Overview
The XC3S200A-4FTG256C is a Field Programmable Gate Array (FPGA) produced by AMD Xilinx. This device is part of the Spartan-3A family, known for its high performance, low power consumption, and versatility in various applications. The XC3S200A-4FTG256C is designed to offer a balance between logic capacity, memory resources, and I/O capabilities, making it suitable for a wide range of electronic systems.
Key Specifications
Type | Description |
---|---|
Number of Gates | 200,000 |
Voltage - Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Key Features
- High logic capacity with 200,000 gates, enabling complex digital designs.
- Low power consumption, making it suitable for power-sensitive applications.
- Surface mount packaging for easy integration into PCBs.
- Wide operating temperature range (0°C ~ 85°C), ensuring reliability in various environments.
- Rich set of I/O and memory resources, facilitating diverse system designs.
Applications
The XC3S200A-4FTG256C FPGA is versatile and can be used in a variety of applications, including:
- Embedded systems requiring high logic density and low power consumption.
- Communication systems, such as wireless and wired networks.
- Industrial control systems, including automation and monitoring.
- Consumer electronics, such as digital TVs and set-top boxes.
- Aerospace and defense systems where reliability and performance are critical.
Q & A
- What is the XC3S200A-4FTG256C?
The XC3S200A-4FTG256C is a Field Programmable Gate Array (FPGA) produced by AMD Xilinx.
- What is the logic capacity of the XC3S200A-4FTG256C?
The XC3S200A-4FTG256C has a logic capacity of 200,000 gates.
- What is the operating voltage range of the XC3S200A-4FTG256C?
The operating voltage range is 1.14V ~ 1.26V.
- What is the mounting type of the XC3S200A-4FTG256C?
The mounting type is surface mount.
- What is the operating temperature range of the XC3S200A-4FTG256C?
The operating temperature range is 0°C ~ 85°C (TJ).
- In what types of applications is the XC3S200A-4FTG256C commonly used?
It is commonly used in embedded systems, communication systems, industrial control systems, consumer electronics, and aerospace and defense systems.
- Why is the XC3S200A-4FTG256C preferred in power-sensitive applications?
It is preferred due to its low power consumption.
- What are the key features of the XC3S200A-4FTG256C?
Key features include high logic capacity, low power consumption, surface mount packaging, and a wide operating temperature range.
- Where can I find detailed specifications for the XC3S200A-4FTG256C?
Detailed specifications can be found on official AMD Xilinx websites, as well as on distributor sites like Digi-Key, Mouser, and Avnet.
- Is the XC3S200A-4FTG256C suitable for high-reliability applications?
Yes, it is suitable due to its wide operating temperature range and robust design.