EP3C25F256C7N
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Intel EP3C25F256C7N

Manufacturer No:
EP3C25F256C7N
Manufacturer:
Intel
Package:
Tray
Description:
IC FPGA 156 I/O 256FBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The EP3C25F256C7N is a member of the Cyclone III FPGA family, designed and manufactured by Intel. This device is part of a series of low-power, high-performance FPGAs that are widely used in various electronic systems. The Cyclone III FPGAs are known for their balance of performance, power, and cost, making them suitable for a broad range of applications.

Key Specifications

SpecificationValue
Device FamilyCyclone III
Logic Elements24,624
Maximum User I/Os385
Embedded Multipliers88 (9-bit x 9-bit)
Embedded Memory (Kbits)1,152
Maximum Clock Frequency (MHz)320
Package TypeFBGA256
Operating Temperature Range (°C)-40 to 100 (Industrial Grade)
Supply Voltage (V)1.2V (Core), 1.8V/2.5V/3.3V (I/O)

Key Features

  • Low power consumption with dynamic and static power management.
  • High-performance logic elements with up to 320 MHz clock frequency.
  • Integrated embedded multipliers for efficient DSP operations.
  • On-chip memory for data storage and processing.
  • Support for various I/O standards including LVDS, LVPECL, and more.
  • Programmable via JTAG, AS, or PS configuration schemes.

Applications

  • Wireless and wired communications systems.
  • Digital signal processing (DSP) and image processing.
  • Industrial control and automation systems.
  • Consumer electronics such as set-top boxes and digital TVs.
  • Aerospace and defense systems requiring high reliability.
  • Medical devices and diagnostic equipment.

Q & A

  1. What is the EP3C25F256C7N? The EP3C25F256C7N is a Cyclone III FPGA from Intel, designed for low-power, high-performance applications.
  2. How many logic elements does it have? It has 24,624 logic elements.
  3. What is the maximum user I/O count? The maximum user I/O count is 385.
  4. What type of package does it use? It uses a FBGA256 package.
  5. What are the operating temperature ranges for this device? The operating temperature range is -40 to 100°C for industrial grade.
  6. What are the supply voltage requirements? The core voltage is 1.2V, and I/O voltages can be 1.8V, 2.5V, or 3.3V.
  7. What configuration methods are supported? It supports JTAG, AS, and PS configuration schemes.
  8. What are some common applications of this FPGA? Common applications include wireless and wired communications, DSP, industrial control, consumer electronics, aerospace, and medical devices.
  9. How much embedded memory does it have? It has 1,152 Kbits of embedded memory.
  10. What is the maximum clock frequency? The maximum clock frequency is up to 320 MHz.

Product Attributes

Number of LABs/CLBs:1539
Number of Logic Elements/Cells:24624
Total RAM Bits:608256
Number of I/O:156
Number of Gates:- 
Voltage - Supply:1.15V ~ 1.25V
Mounting Type:Surface Mount
Operating Temperature:0°C ~ 85°C (TJ)
Package / Case:256-LBGA
Supplier Device Package:256-FBGA (17x17)
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Similar Products

Part Number EP3C25F256C7N EP3C25F256C8N EP3C5F256C7N EP3C25F256I7N EP3C25U256C7N EP3C25F256A7N EP3C25F256C6N EP3C25F256C7
Manufacturer Intel Intel Intel Intel Intel Intel Intel Intel
Product Status Active Active Active Active Active Active Active Active
Number of LABs/CLBs 1539 1539 321 1539 1539 1539 1539 1539
Number of Logic Elements/Cells 24624 24624 5136 24624 24624 24624 24624 24624
Total RAM Bits 608256 608256 423936 608256 608256 608256 608256 608256
Number of I/O 156 156 182 156 156 156 156 156
Number of Gates - - - - - - - -
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 125°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 256-LBGA 256-LBGA 256-LBGA 256-LBGA 256-LFBGA 256-LBGA 256-LBGA 256-LBGA
Supplier Device Package 256-FBGA (17x17) 256-FBGA (17x17) 256-FBGA (17x17) 256-FBGA (17x17) 256-UBGA (14x14) 256-FBGA (17x17) 256-FBGA (17x17) 256-FBGA (17x17)

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