Overview
The XCKU060-2FFVA1156I is a high-performance Field Programmable Gate Array (FPGA) from the AMD Xilinx Kintex UltraScale family. This device is designed to offer an optimal blend of capability and cost, leveraging advanced technologies such as monolithic and next-generation stacked silicon interconnect (SSI) to reduce total power consumption. The Kintex UltraScale FPGAs are known for their high DSP and block RAM-to-logic ratios, next-generation transceivers, and cost-effective packaging, making them ideal for a wide range of high-performance applications.
Key Specifications
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 41,460 |
| Number of Logic Elements/Cells | 725,550 |
| Total RAM Bits | 38,912,000 |
| Number of I/O | 520 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Technology Node | 20nm |
| DSP Slices | 2,760 |
| Maximum Distributed RAM | 9,180Kb |
| Total Block RAM | 38.0Mb |
Key Features
- High-Performance Capabilities: The XCKU060-2FFVA1156I features up to 1.5 million system logic units and 8.2 TeraMAC DSP compute performance, making it suitable for high-speed and computationally intensive applications.
- Advanced Transceivers: Equipped with next-generation transceivers, including 20x 12.5Gbps transceivers, PCIe 3.0, and 150G Interlaken interfaces, enhancing data transfer rates and system connectivity.
- Memory and Storage: Includes 4GB DDR4 SDRAM and 64MB QSPI Flash, providing ample memory for complex system implementations.
- Low Power Consumption: Designed with innovative technologies to lower total power consumption, making it energy-efficient for various applications.
- Flexible I/O and Interfaces: Offers a high number of I/Os (520) and various interfaces such as LVDS, PCIe, and Gigabit Ethernet, ensuring versatility in system design).
Applications
- Artificial Intelligence and Machine Learning: Suitable for AI and ML applications due to its high DSP compute performance and large memory resources).
- 5G Technology and Wireless Communication: Ideal for 5G base stations and other wireless communication systems requiring high-speed data processing and low latency).
- Cloud Computing and Data Centers: Used in cloud infrastructure for its high-performance capabilities and efficient power consumption).
- Consumer Electronics and Industrial Control: Applicable in consumer electronics and industrial control systems where high-performance and cost-effectiveness are crucial).
- Medical Equipment and IoT Devices: Suitable for medical devices and IoT applications that require advanced processing and low power consumption).
Q & A
- What is the technology node of the XCKU060-2FFVA1156I FPGA?
The XCKU060-2FFVA1156I FPGA is based on a 20nm technology node).
- How many logic elements does the XCKU060-2FFVA1156I FPGA have?
The XCKU060-2FFVA1156I FPGA has 725,550 logic elements).
- What is the total RAM capacity of the XCKU060-2FFVA1156I FPGA?
The total RAM capacity is 38,912,000 bits, with 38.0Mb of block RAM and 9,180Kb of distributed RAM).
- What are the key interfaces supported by the XCKU060-2FFVA1156I FPGA?
The FPGA supports interfaces such as PCIe 3.0, 100G Ethernet, 150G Interlaken, and LVDS).
- What is the operating temperature range of the XCKU060-2FFVA1156I FPGA?
The operating temperature range is -40℃ to 100℃ (TJ)).
- How many DSP slices does the XCKU060-2FFVA1156I FPGA have?
The FPGA has 2,760 DSP slices).
- What type of memory is included in the ACKU060 SoM based on the XCKU060-2FFVA1156I FPGA?
The ACKU060 SoM includes 4GB DDR4 SDRAM and 64MB QSPI Flash).
- What are some typical applications of the XCKU060-2FFVA1156I FPGA?
Typical applications include AI, 5G technology, cloud computing, consumer electronics, industrial control, and medical equipment).
- What is the package type of the XCKU060-2FFVA1156I FPGA?
The package type is 1156-BBGA, FCBGA).
- How many I/Os does the XCKU060-2FFVA1156I FPGA have?
The FPGA has 520 I/Os).
