XCKU060-1FFVA1156I
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AMD Xilinx XCKU060-1FFVA1156I

Manufacturer No:
XCKU060-1FFVA1156I
Manufacturer:
AMD Xilinx
Package:
Bulk
Description:
IC FPGA 520 I/O 1156FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The XCKU060-1FFVA1156I is a high-performance FPGA (Field Programmable Gate Array) from AMD Xilinx, part of the Kintex UltraScale+ family. Designed for advanced applications requiring high-speed processing and efficient power consumption, this FPGA is ideal for industries such as telecommunications, data centers, and aerospace. Its unique selling points include its advanced architecture, high logic density, and support for high-speed interfaces, making it a competitive choice for complex system designs.

Key Specifications

ParameterValueUnitNotes
Logic Cells588,000Configurable logic blocks
DSP Slices2,520For high-speed arithmetic operations
Block RAM38.3MBOn-chip memory
Transceivers32High-speed serial interfaces
Maximum I/O Pins400Supports various I/O standards
Process Technology16nmFinFET technology
Power ConsumptionLowOptimized for efficiency
PackageFFVA1156Flip-chip package

Key Features

  • High Logic Density: Provides 588,000 logic cells for complex designs.
  • Advanced DSP Slices: 2,520 DSP slices for high-performance signal processing.
  • High-Speed Transceivers: 32 transceivers supporting up to 16.3 Gbps.
  • Low Power Consumption: Optimized for energy efficiency in demanding applications.
  • Flexible I/O Support: Supports multiple I/O standards for versatile integration.

Applications

The XCKU060-1FFVA1156I is widely used in industries requiring high-speed processing and reliable performance. In telecommunications, it supports advanced networking protocols and high-speed data transmission. In data centers, it enhances server performance and accelerates machine learning tasks. Aerospace applications benefit from its reliability and low power consumption, making it suitable for satellite and avionics systems. Additionally, it is used in medical imaging and industrial automation for real-time processing and control.

Q & A

1. What is the logic cell count of the XCKU060-1FFVA1156I?

The XCKU060-1FFVA1156I has 588,000 logic cells.

2. How many DSP slices does this FPGA have?

It includes 2,520 DSP slices for high-speed arithmetic operations.

3. What is the maximum speed of the transceivers?

The transceivers support speeds up to 16.3 Gbps.

4. What package type is used for this FPGA?

It uses the FFVA1156 flip-chip package.

5. What industries is this FPGA suitable for?

It is ideal for telecommunications, data centers, aerospace, and industrial automation.

6. What is the process technology used?

It is built using 16nm FinFET technology.

7. How much block RAM is available?

The FPGA provides 38.3 MB of block RAM.

8. Is this FPGA optimized for low power consumption?

Yes, it is designed for energy efficiency.

9. How many I/O pins does it support?

It supports up to 400 I/O pins.

10. Can this FPGA be used in medical imaging?

Yes, it is suitable for real-time processing in medical imaging applications.

Product Attributes

Number of LABs/CLBs:41460
Number of Logic Elements/Cells:725550
Total RAM Bits:38912000
Number of I/O:520
Number of Gates:- 
Voltage - Supply:0.922V ~ 0.979V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:1156-BBGA, FCBGA
Supplier Device Package:1156-FCBGA (35x35)
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Similar Products

Part Number XCKU060-1FFVA1156I XCKU060-L1FFVA1156I XCKU060-2FFVA1156I XCKU040-1FFVA1156I XCKU060-1FFVA1156C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active
Number of LABs/CLBs 41460 41460 41460 30300 41460
Number of Logic Elements/Cells 725550 725550 725550 530250 725550
Total RAM Bits 38912000 38912000 38912000 21606000 38912000
Number of I/O 520 520 520 520 520
Number of Gates - - - - -
Voltage - Supply 0.922V ~ 0.979V 0.880V ~ 0.979V 0.922V ~ 0.979V 0.922V ~ 0.979V 0.922V ~ 0.979V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35)

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