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active
Number of LABs/CLBs 30300 41460 30300 30300
Number of Logic Elements/Cells 530250 725550 530250 530250
Total RAM Bits 21606000 38912000 21606000 21606000
Number of I/O 520 520 520 520
Number of Gates - - - -
Voltage - Supply 0.922V ~ 0.979V 0.922V ~ 0.979V 0.922V ~ 0.979V 0.970V ~ 1.030V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35)

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