10M02SCU169C8G
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Intel 10M02SCU169C8G

Manufacturer No:
10M02SCU169C8G
Manufacturer:
Intel
Package:
Tray
Description:
IC FPGA 130 I/O 169UBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The Intel 10M02SCU169C8G is a member of the MAX 10 Field Programmable Gate Array (FPGA) family, designed by Intel. This device is a single-chip, non-volatile, low-cost programmable logic device (PLD) that integrates an optimal set of system components. It is fabricated using 55nm technology and features 2000 logic elements, making it suitable for a wide range of applications including system management, I/O expansion, communication control planes, and more.

Key Specifications

Specification Value
Product Lifecycle Status Active
Family MAX 10
Logic Elements 2000
Technology 55nm
Supply Voltage 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 3V, 3.3V
Package Type UBGA-169
RoHS Compliance Yes
Lead-Free Status Lead Free
Operating Temperature 0°C to 85°C
Memory SRAM, User Flash Memory
Analog-to-Digital Converters (ADCs) Integrated
Nios II Soft Core Processor Support Yes

Key Features

  • Internally stored dual configuration flash for reliable and flexible configuration options.
  • User flash memory for storing user data and firmware.
  • Instant-on support for rapid system startup.
  • Integrated analog-to-digital converters (ADCs) for analog signal processing.
  • Support for Nios II soft core processor, enabling embedded system development.
  • Low power consumption and non-volatile storage, making it suitable for battery-powered devices.

Applications

  • System management and control.
  • I/O expansion and interface management.
  • Communication control planes in various networks.
  • Industrial automation and control systems.
  • Consumer electronics such as smart home devices and wearables.
  • Internet of Things (IoT) devices and applications.
  • Medical equipment and diagnostic devices.

Q & A

  1. What is the Intel 10M02SCU169C8G?

    The Intel 10M02SCU169C8G is a Field Programmable Gate Array (FPGA) from the MAX 10 family, designed for low-cost, non-volatile programmable logic applications.

  2. What technology is used in the fabrication of the 10M02SCU169C8G?

    The 10M02SCU169C8G is fabricated using 55nm technology.

  3. How many logic elements does the 10M02SCU169C8G have?

    The device has 2000 logic elements.

  4. What is the package type of the 10M02SCU169C8G?

    The package type is UBGA-169.

  5. Is the 10M02SCU169C8G RoHS compliant?

    Yes, the 10M02SCU169C8G is RoHS compliant.

  6. What are the integrated features of the 10M02SCU169C8G?

    The device includes internally stored dual configuration flash, user flash memory, instant-on support, integrated ADCs, and Nios II soft core processor support.

  7. What are the typical applications of the 10M02SCU169C8G?

    The device is used in system management, I/O expansion, communication control planes, industrial automation, consumer electronics, IoT devices, and medical equipment.

  8. What is the operating temperature range of the 10M02SCU169C8G?

    The operating temperature range is from 0°C to 85°C.

  9. Does the 10M02SCU169C8G support Nios II soft core processor?

    Yes, the device supports Nios II soft core processor.

  10. What types of memory are available in the 10M02SCU169C8G?

    The device includes SRAM and user flash memory.

Product Attributes

Number of LABs/CLBs:125
Number of Logic Elements/Cells:2000
Total RAM Bits:110592
Number of I/O:130
Number of Gates:- 
Voltage - Supply:2.85V ~ 3.465V
Mounting Type:Surface Mount
Operating Temperature:0°C ~ 85°C (TJ)
Package / Case:169-LFBGA
Supplier Device Package:169-UBGA (11x11)
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Similar Products

Part Number 10M02SCU169C8G 10M04SCU169C8G 10M08SCU169C8G
Manufacturer Intel Intel Intel
Product Status Active Active Active
Number of LABs/CLBs 125 250 500
Number of Logic Elements/Cells 2000 4000 8000
Total RAM Bits 110592 193536 387072
Number of I/O 130 130 130
Number of Gates - - -
Voltage - Supply 2.85V ~ 3.465V 2.85V ~ 3.465V 2.85V ~ 3.465V
Mounting Type Surface Mount Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 169-LFBGA 169-LFBGA 169-LFBGA
Supplier Device Package 169-UBGA (11x11) 169-UBGA (11x11) 169-UBGA (11x11)

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