XCZU7EG-1FBVB900E
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AMD Xilinx XCZU7EG-1FBVB900E

Manufacturer No:
XCZU7EG-1FBVB900E
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC SOC CORTEX-A53 900FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XCZU7EG-1FBVB900E is a high-performance System on Chip (SoC) produced by AMD Xilinx, belonging to the Zynq UltraScale+ MPSoC family. This model integrates a quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and a Mali-400 MP2 GPU, alongside a programmable logic fabric. It is designed for applications requiring high computational power, flexibility, and reliability. The XCZU7EG-1FBVB900E targets industries such as automotive, industrial automation, and aerospace, offering a unique combination of processing, graphics, and programmability to meet diverse system requirements.

Key Specifications

ParameterValueUnitNotes
ProcessorQuad-core ARM Cortex-A53, Dual-core ARM Cortex-R5-64-bit processing
GPUMali-400 MP2-Supports OpenGL ES 1.1/2.0
Programmable Logic Cells504K-UltraScale+ architecture
On-Chip Memory2560KBDistributed across processors
Max Operating Frequency600MHzFor ARM Cortex-A53
PackageFBVB900-900-ball BGA
Operating Temperature0 to +100°CCommercial grade
Power Consumption~11WTypical use case

Key Features

  • High Integration: Combines processing, graphics, and programmable logic in a single chip.
  • Flexibility: Adaptable to a wide range of applications through programmable logic.
  • Performance: Offers high computational power with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5.
  • Graphics Capabilities: Integrated Mali-400 MP2 GPU supports advanced graphical applications.
  • Reliability: Designed for demanding environments with robust architecture and thermal management.

Applications

The XCZU7EG-1FBVB900E is versatile and finds applications in various sectors:

  • Automotive: Used in advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.
  • Industrial Automation: Ideal for real-time control systems and machine vision applications.
  • Aerospace: Suitable for avionics and satellite systems requiring high reliability and performance.
  • Consumer Electronics: Powers high-end smart devices with its processing and graphics capabilities.

Q & A

1. What is the operating temperature range of the XCZU7EG-1FBVB900E?

The operating temperature range is 0 to +100°C.

2. Can the XCZU7EG-1FBVB900E be used in automotive applications?

Yes, it is suitable for automotive applications, including ADAS and in-vehicle infotainment.

3. What GPU is integrated into the XCZU7EG-1FBVB900E?

It integrates a Mali-400 MP2 GPU.

4. How many programmable logic cells does it have?

It features 504K programmable logic cells.

5. What is the maximum operating frequency of the ARM Cortex-A53 cores?

The maximum operating frequency is 600 MHz.

6. What package does the XCZU7EG-1FBVB900E use?

It uses a 900-ball BGA package.

7. Is the XCZU7EG-1FBVB900E suitable for industrial automation?

Yes, it is ideal for industrial automation applications, including real-time control systems.

8. What is the typical power consumption of the XCZU7EG-1FBVB900E?

The typical power consumption is around 11W.

9. Does the XCZU7EG-1FBVB900E support OpenGL ES?

Yes, the Mali-400 MP2 GPU supports OpenGL ES 1.1/2.0.

10. What industries benefit from the XCZU7EG-1FBVB900E?

Industries such as automotive, industrial automation, aerospace, and consumer electronics benefit from its capabilities.

Product Attributes

Architecture:MCU, FPGA
Core Processor:
Flash Size:- 
RAM Size:256KB
Peripherals:DMA, WDT
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:500MHz, 600MHz, 1.2GHz
Primary Attributes:Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:0°C ~ 100°C (TJ)
Package / Case:900-BBGA, FCBGA
Supplier Device Package:900-FCBGA (31x31)
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Similar Products

Part Number XCZU7EG-1FBVB900E XCZU7EV-1FBVB900E XCZU7EG-1FBVB900I XCZU7EG-2FBVB900E XCZU7EG-3FBVB900E XCZU5EG-1FBVB900E XCZU7CG-1FBVB900E
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size - - - - - - -
RAM Size 256KB 256KB 256KB 256KB 256KB 256KB 256KB
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 533MHz, 600MHz, 1.3GHz 600MHz, 667MHz, 1.5GHz 500MHz, 600MHz, 1.2GHz 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31)

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