EP3C40F324I7N
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Intel EP3C40F324I7N

Manufacturer No:
EP3C40F324I7N
Manufacturer:
Intel
Package:
Tray
Description:
IC FPGA 195 I/O 324FBGA
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The Intel Cyclone III EP3C40F324I7N is a Field Programmable Gate Array (FPGA) that offers a unique combination of high functionality, low power consumption, and low cost. Built on the Taiwan Semiconductor Manufacturing Company (TSMC) low-power process technology, this device is part of the Cyclone III family, which is ideal for high-volume, low-power, and cost-sensitive applications. The Cyclone III series is known for its silicon optimizations and software features that minimize power consumption, making it suitable for a wide range of applications.

Key Specifications

Specification Value
Series Cyclone III
Number of Logic Elements/Cells 39,600
Number of LABs/CLBs 2,475
Embedded Block RAM - EBR 1,161 kbit
Distributed RAM 1 Mbit
Number of I/Os 195
Maximum Operating Frequency 315 MHz
Operating Supply Voltage 1.15 V to 1.25 V
Minimum Operating Temperature -40°C
Maximum Operating Temperature 100°C (TJ)
Mounting Style Surface Mount
Package / Case 324-Pin FBGA
Technology 65nm

Key Features

  • Low Power Consumption: The Cyclone III EP3C40F324I7N is designed with low-power process technology, making it suitable for applications where power efficiency is crucial.
  • High Functionality: With 39,600 logic elements and various memory options, this FPGA offers high functionality for complex designs.
  • Security Features: The Cyclone III LS devices, part of this family, include advanced security features such as configuration security using AES with a 256-bit volatile key, design separation, and the ability to disable the external JTAG port.
  • Memory Interfaces: Supports DDR2 SDRAM memory interfaces with data rates up to 400 Mbps and other high-speed memory interfaces like QDRII+ SRAM.
  • High-Speed I/Os: Includes high-speed I/Os and transceivers, enhancing the device's performance in various applications.

Applications

  • Artificial Intelligence: Suitable for AI applications requiring high computational power and low power consumption.
  • 5G Technology: Can be used in 5G infrastructure due to its high-speed I/Os and low latency.
  • Cloud Computing: Ideal for cloud computing applications that require high performance and efficiency.
  • Consumer Electronics: Used in various consumer electronics for its cost-effectiveness and high functionality.
  • Wireless Technology: Suitable for wireless communication systems.
  • Industrial Control: Used in industrial control systems for its reliability and performance.
  • Internet of Things (IoT): Ideal for IoT applications that require low power consumption and high functionality.
  • Medical Equipment: Can be used in medical devices that require precise and reliable performance.

Q & A

  1. What is the Cyclone III EP3C40F324I7N FPGA used for?

    The Cyclone III EP3C40F324I7N FPGA is used in a variety of applications requiring high functionality, low power consumption, and cost-effectiveness, such as AI, 5G technology, cloud computing, consumer electronics, and more.

  2. What is the maximum operating frequency of the Cyclone III EP3C40F324I7N?

    The maximum operating frequency of the Cyclone III EP3C40F324I7N is 315 MHz.

  3. What type of package does the Cyclone III EP3C40F324I7N come in?

    The Cyclone III EP3C40F324I7N comes in a 324-Pin FBGA package.

  4. What are the key security features of the Cyclone III LS devices?

    The Cyclone III LS devices include configuration security using AES with a 256-bit volatile key, design separation, the ability to disable the external JTAG port, and other security features to protect IP from tampering and reverse engineering.

  5. What is the operating supply voltage range for the Cyclone III EP3C40F324I7N?

    The operating supply voltage range for the Cyclone III EP3C40F324I7N is 1.15 V to 1.25 V.

  6. What is the minimum and maximum operating temperature for the Cyclone III EP3C40F324I7N?

    The minimum operating temperature is -40°C, and the maximum operating temperature is 100°C (TJ).

  7. How many logic elements does the Cyclone III EP3C40F324I7N have?

    The Cyclone III EP3C40F324I7N has 39,600 logic elements.

  8. What type of memory interfaces does the Cyclone III EP3C40F324I7N support?

    The Cyclone III EP3C40F324I7N supports DDR2 SDRAM memory interfaces with data rates up to 400 Mbps and other high-speed memory interfaces like QDRII+ SRAM.

  9. Is the Cyclone III EP3C40F324I7N suitable for industrial control applications?
  10. What is the technology node of the Cyclone III EP3C40F324I7N?

    The technology node of the Cyclone III EP3C40F324I7N is 65nm.

Product Attributes

Number of LABs/CLBs:2475
Number of Logic Elements/Cells:39600
Total RAM Bits:1161216
Number of I/O:195
Number of Gates:- 
Voltage - Supply:1.15V ~ 1.25V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:324-BGA
Supplier Device Package:324-FBGA (19x19)
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Similar Products

Part Number EP3C40F324I7N EP3C40F324A7N EP3C40F324C7N EP3C40F324I7
Manufacturer Intel Intel Intel Intel
Product Status Active Active Active Active
Number of LABs/CLBs 2475 2475 2475 2475
Number of Logic Elements/Cells 39600 39600 39600 39600
Total RAM Bits 1161216 1161216 1161216 1161216
Number of I/O 195 195 195 195
Number of Gates - - - -
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 125°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Package / Case 324-BGA 324-BGA 324-BGA 324-BGA
Supplier Device Package 324-FBGA (19x19) 324-FBGA (19x19) 324-FBGA (19x19) 324-FBGA (19x19)

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