EP3C25F256I7N
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Intel EP3C25F256I7N

Manufacturer No:
EP3C25F256I7N
Manufacturer:
Intel
Package:
Tray
Description:
IC FPGA 156 I/O 256FBGA
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The Intel EP3C25F256I7N is a Cyclone III Field Programmable Gate Array (FPGA) integrated circuit. This FPGA is part of Intel's Cyclone III family, known for its balance of performance, power, and cost. It is designed to offer a high level of integration and flexibility, making it suitable for a wide range of applications from industrial control to consumer electronics.

Key Specifications

ParameterValue
FamilyCyclone III
Logic Elements (LEs)25,000
Memory0.5 Megabits (Mb)
Static Power ConsumptionLess than ¼ watt
Package Type256-LBGA
Operating TemperatureIndustrial (-40°C to 100°C)

Key Features

  • High-density logic elements with up to 25,000 LEs.
  • Low static power consumption, making it energy-efficient.
  • Integrated memory of 0.5 Mb.
  • Support for various I/O standards and interfaces.
  • Programmable via JTAG, AS, or PS configuration schemes.

Applications

The Intel EP3C25F256I7N FPGA is versatile and can be used in a variety of applications, including:

  • Industrial control systems.
  • Consumer electronics such as set-top boxes and DVD players.
  • Communication equipment.
  • Medical devices.
  • Aerospace and defense systems.

Q & A

  1. What is the EP3C25F256I7N? The EP3C25F256I7N is a Cyclone III Field Programmable Gate Array (FPGA) from Intel.
  2. How many logic elements does it have? It has 25,000 logic elements (LEs).
  3. What is the memory capacity of this FPGA? It has 0.5 Megabits (Mb) of memory.
  4. What is the typical static power consumption? Less than ¼ watt.
  5. What is the package type of this FPGA? 256-LBGA.
  6. What are the operating temperature ranges for this FPGA? Industrial (-40°C to 100°C).
  7. What configuration methods are supported? JTAG, AS, or PS configuration schemes.
  8. What are some common applications for this FPGA? Industrial control systems, consumer electronics, communication equipment, medical devices, and aerospace and defense systems.
  9. Where can I find detailed specifications for the EP3C25F256I7N? Detailed specifications can be found on official Intel websites, Digi-Key, and other electronic component distributors.
  10. Is this FPGA suitable for high-performance applications? Yes, it is designed to balance performance and power consumption, making it suitable for various high-performance applications.

Product Attributes

Number of LABs/CLBs:1539
Number of Logic Elements/Cells:24624
Total RAM Bits:608256
Number of I/O:156
Number of Gates:- 
Voltage - Supply:1.15V ~ 1.25V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:256-LBGA
Supplier Device Package:256-FBGA (17x17)
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Similar Products

Part Number EP3C25F256I7N EP3C25U256I7N EP3C5F256I7N EP3C25F256A7N EP3C25F256C7N EP3C25F256I7
Manufacturer Intel Intel Intel Intel Intel Intel
Product Status Active Active Active Active Active Active
Number of LABs/CLBs 1539 1539 321 1539 1539 1539
Number of Logic Elements/Cells 24624 24624 5136 24624 24624 24624
Total RAM Bits 608256 608256 423936 608256 608256 608256
Number of I/O 156 156 182 156 156 156
Number of Gates - - - - - -
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 125°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Package / Case 256-LBGA 256-LFBGA 256-LBGA 256-LBGA 256-LBGA 256-LBGA
Supplier Device Package 256-FBGA (17x17) 256-UBGA (14x14) 256-FBGA (17x17) 256-FBGA (17x17) 256-FBGA (17x17) 256-FBGA (17x17)

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