XC7A200T-2FBG676I
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AMD Xilinx XC7A200T-2FBG676I

Manufacturer No:
XC7A200T-2FBG676I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 400 I/O 676FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The Xilinx XC7A200T-2FBG676I is a high-performance Field Programmable Gate Array (FPGA) from the Artix-7 family, manufactured by AMD Xilinx. Built on a 28nm process, this FPGA is designed to offer a balance of high performance, low power consumption, and cost optimization. It is particularly suited for embedded systems that require significant real-time processing power and complex algorithm implementation.

The XC7A200T-2FBG676I features a large programmable logic fabric, abundant memory blocks, high-speed I/O interfaces, and robust thermal and mechanical characteristics, making it ideal for industrial electronics and other demanding applications.

Key Specifications

Specification Details
Logic Cells 218,600 in 11,661 logic slices
Block RAM 655KB
DSP Slices 240 using 25×18 multipliers
Clock Management 8 PLLs and 16 clock management tiles
Transceivers Up to 12.5Gb/s
Analog-to-Digital Converters Two 12-bit 1MSPS
Package FBG676 – 27x27mm 1.0mm ball pitch flip-chip BGA with 676 balls
Speed Grade -2, supporting clock rates up to 550MHz
Temperature Range -40°C to +100°C (Industrial grade)
I/O Pins 400
Process Technology 28nm (HKMG)

Key Features

  • High Performance Fabric: The XC7A200T-2FBG676I features a high-performance fabric optimized for low power consumption and high logic throughput.
  • MicroBlaze Soft Processor: Integrated MicroBlaze soft processor for coordinating processing power and functionalities.
  • DSP Capabilities: 240 DSP slices using 25×18 multipliers for high-performance math-intensive processing.
  • Robust Clock Management: 8 PLLs and 16 clock management tiles for robust clock management.
  • High-Speed Transceivers: Up to 12.5Gb/s transceivers for high-speed serial connectivity.
  • Analog-to-Digital Converters: Two 12-bit 1MSPS analog-to-digital converters.
  • Low Power Consumption: 65% lower static power and 50% lower dynamic power compared to 45nm generation devices.
  • Comprehensive Development Tools: Supports VHDL, Verilog, and higher-level programming tools like Simulink for efficient design and verification.

Applications

  • Industrial Electronics: Suitable for complex industrial control systems and real-time processing applications.
  • Software Defined Radio: Ideal for software-defined radio applications due to its high DSP and logic throughput.
  • Machine Vision Cameras: Used in machine vision cameras requiring high-speed processing and low power consumption.
  • Wireless Backhaul: Applicable in low-end wireless backhaul systems due to its cost and power optimization.
  • Medical Devices: Can be used in medical devices requiring high performance and low power consumption.
  • Avionics and Communications: Meets the needs of size, weight, power, and cost (SWaP-C) sensitive markets like avionics and communications.

Q & A

  1. What is the XC7A200T-2FBG676I FPGA?

    The XC7A200T-2FBG676I is a high-performance Field Programmable Gate Array (FPGA) from the Artix-7 family, manufactured by AMD Xilinx.

  2. What process technology is used in the XC7A200T-2FBG676I?

    The XC7A200T-2FBG676I is built on a 28nm high-k metal gate (HKMG) process technology.

  3. What are the key specifications of the XC7A200T-2FBG676I?

    Key specifications include 218,600 logic cells, 655KB of block RAM, 240 DSP slices, and high-speed transceivers up to 12.5Gb/s.

  4. What is the temperature range of the XC7A200T-2FBG676I?

    The temperature range is -40°C to +100°C, making it suitable for industrial applications.

  5. What package type does the XC7A200T-2FBG676I use?

    The package is a 27x27mm 1.0mm ball pitch flip-chip BGA with 676 balls.

  6. What are the applications of the XC7A200T-2FBG676I?

    Applications include industrial electronics, software-defined radio, machine vision cameras, wireless backhaul, and medical devices.

  7. Does the XC7A200T-2FBG676I support high-speed interfaces?

    Yes, it supports high-speed interfaces including up to 12.5Gb/s transceivers and DDR3 interfaces up to 1866Mb/s.

  8. What development tools are available for the XC7A200T-2FBG676I?

    Comprehensive development tools including VHDL, Verilog, and higher-level programming tools like Simulink are available.

  9. How does the XC7A200T-2FBG676I manage power consumption?

    The XC7A200T-2FBG676I features 65% lower static power and 50% lower dynamic power compared to 45nm generation devices.

  10. What is the warranty period for Xilinx semiconductor products?

    Xilinx semiconductor products have a warranty of twelve (12) months from the date of purchase.

Product Attributes

Number of LABs/CLBs:16825
Number of Logic Elements/Cells:215360
Total RAM Bits:13455360
Number of I/O:400
Number of Gates:- 
Voltage - Supply:0.95V ~ 1.05V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:676-BBGA, FCBGA
Supplier Device Package:676-FCBGA (27x27)
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Similar Products

Part Number XC7A200T-2FBG676I XC7A200T-1FBG676I XC7A200T-2FB676I XC7A200T-2FBG676C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active
Number of LABs/CLBs 16825 16825 16825 16825
Number of Logic Elements/Cells 215360 215360 215360 215360
Total RAM Bits 13455360 13455360 13455360 13455360
Number of I/O 400 400 400 400
Number of Gates - - - -
Voltage - Supply 0.95V ~ 1.05V 0.95V ~ 1.05V 0.95V ~ 1.05V 0.95V ~ 1.05V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27)

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