XC7Z035-2FFG900I
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AMD Xilinx XC7Z035-2FFG900I

Manufacturer No:
XC7Z035-2FFG900I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC SOC CORTEX-A9 800MHZ 900FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XC7Z035-2FFG900I is a Zynq-7000 System-on-Chip (SoC) produced by AMD Xilinx. This integrated circuit combines the benefits of a Field-Programmable Gate Array (FPGA) with those of a dual-core ARM Cortex-A9 processor, making it a powerful and versatile device. The SoC is designed for applications that require high-speed processing, low power consumption, and the flexibility to be regularly updated and customized. It is particularly suited for industries such as automotive, aerospace, and defense, where advanced processing capabilities and reliability are crucial.

Key Specifications

Category Embedded System On Chip (SoC)
Manufacturer AMD Xilinx
Series Zynq-7000 SoC
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB MCU RAM
Number of I/O 130
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Key Features

  • Dual ARM Cortex-A9 MPCore with CoreSight: Provides high-performance processing capabilities.
  • Programmable Logic: Features 275K logic cells, enabling flexible and customizable designs.
  • Memory Interfaces: Supports DDR3, DDR3L, DDR2, LPDDR2, SRAM, and various flash memory types (NOR, NAND, SPI).
  • High-Speed Connectivity: Includes Gigabit Ethernet transceivers, USB OTG, and multiple serial interfaces.
  • Low Power Consumption: Available in speed grades optimized for lower power, such as the -2LI speed grade.

Applications

  • Automotive Systems: Advanced driver-assistance systems (ADAS), multi-axis motor control.
  • Aerospace and Defense: High-reliability and performance-critical applications.
  • Machine Vision: Real-time image processing and analysis.
  • Medical Devices: Medical endoscopes and other diagnostic equipment.
  • Professional Cameras: High-resolution image capture and processing.
  • Carrier Ethernet Backhaul: High-speed data transmission and networking.
  • Small Cell Baseband: Wireless communication infrastructure.

Q & A

  1. What is the core processor of the XC7Z035-2FFG900I?

    The core processor is a dual ARM® Cortex®-A9 MPCore™ with CoreSight™.

  2. What is the maximum operating temperature of the XC7Z035-2FFG900I?

    The operating temperature range is -40°C to 100°C (TJ).

  3. How many logic cells does the XC7Z035-2FFG900I FPGA have?

    The FPGA has 275K logic cells.

  4. What types of memory interfaces does the XC7Z035-2FFG900I support?

    It supports DDR3, DDR3L, DDR2, LPDDR2, SRAM, and various flash memory types (NOR, NAND, SPI).

  5. What is the clock speed of the ARM Cortex-A9 processors in the XC7Z035-2FFG900I?

    The clock speed is 800MHz.

  6. What are some of the key applications for the XC7Z035-2FFG900I?

    Applications include automotive systems, aerospace and defense, machine vision, medical devices, professional cameras, and carrier Ethernet backhaul.

  7. Does the XC7Z035-2FFG900I support Gigabit Ethernet?

    Yes, it includes Gigabit Ethernet transceivers.

  8. What is the package type of the XC7Z035-2FFG900I?

    The package type is 900-BBGA, FCBGA.

  9. How many I/O pins does the XC7Z035-2FFG900I have?

    It has 130 I/O pins.

  10. Is the XC7Z035-2FFG900I RoHS compliant?

    Yes, it is RoHS compliant.

Product Attributes

Architecture:MCU, FPGA
Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:- 
RAM Size:256KB
Peripherals:DMA
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:800MHz
Primary Attributes:Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:900-BBGA, FCBGA
Supplier Device Package:900-FCBGA (31x31)
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Similar Products

Part Number XC7Z035-2FFG900I XC7Z045-2FFG900I XC7Z035-L2FFG900I XC7Z035-1FFG900I XC7Z035-2FFG900E
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size - - - - -
RAM Size 256KB 256KB 256KB 256KB 256KB
Peripherals DMA DMA DMA DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz 800MHz 800MHz 667MHz 800MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 350K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31)

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