Overview
The Intel 10M04DCF256I7G is a Field Programmable Gate Array (FPGA) from the MAX 10 family. This device is fabricated using 55nm technology and operates at a core voltage of 1.2V. It is packaged in a 256-pin Fine-Pitch Ball Grid Array (FBGA). The 10M04DCF256I7G was introduced on September 22, 2014, and is compliant with EU RoHS standards (2011/65/EU, 2015/863).
Key Specifications
Parameter | Value |
---|---|
Family | MAX 10 |
Technology | 55nm |
Core Voltage | 1.2V |
Package Type | 256-Pin FBGA |
Logic Cells | 4000 |
Maximum Internal Frequency | Varies by configuration |
Maximum LVDS Data Rate | Varies by configuration |
Number of I/O Banks | Varies by configuration |
Minimum Operating Temperature | -40°C |
Maximum Operating Temperature | 100°C |
RoHS Compliance | Yes (2011/65/EU, 2015/863) |
Key Features
- Programmable Logic: The 10M04DCF256I7G offers 4000 logic cells, making it suitable for a variety of digital logic applications.
- High-Speed I/O: Supports high-speed LVDS (Low Voltage Differential Signaling) and single-ended I/O standards.
- Embedded Memory: Includes distributed RAM and block RAM for efficient data storage and processing.
- PCIe Hard IP Blocks: Integrated PCIe hard IP blocks for high-speed data transfer.
- In-System Programmability: Allows for reprogramming without removing the device from the system.
- Low Power Consumption: Operates at a low core voltage of 1.2V, reducing power consumption.
Applications
- Industrial Control Systems: Suitable for control and monitoring in industrial environments due to its reliability and programmability.
- Communication Systems: Used in communication equipment for its high-speed I/O capabilities and integrated PCIe blocks.
- Medical Devices: Can be used in medical devices requiring precise digital logic and low power consumption.
- Aerospace and Defense: Employed in various aerospace and defense applications due to its robustness and compliance with industry standards.
Q & A
- What is the technology used in the 10M04DCF256I7G FPGA?
The 10M04DCF256I7G is fabricated using 55nm technology.
- What is the core voltage of the 10M04DCF256I7G?
The core voltage is 1.2V.
- What type of package does the 10M04DCF256I7G use?
The device is packaged in a 256-pin Fine-Pitch Ball Grid Array (FBGA).
- Is the 10M04DCF256I7G RoHS compliant?
Yes, it is compliant with EU RoHS standards (2011/65/EU, 2015/863).
- What are the operating temperature ranges for the 10M04DCF256I7G?
The operating temperature range is from -40°C to 100°C.
- Does the 10M04DCF256I7G support in-system programmability?
Yes, it supports in-system programmability.
- What types of I/O standards does the 10M04DCF256I7G support?
The device supports high-speed LVDS and single-ended I/O standards.
- What is the maximum internal frequency of the 10M04DCF256I7G?
The maximum internal frequency varies by configuration.
- Does the 10M04DCF256I7G have embedded memory?
Yes, it includes distributed RAM and block RAM.
- What are some common applications of the 10M04DCF256I7G?
Common applications include industrial control systems, communication systems, medical devices, and aerospace and defense.